GB8710213D0 - Substrates - Google Patents

Substrates

Info

Publication number
GB8710213D0
GB8710213D0 GB878710213A GB8710213A GB8710213D0 GB 8710213 D0 GB8710213 D0 GB 8710213D0 GB 878710213 A GB878710213 A GB 878710213A GB 8710213 A GB8710213 A GB 8710213A GB 8710213 D0 GB8710213 D0 GB 8710213D0
Authority
GB
United Kingdom
Prior art keywords
substrates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB878710213A
Other versions
GB2204184A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BRACEY S
Original Assignee
BRACEY S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BRACEY S filed Critical BRACEY S
Priority to GB08710213A priority Critical patent/GB2204184A/en
Publication of GB8710213D0 publication Critical patent/GB8710213D0/en
Publication of GB2204184A publication Critical patent/GB2204184A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
GB08710213A 1987-04-29 1987-04-29 Mounting electronic components on substrates Withdrawn GB2204184A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB08710213A GB2204184A (en) 1987-04-29 1987-04-29 Mounting electronic components on substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08710213A GB2204184A (en) 1987-04-29 1987-04-29 Mounting electronic components on substrates

Publications (2)

Publication Number Publication Date
GB8710213D0 true GB8710213D0 (en) 1987-06-03
GB2204184A GB2204184A (en) 1988-11-02

Family

ID=10616598

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08710213A Withdrawn GB2204184A (en) 1987-04-29 1987-04-29 Mounting electronic components on substrates

Country Status (1)

Country Link
GB (1) GB2204184A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2071662A1 (en) * 1991-06-26 1992-12-27 Jon J. Gulick Integrated socket-type package for flip-chip semiconductor devices and circuits
US5412538A (en) * 1993-07-19 1995-05-02 Cordata, Inc. Space-saving memory module
GB9401634D0 (en) * 1994-01-28 1994-03-23 City Tech Monitor
GB2307598B (en) * 1995-11-24 2000-02-23 Varintelligent Combined printed circuit board and integrated circuit driver
EP0797379B1 (en) * 1996-03-18 2002-09-18 KRONE GmbH Circuit board and process for mounting and soldering of electronic components in accurate positions on the surface of the circuit board
RU2133523C1 (en) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Three-dimensional electron module
RU2190284C2 (en) * 1998-07-07 2002-09-27 Закрытое акционерное общество "Техно-ТМ" Two-sided electronic device
JP3093800U (en) * 2002-11-01 2003-05-16 アルプス電気株式会社 Electronic unit
FI119583B (en) 2003-02-26 2008-12-31 Imbera Electronics Oy Procedure for manufacturing an electronics module
FI20030293A (en) * 2003-02-26 2004-08-27 Imbera Electronics Oy Method for manufacturing an electronic module and an electronic module

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1156457B (en) * 1961-07-08 1963-10-31 Telefunken Patent Process for the production of an integrated circuit arrangement
US3459999A (en) * 1967-07-03 1969-08-05 Trw Inc Circuit module and assembly
US3500428A (en) * 1967-08-30 1970-03-10 Gen Electric Microwave hybrid microelectronic circuit module
GB1221914A (en) * 1969-06-13 1971-02-10 Standard Telephones Cables Ltd Manufacture of integrated circuits
GB1240789A (en) * 1969-12-18 1971-07-28 Standard Telephones Cables Ltd Improvements in or relating to electrical equipment
JPS5636140Y2 (en) * 1977-08-19 1981-08-25
FR2402995A1 (en) * 1977-09-12 1979-04-06 Thomson Csf MICRO-CIRCUIT INTERCONNECTION DEVICE

Also Published As

Publication number Publication date
GB2204184A (en) 1988-11-02

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)