CN103540972A - High-hardness electroplating liquid - Google Patents
High-hardness electroplating liquid Download PDFInfo
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- CN103540972A CN103540972A CN201310517243.8A CN201310517243A CN103540972A CN 103540972 A CN103540972 A CN 103540972A CN 201310517243 A CN201310517243 A CN 201310517243A CN 103540972 A CN103540972 A CN 103540972A
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- high rigidity
- electroplate liquid
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- hardness
- salt
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Abstract
The invention discloses a high-hardness electroplating liquid, which is composed of a degreasing fluid, an etchant and a preplating liquid, wherein the degreasing fluid is a metal salt; the etchant is sodium ethylsulfate; the preplating liquid is cystine; the metal salt accounts for 90%-92% of the total weight of the high-hardness electroplating liquid; the sodium ethylsulfate accounts for 4%-6% of the total weight of the high-hardness electroplating liquid; and the cystine accounts for 3%-7% of the total weight of the high-hardness electroplating liquid. The high-hardness electroplating liquid provided by the invention has the advantages of high hardness, good dispersing performance and high covering power.
Description
Technical field
The present invention relates to a kind of electroplate liquid, relate in particular to a kind of electroplate liquid of high rigidity.
Background technology
In mechanical processing process, the antirust grease that component surface adheres to, cutting fluid, machinery oil, lubricating grease, grinding fluid, releasing agent etc. mix and stick together with dust, polishing dust, form thicker dirt.If, not by above soil release, after its quenching sinters obstinate solid grease into, degreasing and rust removal is difficult to clean up before thermal treatment, during plating, bubble adheres to and on it, makes coating form gas hold-up type pin hole.Heat treated part surface inevitably can adhere to one deck greasy dirt, when dust falls from the teeth outwards, and sticks together with grease is mixed, of long duration is difficult to clean up, thereby makes workpiece surface form unconspicuous tiny oil mark, and during plating, bubble is detained formation pin hole it on.While adopting in addition mesh band type resistor furnace to quench; the impurity particles such as the greasy dirt of workpiece surface and dust are mixed to stick together; sinter obstinate solid grease into; during salt made from earth containing a comparatively high percentage of sodium chloride tempering; above grease again with the thermopolymer of nitro salt formation stubbornness; during plating, be difficult to the thorough Ex-all of above dirt; bubble hydrogen easily sticks to above dirt; be difficult to discharge; thereby make coating produce pin hole and pit phenomenon, and along with bubble is grown up gradually, coating can burst automatically; produce decortication phenomenon, thereby cause the poor shortcoming of electroplate liquid difference of hardness, dispersing property and covering power.
Summary of the invention
The invention provides a kind of electroplate liquid with the high rigidity of the advantage that high rigidity, dispersing property and covering power are good.
Technical scheme of the present invention is: a kind of electroplate liquid of high rigidity, the electroplate liquid of described high rigidity comprises that degreasing fluid, etching solution and pre-plating solution combine, described degreasing fluid is metal-salt, described etching solution is base sodium ethyl sulfate, described pre-plating solution is Gelucystine, described metal-salt accounts for the 90%-92% of the overall component of electroplate liquid of high rigidity, and described base sodium ethyl sulfate accounts for the 4%-6% of the overall component of electroplate liquid of high rigidity, and described Gelucystine accounts for the 3%-7% of the overall component of electroplate liquid of high rigidity.
In a preferred embodiment of the present invention, described metal-salt comprises plumbic acetate, mercury chloride, copper sulfate or Silver Nitrate.
In a preferred embodiment of the present invention, described metal-salt account for high rigidity the overall component of electroplate liquid 91%, described base sodium ethyl sulfate account for high rigidity the overall component of electroplate liquid 4%, described Gelucystine account for high rigidity the overall component of electroplate liquid 5%.
The electroplate liquid of a kind of high rigidity of the present invention, has advantages of that high rigidity, dispersing property and covering power are good.
Embodiment
Below preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
Wherein, the electroplate liquid of described high rigidity comprises that degreasing fluid, etching solution and pre-plating solution combine, described degreasing fluid is metal-salt, described etching solution is base sodium ethyl sulfate, described pre-plating solution is Gelucystine, described metal-salt accounts for the 90%-92% of the overall component of electroplate liquid of high rigidity, described base sodium ethyl sulfate accounts for the 4%-6% of the overall component of electroplate liquid of high rigidity, described Gelucystine accounts for the 3%-7% of the overall component of electroplate liquid of high rigidity, and described metal-salt comprises plumbic acetate, mercury chloride, copper sulfate or Silver Nitrate.
Further illustrate, described metal-salt account for high rigidity the overall component of electroplate liquid 91%, described base sodium ethyl sulfate account for high rigidity the overall component of electroplate liquid 4%, described Gelucystine account for high rigidity the overall component of electroplate liquid 5%.Heavy metal salt as plumbic acetate, mercury chloride, copper sulfate, Silver Nitrate etc. be all the precipitation agent of protein.Protein is the important substance that forms human body cell, if people has absorbed heavy metal salt, the protein in body will generate throw out---protein salt, people also will be poisoning because of protein denaturation.If generation heavy metal poisoning, can take egg white, milk, the contour proteic substance of soya-bean milk in time, to reduce the effect of heavy metallic salt to human body protein, and see the doctor for treatment immediately.
Further illustrating, the internal stress of coating can fall in described base sodium ethyl sulfate, improves the toughness of coating.
Further illustrating, Gelucystine is amino acid drug, can promote cellular oxidation restoring function, makes liver function vigorous, and can neutralize a toxin, promote leucocyte hyperplasia, prevention pathogenic bacteria to grow; VITMAIN B1 forms TPP (thiamine diphosphate, diphosphothiamine), necessary coenzyme while being carbohydrate metabolism in conjunction with Triphosaden; VITMAIN B1 can suppress the activity of Pseudocholinesterase, and during shortage, cholinesterase activity strengthens, and acetylcholine hydrolyzation accelerates, and causes nerve impulse conductive impairment, affects stomach and intestine, myocardial function; Calcium pantothenate is the precursor of coenzyme A, is the essential material of multiple metabolism link (comprising carbohydrate, protein and lipid), can participate in the synthetic of the materials such as steroid, porphyrin, vagusstoff, and can maintain normal epithelium function.The invention provides a kind of electroplate liquid of high rigidity, have advantages of that high rigidity, dispersing property and covering power are good.
The specific embodiment of the present invention; but protection scope of the present invention is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the present invention, and the variation that can expect without creative work or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (3)
1. the electroplate liquid of a high rigidity, it is characterized in that: the electroplate liquid of described high rigidity comprises that degreasing fluid, etching solution and pre-plating solution combine, described degreasing fluid is metal-salt, described etching solution is base sodium ethyl sulfate, described pre-plating solution is Gelucystine, described metal-salt accounts for the 90%-92% of the overall component of electroplate liquid of high rigidity, and described base sodium ethyl sulfate accounts for the 4%-6% of the overall component of electroplate liquid of high rigidity, and described Gelucystine accounts for the 3%-7% of the overall component of electroplate liquid of high rigidity.
2. the electroplate liquid of high rigidity according to claim 1, is characterized in that: described metal-salt comprises plumbic acetate, mercury chloride, copper sulfate or Silver Nitrate.
3. the electroplate liquid of high rigidity according to claim 1, it is characterized in that: described metal-salt account for high rigidity the overall component of electroplate liquid 91%, described base sodium ethyl sulfate account for high rigidity the overall component of electroplate liquid 4%, described Gelucystine account for high rigidity the overall component of electroplate liquid 5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310517243.8A CN103540972A (en) | 2013-10-29 | 2013-10-29 | High-hardness electroplating liquid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310517243.8A CN103540972A (en) | 2013-10-29 | 2013-10-29 | High-hardness electroplating liquid |
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| Publication Number | Publication Date |
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| CN103540972A true CN103540972A (en) | 2014-01-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310517243.8A Pending CN103540972A (en) | 2013-10-29 | 2013-10-29 | High-hardness electroplating liquid |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105483724A (en) * | 2015-11-25 | 2016-04-13 | 安徽天思朴超精密模具股份有限公司 | Metal degreasant material combination as well as preparing method and application of metal degreasant |
| CN107099786A (en) * | 2017-05-08 | 2017-08-29 | 安徽长青电子机械（集团）有限公司 | One kind plating liquid and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1436645A (en) * | 1973-07-24 | 1976-05-19 | Kollmorgen Corp | Immersion tin bath composition and process for using same |
| JPS5923895A (en) * | 1982-07-28 | 1984-02-07 | Citizen Watch Co Ltd | Method for plating decorative parts to provide black color tone |
| JPH01222064A (en) * | 1988-03-02 | 1989-09-05 | Hitachi Ltd | Chemical nickel plating solution and method for using same |
| CN101024878A (en) * | 2006-12-22 | 2007-08-29 | 陈先义 | Environment-protection brightening type chemical nickel-plating additive |
| CN101054699A (en) * | 2007-02-12 | 2007-10-17 | 伟业重工(安徽)有限公司 | Plating technique for substituting chemical oxidation of copper and copper alloy |
| CN103258723A (en) * | 2012-02-07 | 2013-08-21 | 罗门哈斯电子材料有限公司 | Activation process to improve metal adhesion |
-
2013
- 2013-10-29 CN CN201310517243.8A patent/CN103540972A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1436645A (en) * | 1973-07-24 | 1976-05-19 | Kollmorgen Corp | Immersion tin bath composition and process for using same |
| JPS5923895A (en) * | 1982-07-28 | 1984-02-07 | Citizen Watch Co Ltd | Method for plating decorative parts to provide black color tone |
| JPH01222064A (en) * | 1988-03-02 | 1989-09-05 | Hitachi Ltd | Chemical nickel plating solution and method for using same |
| CN101024878A (en) * | 2006-12-22 | 2007-08-29 | 陈先义 | Environment-protection brightening type chemical nickel-plating additive |
| CN101054699A (en) * | 2007-02-12 | 2007-10-17 | 伟业重工(安徽)有限公司 | Plating technique for substituting chemical oxidation of copper and copper alloy |
| CN103258723A (en) * | 2012-02-07 | 2013-08-21 | 罗门哈斯电子材料有限公司 | Activation process to improve metal adhesion |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105483724A (en) * | 2015-11-25 | 2016-04-13 | 安徽天思朴超精密模具股份有限公司 | Metal degreasant material combination as well as preparing method and application of metal degreasant |
| CN107099786A (en) * | 2017-05-08 | 2017-08-29 | 安徽长青电子机械（集团）有限公司 | One kind plating liquid and preparation method thereof |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140129 |