CN103540962A - Heat-resistant electroplating solution - Google Patents
Heat-resistant electroplating solution Download PDFInfo
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- CN103540962A CN103540962A CN201310517035.8A CN201310517035A CN103540962A CN 103540962 A CN103540962 A CN 103540962A CN 201310517035 A CN201310517035 A CN 201310517035A CN 103540962 A CN103540962 A CN 103540962A
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- electroplate liquid
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- electroplating solution
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Abstract
The invention discloses a heat-resistant electroplating solution. The heat-resistant electroplating solution is formed by combining a complexing agent, a stabilizing agent and a modifying agent, wherein the complexing agent is sodium potassium tartrate tetrahydrate, the stabilizing agent is sulpho-hydantoin, the modifying agent is sodium n-octyl sulphate, sodium potassium tartrate tetrahydrate accounts for 71-78% of the total weight of the heat-resistant electroplating solution, sulpho-hydantoin accounts for 10-15% of the total weight of the heat-resistant electroplating solution, and sodium n-octyl sulphate accounts for 9-16% of the total weight of the heat-resistant electroplating solution. The heat-resistant electroplating solution has the advantages of heat resistance, no corrosiveness and low preparation cost.
Description
Technical field
The present invention relates to a kind of electroplate liquid, relate in particular to a kind of stable on heating electroplate liquid.
Background technology
In mechanical processing process, the antirust grease that component surface adheres to, cutting fluid, machinery oil, lubricating grease, grinding fluid, releasing agent etc. mix and stick together with dust, polishing dust, form thicker dirt.If, not by above soil release, after its quenching sinters obstinate solid grease into, degreasing and rust removal is difficult to clean up before thermal treatment, during plating, bubble adheres to and on it, makes coating form gas hold-up type pin hole.Heat treated part surface inevitably can adhere to one deck greasy dirt, when dust falls from the teeth outwards, and sticks together with grease is mixed, of long duration is difficult to clean up, thereby makes workpiece surface form unconspicuous tiny oil mark, and during plating, bubble is detained formation pin hole it on.While adopting in addition mesh band type resistor furnace to quench; the impurity particles such as the greasy dirt of workpiece surface and dust are mixed to stick together; sinter obstinate solid grease into; during salt made from earth containing a comparatively high percentage of sodium chloride tempering; above grease again with the thermopolymer of nitro salt formation stubbornness; during plating, be difficult to the thorough Ex-all of above dirt; bubble hydrogen easily sticks to above dirt; be difficult to discharge; thereby make coating produce pin hole and pit phenomenon, and along with bubble is grown up gradually, coating can burst automatically; produce decortication phenomenon, thereby cause that electroplate liquid resistance toheat is poor, seriously corroded and the high shortcoming of deployment cost.
Summary of the invention
The invention provides a kind of stable on heating electroplate liquid with the advantage that thermotolerance, non-corrosiveness and deployment cost are low.
Technical scheme of the present invention is: a kind of stable on heating electroplate liquid, described stable on heating electroplate liquid comprises that complexing agent, stablizer and modifying agent combine, described complexing agent is Seignette salt, described stablizer is thio-hydantoin, described modifying agent is n-octyl sodium sulfate, described Seignette salt accounts for the 71%-78% of the overall component of stable on heating electroplate liquid, described thio-hydantoin accounts for the 10%-15% of the overall component of stable on heating electroplate liquid, and described n-octyl sodium sulfate accounts for the 9%-16% of the overall component of stable on heating electroplate liquid.
In a preferred embodiment of the present invention, described Seignette salt comprises potassium, sodium, calcium, iron, copper and lead.
In a preferred embodiment of the present invention, described Seignette salt accounts for 76% of the overall component of stable on heating electroplate liquid, described thio-hydantoin accounts for 11% of the overall component of stable on heating electroplate liquid, and described n-octyl sodium sulfate accounts for 13% of the overall component of stable on heating electroplate liquid.
A kind of stable on heating electroplate liquid of the present invention, has advantages of that thermotolerance, non-corrosiveness and deployment cost are low.
Embodiment
Below preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
Wherein, described stable on heating electroplate liquid comprises that complexing agent, stablizer and modifying agent combine, described complexing agent is Seignette salt, described stablizer is thio-hydantoin, described modifying agent is n-octyl sodium sulfate, described Seignette salt accounts for the 71%-78% of the overall component of stable on heating electroplate liquid, described thio-hydantoin accounts for the 10%-15% of the overall component of stable on heating electroplate liquid, described n-octyl sodium sulfate accounts for the 9%-16% of the overall component of stable on heating electroplate liquid, and described Seignette salt comprises potassium, sodium, calcium, iron, copper and lead.
Further illustrate, described Seignette salt accounts for 76% of the overall component of stable on heating electroplate liquid, and described thio-hydantoin accounts for 11% of the overall component of stable on heating electroplate liquid, and described n-octyl sodium sulfate accounts for 13% of the overall component of stable on heating electroplate liquid.Seignette salt is white particulate xln.Density 1.783g/cm3.100 ℃ of fusing points.In warm air, have weathering, 60 ℃ lose partial crystallization water, and 215 ℃ lose whole crystal water.During 30 ℃ of solubleness in water, l00ml is that 117.62g is insoluble to alcohol.There is complexing.
Further illustrating, described thio-hydantoin is that effect is absorption or shelters the catalytic particulate in plating solution, prevents that plating solution from decomposing voluntarily.
Further illustrating, the effect of n-octyl sodium sulfate is to improve Deposit appearance, prevents pin hole.The invention provides a kind of stable on heating electroplate liquid, have advantages of that thermotolerance, non-corrosiveness and deployment cost are low.
The specific embodiment of the present invention; but protection scope of the present invention is not limited to this; any those of ordinary skill in the art are in the disclosed technical scope of the present invention, and the variation that can expect without creative work or replacement, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection domain that claims were limited.
Claims (3)
1. a stable on heating electroplate liquid, it is characterized in that: described stable on heating electroplate liquid comprises that complexing agent, stablizer and modifying agent combine, described complexing agent is Seignette salt, described stablizer is thio-hydantoin, described modifying agent is n-octyl sodium sulfate, described Seignette salt accounts for the 71%-78% of the overall component of stable on heating electroplate liquid, described thio-hydantoin accounts for the 10%-15% of the overall component of stable on heating electroplate liquid, and described n-octyl sodium sulfate accounts for the 9%-16% of the overall component of stable on heating electroplate liquid.
2. stable on heating electroplate liquid according to claim 1, is characterized in that: described Seignette salt comprises potassium, sodium, calcium, iron, copper and lead.
3. stable on heating electroplate liquid according to claim 1, it is characterized in that: described Seignette salt accounts for 76% of the overall component of stable on heating electroplate liquid, described thio-hydantoin accounts for 11% of the overall component of stable on heating electroplate liquid, and described n-octyl sodium sulfate accounts for 13% of the overall component of stable on heating electroplate liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310517035.8A CN103540962A (en) | 2013-10-29 | 2013-10-29 | Heat-resistant electroplating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310517035.8A CN103540962A (en) | 2013-10-29 | 2013-10-29 | Heat-resistant electroplating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103540962A true CN103540962A (en) | 2014-01-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310517035.8A Pending CN103540962A (en) | 2013-10-29 | 2013-10-29 | Heat-resistant electroplating solution |
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| CN (1) | CN103540962A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104894619A (en) * | 2015-06-19 | 2015-09-09 | 梁胜光 | Heat-resistant electroplating solution |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101942683A (en) * | 2010-09-19 | 2011-01-12 | 西南科技大学 | Method for preparing bismuth film by pulse plating process |
| CN103088375A (en) * | 2012-12-13 | 2013-05-08 | 苏州新区化工节能设备厂 | Water electrolysis pole plate nickel-plating additive |
| CN103243356A (en) * | 2012-10-11 | 2013-08-14 | 湖南理工学院 | Preparation method of iron-nickel-cobalt-molybdenum alloy foil by electrodeposition |
-
2013
- 2013-10-29 CN CN201310517035.8A patent/CN103540962A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101942683A (en) * | 2010-09-19 | 2011-01-12 | 西南科技大学 | Method for preparing bismuth film by pulse plating process |
| CN103243356A (en) * | 2012-10-11 | 2013-08-14 | 湖南理工学院 | Preparation method of iron-nickel-cobalt-molybdenum alloy foil by electrodeposition |
| CN103088375A (en) * | 2012-12-13 | 2013-05-08 | 苏州新区化工节能设备厂 | Water electrolysis pole plate nickel-plating additive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104894619A (en) * | 2015-06-19 | 2015-09-09 | 梁胜光 | Heat-resistant electroplating solution |
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Application publication date: 20140129 |