AT326970B - ELECTRIC WATER COPPER BATH - Google Patents

ELECTRIC WATER COPPER BATH

Info

Publication number
AT326970B
AT326970B AT266674A AT266674A AT326970B AT 326970 B AT326970 B AT 326970B AT 266674 A AT266674 A AT 266674A AT 266674 A AT266674 A AT 266674A AT 326970 B AT326970 B AT 326970B
Authority
AT
Austria
Prior art keywords
electric water
copper bath
water copper
bath
electric
Prior art date
Application number
AT266674A
Other languages
German (de)
Other versions
ATA266674A (en
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of ATA266674A publication Critical patent/ATA266674A/en
Application granted granted Critical
Publication of AT326970B publication Critical patent/AT326970B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AT266674A 1973-04-04 1974-04-01 ELECTRIC WATER COPPER BATH AT326970B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304650A NL7304650A (en) 1973-04-04 1973-04-04

Publications (2)

Publication Number Publication Date
ATA266674A ATA266674A (en) 1975-03-15
AT326970B true AT326970B (en) 1976-01-12

Family

ID=19818567

Family Applications (1)

Application Number Title Priority Date Filing Date
AT266674A AT326970B (en) 1973-04-04 1974-04-01 ELECTRIC WATER COPPER BATH

Country Status (11)

Country Link
JP (1) JPS5334102B2 (en)
AT (1) AT326970B (en)
BE (1) BE813195A (en)
CA (1) CA1021103A (en)
CH (1) CH606473A5 (en)
DE (1) DE2414650C3 (en)
FR (1) FR2224555B1 (en)
GB (1) GB1425298A (en)
IT (1) IT1010903B (en)
NL (1) NL7304650A (en)
SE (1) SE392737B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7402423A (en) * 1974-02-22 1975-08-26 Philips Nv UNIVERSAL SALES SOLUTION.
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
DE10214859B4 (en) 2002-04-04 2004-04-08 Chemetall Gmbh Process for coppering or bronzing an object and liquid mixtures therefor
JP6030848B2 (en) * 2012-05-07 2016-11-24 上村工業株式会社 Electroless copper plating bath and electroless copper plating method

Also Published As

Publication number Publication date
CA1021103A (en) 1977-11-22
JPS5334102B2 (en) 1978-09-19
FR2224555B1 (en) 1976-12-17
BE813195A (en) 1974-10-02
FR2224555A1 (en) 1974-10-31
SE392737B (en) 1977-04-18
GB1425298A (en) 1976-02-18
DE2414650C3 (en) 1978-11-16
JPS49129638A (en) 1974-12-12
IT1010903B (en) 1977-01-20
CH606473A5 (en) 1978-10-31
NL7304650A (en) 1974-10-08
DE2414650B2 (en) 1978-03-16
ATA266674A (en) 1975-03-15
DE2414650A1 (en) 1974-10-17

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Legal Events

Date Code Title Description
EIH Change in the person of patent owner
ELJ Ceased due to non-payment of the annual fee
ELJ Ceased due to non-payment of the annual fee