JPS5334102B2 - - Google Patents

Info

Publication number
JPS5334102B2
JPS5334102B2 JP3744174A JP3744174A JPS5334102B2 JP S5334102 B2 JPS5334102 B2 JP S5334102B2 JP 3744174 A JP3744174 A JP 3744174A JP 3744174 A JP3744174 A JP 3744174A JP S5334102 B2 JPS5334102 B2 JP S5334102B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3744174A
Other languages
Japanese (ja)
Other versions
JPS49129638A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS49129638A publication Critical patent/JPS49129638A/ja
Publication of JPS5334102B2 publication Critical patent/JPS5334102B2/ja
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP3744174A 1973-04-04 1974-04-04 Expired JPS5334102B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304650A NL7304650A (en) 1973-04-04 1973-04-04

Publications (2)

Publication Number Publication Date
JPS49129638A JPS49129638A (en) 1974-12-12
JPS5334102B2 true JPS5334102B2 (en) 1978-09-19

Family

ID=19818567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3744174A Expired JPS5334102B2 (en) 1973-04-04 1974-04-04

Country Status (11)

Country Link
JP (1) JPS5334102B2 (en)
AT (1) AT326970B (en)
BE (1) BE813195A (en)
CA (1) CA1021103A (en)
CH (1) CH606473A5 (en)
DE (1) DE2414650C3 (en)
FR (1) FR2224555B1 (en)
GB (1) GB1425298A (en)
IT (1) IT1010903B (en)
NL (1) NL7304650A (en)
SE (1) SE392737B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7402423A (en) * 1974-02-22 1975-08-26 Philips Nv UNIVERSAL SALES SOLUTION.
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
DE10214859B4 (en) 2002-04-04 2004-04-08 Chemetall Gmbh Process for coppering or bronzing an object and liquid mixtures therefor
JP6030848B2 (en) * 2012-05-07 2016-11-24 上村工業株式会社 Electroless copper plating bath and electroless copper plating method

Also Published As

Publication number Publication date
CA1021103A (en) 1977-11-22
FR2224555B1 (en) 1976-12-17
BE813195A (en) 1974-10-02
AT326970B (en) 1976-01-12
FR2224555A1 (en) 1974-10-31
SE392737B (en) 1977-04-18
GB1425298A (en) 1976-02-18
DE2414650C3 (en) 1978-11-16
JPS49129638A (en) 1974-12-12
IT1010903B (en) 1977-01-20
CH606473A5 (en) 1978-10-31
NL7304650A (en) 1974-10-08
DE2414650B2 (en) 1978-03-16
ATA266674A (en) 1975-03-15
DE2414650A1 (en) 1974-10-17

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