CA1021103A - Electroless aqueous copper-plating bath - Google Patents

Electroless aqueous copper-plating bath

Info

Publication number
CA1021103A
CA1021103A CA196,764A CA196764A CA1021103A CA 1021103 A CA1021103 A CA 1021103A CA 196764 A CA196764 A CA 196764A CA 1021103 A CA1021103 A CA 1021103A
Authority
CA
Canada
Prior art keywords
plating bath
aqueous copper
electroless aqueous
electroless
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA196,764A
Other languages
French (fr)
Inventor
Jan Boven
Arian Molenaar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of CA1021103A publication Critical patent/CA1021103A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CA196,764A 1973-04-04 1974-04-03 Electroless aqueous copper-plating bath Expired CA1021103A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304650A NL7304650A (en) 1973-04-04 1973-04-04

Publications (1)

Publication Number Publication Date
CA1021103A true CA1021103A (en) 1977-11-22

Family

ID=19818567

Family Applications (1)

Application Number Title Priority Date Filing Date
CA196,764A Expired CA1021103A (en) 1973-04-04 1974-04-03 Electroless aqueous copper-plating bath

Country Status (11)

Country Link
JP (1) JPS5334102B2 (en)
AT (1) AT326970B (en)
BE (1) BE813195A (en)
CA (1) CA1021103A (en)
CH (1) CH606473A5 (en)
DE (1) DE2414650C3 (en)
FR (1) FR2224555B1 (en)
GB (1) GB1425298A (en)
IT (1) IT1010903B (en)
NL (1) NL7304650A (en)
SE (1) SE392737B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7402423A (en) * 1974-02-22 1975-08-26 Philips Nv UNIVERSAL SALES SOLUTION.
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
DE10214859B4 (en) 2002-04-04 2004-04-08 Chemetall Gmbh Process for coppering or bronzing an object and liquid mixtures therefor
JP6030848B2 (en) * 2012-05-07 2016-11-24 上村工業株式会社 Electroless copper plating bath and electroless copper plating method

Also Published As

Publication number Publication date
FR2224555B1 (en) 1976-12-17
BE813195A (en) 1974-10-02
GB1425298A (en) 1976-02-18
SE392737B (en) 1977-04-18
JPS5334102B2 (en) 1978-09-19
FR2224555A1 (en) 1974-10-31
DE2414650C3 (en) 1978-11-16
ATA266674A (en) 1975-03-15
JPS49129638A (en) 1974-12-12
AT326970B (en) 1976-01-12
NL7304650A (en) 1974-10-08
IT1010903B (en) 1977-01-20
DE2414650A1 (en) 1974-10-17
CH606473A5 (en) 1978-10-31
DE2414650B2 (en) 1978-03-16

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