NL7304650A - - Google Patents
Info
- Publication number
- NL7304650A NL7304650A NL7304650A NL7304650A NL7304650A NL 7304650 A NL7304650 A NL 7304650A NL 7304650 A NL7304650 A NL 7304650A NL 7304650 A NL7304650 A NL 7304650A NL 7304650 A NL7304650 A NL 7304650A
- Authority
- NL
- Netherlands
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Priority Applications (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7304650A NL7304650A (en) | 1973-04-04 | 1973-04-04 | |
| DE19742414650 DE2414650C3 (en) | 1973-04-04 | 1974-03-27 | Electrically working aqueous copper plating bath |
| CH451274A CH606473A5 (en) | 1973-04-04 | 1974-04-01 | |
| AT266674A AT326970B (en) | 1973-04-04 | 1974-04-01 | ELECTRIC WATER COPPER BATH |
| SE7404432A SE392737B (en) | 1973-04-04 | 1974-04-02 | AQUATIC ALKALINE COPPER BATH FOR STROMLESS PRE-COUPLING, WHICH INCLUDES A COMPLEX BUILDING AGENT FOR COPPER (II) IONS INCLUDING ATMINSTONE AN ORGANIC ASSOCIATION, WHICH ... |
| BE142758A BE813195A (en) | 1973-04-04 | 1974-04-02 | AQUEOUS COPPER BATH WITHOUT CURRENT |
| FR7411799A FR2224555B1 (en) | 1973-04-04 | 1974-04-03 | |
| GB1480474A GB1425298A (en) | 1973-04-04 | 1974-04-03 | Electroless deposition of copper |
| CA196,764A CA1021103A (en) | 1973-04-04 | 1974-04-03 | Electroless aqueous copper-plating bath |
| IT4263674A IT1010903B (en) | 1973-04-04 | 1974-04-03 | WATERPROOF BATHROOM WITH NO CURRENT PASSAGE |
| JP3744174A JPS5334102B2 (en) | 1973-04-04 | 1974-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7304650A NL7304650A (en) | 1973-04-04 | 1973-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NL7304650A true NL7304650A (en) | 1974-10-08 |
Family
ID=19818567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NL7304650A NL7304650A (en) | 1973-04-04 | 1973-04-04 |
Country Status (11)
| Country | Link |
|---|---|
| JP (1) | JPS5334102B2 (en) |
| AT (1) | AT326970B (en) |
| BE (1) | BE813195A (en) |
| CA (1) | CA1021103A (en) |
| CH (1) | CH606473A5 (en) |
| DE (1) | DE2414650C3 (en) |
| FR (1) | FR2224555B1 (en) |
| GB (1) | GB1425298A (en) |
| IT (1) | IT1010903B (en) |
| NL (1) | NL7304650A (en) |
| SE (1) | SE392737B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL7402423A (en) * | 1974-02-22 | 1975-08-26 | Philips Nv | UNIVERSAL SALES SOLUTION. |
| US4209331A (en) * | 1978-05-25 | 1980-06-24 | Macdermid Incorporated | Electroless copper composition solution using a hypophosphite reducing agent |
| CA1144304A (en) * | 1978-10-23 | 1983-04-12 | Glenn O. Mallory, Jr. | Electroless deposition of copper |
| GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
| DE10214859B4 (en) * | 2002-04-04 | 2004-04-08 | Chemetall Gmbh | Process for coppering or bronzing an object and liquid mixtures therefor |
| JP6030848B2 (en) * | 2012-05-07 | 2016-11-24 | 上村工業株式会社 | Electroless copper plating bath and electroless copper plating method |
-
1973
- 1973-04-04 NL NL7304650A patent/NL7304650A/xx not_active Application Discontinuation
-
1974
- 1974-03-27 DE DE19742414650 patent/DE2414650C3/en not_active Expired
- 1974-04-01 AT AT266674A patent/AT326970B/en not_active IP Right Cessation
- 1974-04-01 CH CH451274A patent/CH606473A5/xx not_active IP Right Cessation
- 1974-04-02 SE SE7404432A patent/SE392737B/en not_active IP Right Cessation
- 1974-04-02 BE BE142758A patent/BE813195A/en not_active IP Right Cessation
- 1974-04-03 IT IT4263674A patent/IT1010903B/en active
- 1974-04-03 CA CA196,764A patent/CA1021103A/en not_active Expired
- 1974-04-03 FR FR7411799A patent/FR2224555B1/fr not_active Expired
- 1974-04-03 GB GB1480474A patent/GB1425298A/en not_active Expired
- 1974-04-04 JP JP3744174A patent/JPS5334102B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2224555A1 (en) | 1974-10-31 |
| SE392737B (en) | 1977-04-18 |
| BE813195A (en) | 1974-10-02 |
| FR2224555B1 (en) | 1976-12-17 |
| ATA266674A (en) | 1975-03-15 |
| CA1021103A (en) | 1977-11-22 |
| JPS49129638A (en) | 1974-12-12 |
| DE2414650C3 (en) | 1978-11-16 |
| CH606473A5 (en) | 1978-10-31 |
| DE2414650B2 (en) | 1978-03-16 |
| AT326970B (en) | 1976-01-12 |
| DE2414650A1 (en) | 1974-10-17 |
| IT1010903B (en) | 1977-01-20 |
| GB1425298A (en) | 1976-02-18 |
| JPS5334102B2 (en) | 1978-09-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| BC | A request for examination has been filed | ||
| BI | The patent application has been withdrawn |