CH606473A5 - - Google Patents

Info

Publication number
CH606473A5
CH606473A5 CH451274A CH451274A CH606473A5 CH 606473 A5 CH606473 A5 CH 606473A5 CH 451274 A CH451274 A CH 451274A CH 451274 A CH451274 A CH 451274A CH 606473 A5 CH606473 A5 CH 606473A5
Authority
CH
Switzerland
Application number
CH451274A
Inventor
Arian Molenaar
Jan Boven
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH606473A5 publication Critical patent/CH606473A5/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
CH451274A 1973-04-04 1974-04-01 CH606473A5 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7304650A NL7304650A (en) 1973-04-04 1973-04-04

Publications (1)

Publication Number Publication Date
CH606473A5 true CH606473A5 (en) 1978-10-31

Family

ID=19818567

Family Applications (1)

Application Number Title Priority Date Filing Date
CH451274A CH606473A5 (en) 1973-04-04 1974-04-01

Country Status (11)

Country Link
JP (1) JPS5334102B2 (en)
AT (1) AT326970B (en)
BE (1) BE813195A (en)
CA (1) CA1021103A (en)
CH (1) CH606473A5 (en)
DE (1) DE2414650C3 (en)
FR (1) FR2224555B1 (en)
GB (1) GB1425298A (en)
IT (1) IT1010903B (en)
NL (1) NL7304650A (en)
SE (1) SE392737B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7402423A (en) * 1974-02-22 1975-08-26 Philips Nv UNIVERSAL SALES SOLUTION.
US4209331A (en) * 1978-05-25 1980-06-24 Macdermid Incorporated Electroless copper composition solution using a hypophosphite reducing agent
CA1144304A (en) * 1978-10-23 1983-04-12 Glenn O. Mallory, Jr. Electroless deposition of copper
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
DE10214859B4 (en) 2002-04-04 2004-04-08 Chemetall Gmbh Process for coppering or bronzing an object and liquid mixtures therefor
JP6030848B2 (en) * 2012-05-07 2016-11-24 上村工業株式会社 Electroless copper plating bath and electroless copper plating method

Also Published As

Publication number Publication date
CA1021103A (en) 1977-11-22
JPS5334102B2 (en) 1978-09-19
FR2224555B1 (en) 1976-12-17
BE813195A (en) 1974-10-02
AT326970B (en) 1976-01-12
FR2224555A1 (en) 1974-10-31
SE392737B (en) 1977-04-18
GB1425298A (en) 1976-02-18
DE2414650C3 (en) 1978-11-16
JPS49129638A (en) 1974-12-12
IT1010903B (en) 1977-01-20
NL7304650A (en) 1974-10-08
DE2414650B2 (en) 1978-03-16
ATA266674A (en) 1975-03-15
DE2414650A1 (en) 1974-10-17

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Legal Events

Date Code Title Description
PL Patent ceased