GB844358A - Improvements in palladium plating - Google Patents

Improvements in palladium plating

Info

Publication number
GB844358A
GB844358A GB5981/59A GB598159A GB844358A GB 844358 A GB844358 A GB 844358A GB 5981/59 A GB5981/59 A GB 5981/59A GB 598159 A GB598159 A GB 598159A GB 844358 A GB844358 A GB 844358A
Authority
GB
United Kingdom
Prior art keywords
mol
palladium
hydrazine
carbon atoms
per molecule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB5981/59A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mond Nickel Co Ltd
Original Assignee
Mond Nickel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mond Nickel Co Ltd filed Critical Mond Nickel Co Ltd
Publication of GB844358A publication Critical patent/GB844358A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents

Abstract

A chemical palladium plating solution contains 0.001-0.25 mol/l. divalent palladium, 2.5-14 mol/l. ammonia and/or one or more aliphatic compounds having a primary amine group and up to 5 carbon atoms per molecule, 0.002-0.05 mol/l. hydrazine, and a stabilizing agent to inhibit spontaneous decomposition of the solution to form spongy palladium, the balance being water in an amount of at least 2 mol/l. together with incidental ions. The divalent palladium may be introduced as the chloride, chloropalladite or aminochloride, and the hydrazine as the hydrate or sulphate. Examples of primary amines are ethylamine, n-amylamine and aminoethyl ethanolamine. Suitable stabilizing agents are the di-sodium salt of ethylene diamine tetra-acetic acid; aliphatic ketones having 3-5 carbon atoms per molecule, e.g. pentan-3-one, acetone and methyl ethyl ketone; dihydroxy-dialkyl sulphides having up to 5 carbon atoms per molecule, e.g. 2,21-thiodiethanol; and ammonium salts of mono- and di-basic mineral acids, e.g. ammonium chloride, nitrate and sulphate. Coatings may be deposited on substances which catalyze the reduction of divalent palladium by hydrazine, e.g. on Al, Cr, Co, Au, Fe, steel, Mo, Ni, Pd, Pt, Ru, Ag, Sn, W and alloys rich in Ni or Co. Non-catalytic substances (such as glass, ceramic and graphite) may also be coated if they are first provided with a coating of catalytic metal.
GB5981/59A 1958-03-03 1959-02-20 Improvements in palladium plating Expired GB844358A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US844358XA 1958-03-03 1958-03-03

Publications (1)

Publication Number Publication Date
GB844358A true GB844358A (en) 1960-08-10

Family

ID=22184965

Family Applications (1)

Application Number Title Priority Date Filing Date
GB5981/59A Expired GB844358A (en) 1958-03-03 1959-02-20 Improvements in palladium plating

Country Status (1)

Country Link
GB (1) GB844358A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3150065A (en) * 1961-02-27 1964-09-22 Ibm Method for plating palladium
DE1247804B (en) * 1963-03-26 1967-08-17 Int Nickel Ltd Alkaline bath for the chemical deposition of firmly adhering palladium coatings
EP1247574A1 (en) * 2001-04-03 2002-10-09 Mitsubishi Gas Chemical Company, Inc. Process for producing a supported metal catalyst
WO2010065851A2 (en) 2008-12-05 2010-06-10 Omg Americas, Inc. Electroless palladium plating solution and method of use

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3150065A (en) * 1961-02-27 1964-09-22 Ibm Method for plating palladium
DE1247804B (en) * 1963-03-26 1967-08-17 Int Nickel Ltd Alkaline bath for the chemical deposition of firmly adhering palladium coatings
EP1247574A1 (en) * 2001-04-03 2002-10-09 Mitsubishi Gas Chemical Company, Inc. Process for producing a supported metal catalyst
US6806224B2 (en) 2001-04-03 2004-10-19 Mitsubishi Gas Chemical Company, Inc. Process for producing a supported metal catalyst
KR100852309B1 (en) * 2001-04-03 2008-08-14 미츠비시 가스 가가쿠 가부시키가이샤 Process for producing metallic carrier catalyst
WO2010065851A2 (en) 2008-12-05 2010-06-10 Omg Americas, Inc. Electroless palladium plating solution and method of use
EP2373831A2 (en) * 2008-12-05 2011-10-12 OMG Americas, Inc. Electroless palladium plating solution and method of use
EP2373831A4 (en) * 2008-12-05 2013-11-27 Omg Americas Inc Electroless palladium plating solution and method of use

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