GB994560A - Deposition of palladium - Google Patents
Deposition of palladiumInfo
- Publication number
- GB994560A GB994560A GB10064/64A GB1006464A GB994560A GB 994560 A GB994560 A GB 994560A GB 10064/64 A GB10064/64 A GB 10064/64A GB 1006464 A GB1006464 A GB 1006464A GB 994560 A GB994560 A GB 994560A
- Authority
- GB
- United Kingdom
- Prior art keywords
- ammonia
- coated
- group
- palladium
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
An electroless plating bath comprises an aqueous solution containing from 1-20 g./l. of divalent palladium, from 0.04-0.50 g./l, of unsymmetrical dimethyl hydrazine and at least one amino compound from the group consisting of ammonia and aliphatic organic compounds having a primary amine group, e.g. aminoethyl ethanolamine, and amylamine in a total molar concentration equal to from 100-350 g./l. of ammonia. E.D.T.A. in a concentration not exceeding 80 g./l., ammonium chloride and sulphate may also be added. Catalytic metals, e.g. Al, Cr, Co, Cu, Au, Fe, Mo, Ni, Pd, Pt, Ru, Ag, Sn, and W, and glass, plastics or ceramics coated with a preliminary coating of e.g. Ni, Ag or Pd may be coated.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US267947A US3274022A (en) | 1963-03-26 | 1963-03-26 | Palladium deposition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB994560A true GB994560A (en) | 1965-06-10 |
Family
ID=23020789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB10064/64A Expired GB994560A (en) | 1963-03-26 | 1964-03-10 | Deposition of palladium |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3274022A (en) |
| BE (1) | BE645775A (en) |
| DE (1) | DE1247804B (en) |
| GB (1) | GB994560A (en) |
| NL (1) | NL6403078A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1035850A (en) * | 1964-06-12 | 1966-07-13 | Johnson Matthey Co Ltd | Improvements in and relating to the electrodeposition of palladium |
| US3629776A (en) * | 1967-10-24 | 1971-12-21 | Nippon Kogaku Kk | Sliding thin film resistance for measuring instruments |
| US3846345A (en) * | 1969-10-06 | 1974-11-05 | Owens Illinois Inc | Electroconductive paste composition and structures formed therefrom |
| US3861919A (en) * | 1970-03-30 | 1975-01-21 | Itek Corp | A photoconductor process using a copy medium sensitized with an amine |
| US3862488A (en) * | 1970-11-20 | 1975-01-28 | Rca Corp | Method of making a joined metal structure |
| US4180480A (en) * | 1975-10-15 | 1979-12-25 | Mcgean Chemical Company, Inc. | Catalytically active compositions from precious metal complexes |
| US4279951A (en) * | 1979-01-15 | 1981-07-21 | Mine Safety Appliances Company | Method for the electroless deposition of palladium |
| US4255194A (en) * | 1979-01-15 | 1981-03-10 | Mine Safety Appliances Company | Palladium alloy baths for the electroless deposition |
| CN104674201A (en) * | 2015-02-11 | 2015-06-03 | 江苏澳光电子有限公司 | Chemical palladium-plating liquid for plating metal palladium plating layer on metal surface |
| CN105296974A (en) * | 2015-08-27 | 2016-02-03 | 中国科学院兰州化学物理研究所 | Palladium plating liquid and method for plating palladium on copper surface by using same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2915406A (en) * | 1958-03-03 | 1959-12-01 | Int Nickel Co | Palladium plating by chemical reduction |
| GB844358A (en) * | 1958-03-03 | 1960-08-10 | Mond Nickel Co Ltd | Improvements in palladium plating |
| US3156634A (en) * | 1962-12-12 | 1964-11-10 | Sel Rex Corp | Gold plating |
-
1963
- 1963-03-26 US US267947A patent/US3274022A/en not_active Expired - Lifetime
-
1964
- 1964-03-10 GB GB10064/64A patent/GB994560A/en not_active Expired
- 1964-03-19 DE DEJ25485A patent/DE1247804B/en active Pending
- 1964-03-23 NL NL6403078A patent/NL6403078A/xx unknown
- 1964-03-26 BE BE645775A patent/BE645775A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| BE645775A (en) | 1964-09-28 |
| NL6403078A (en) | 1964-09-28 |
| DE1247804B (en) | 1967-08-17 |
| US3274022A (en) | 1966-09-20 |
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