GB1263445A - Ductility promoter and stabilizer for electroless plating baths - Google Patents
Ductility promoter and stabilizer for electroless plating bathsInfo
- Publication number
- GB1263445A GB1263445A GB4211/70A GB421170A GB1263445A GB 1263445 A GB1263445 A GB 1263445A GB 4211/70 A GB4211/70 A GB 4211/70A GB 421170 A GB421170 A GB 421170A GB 1263445 A GB1263445 A GB 1263445A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electroless plating
- oxide
- metal
- stabilizer
- borohydride
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1,263,445. Electroless plating. PHOTO- CIRCUITS CORP. Jan.28, 1970 [Feb.4, 1969], No.4211/70. Heading C7F. An electroless plating solution comprises water, a complexing agent, a reducing agent and a stabilizing agent for the metal ion to be deposited, a pH adjuster, and an amount of a polyalkylene oxide insufficient to prevent electroless deposition of metal but sufficient to enhance the stability of the solution, said amount being in the range 0À1 to 80 mg/l. The polyalkylene oxide preferably has MW 6000-6,000,000 and may be polyethylene oxide, polypropylene oxide or polybutylene oxide. The metal may be Cu, the reducing agents may be formaldehyde, paraformaldehyde, trioxane, dimethyl hydantoin, glyoxal, Na or K borohydride, Na trimethoxy-borohydride, boranes, or amine boranes and the stabilizing agent may be NaCN or 2-mercapto-benzothiazole.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US79654269A | 1969-02-04 | 1969-02-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1263445A true GB1263445A (en) | 1972-02-09 |
Family
ID=25168439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4211/70A Expired GB1263445A (en) | 1969-02-04 | 1970-01-28 | Ductility promoter and stabilizer for electroless plating baths |
Country Status (9)
Country | Link |
---|---|
US (1) | US3607317A (en) |
JP (1) | JPS4834975B1 (en) |
AT (1) | AT313017B (en) |
CH (1) | CH533690A (en) |
DK (1) | DK139590B (en) |
FR (1) | FR2033925A5 (en) |
GB (1) | GB1263445A (en) |
NL (1) | NL165507C (en) |
SE (1) | SE366776B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2610470A1 (en) * | 1975-03-14 | 1976-09-30 | Hitachi Ltd | SOLUTION TO NON-GALVANIC COPPER |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4082898A (en) * | 1975-06-23 | 1978-04-04 | Ppg Industries, Inc. | Electroless deposition of electrically nonconductive copper-boron coatings on nonmetallic substrates |
US4171225A (en) * | 1976-01-23 | 1979-10-16 | U.S. Philips Corporation | Electroless copper plating solutions |
DE2635457C2 (en) * | 1976-08-04 | 1985-06-05 | Schering AG, 1000 Berlin und 4709 Bergkamen | Catalytic varnish and its use in the manufacture of printed circuits |
JPS56156749A (en) * | 1980-05-08 | 1981-12-03 | Toshiba Corp | Chemical copper plating solution |
DE3121015C2 (en) * | 1981-05-27 | 1986-12-04 | Friedr. Blasberg GmbH und Co KG, 5650 Solingen | Process for activating pickled surfaces and solution for carrying out the same |
US4405663A (en) * | 1982-03-29 | 1983-09-20 | Republic Steel Corporation | Tin plating bath composition and process |
US4548644A (en) * | 1982-09-28 | 1985-10-22 | Hitachi Chemical Company, Ltd. | Electroless copper deposition solution |
DE3239090A1 (en) * | 1982-10-22 | 1984-04-26 | Bayer Ag, 5090 Leverkusen | BLACK METALIZED SUBSTRATE SURFACES |
JPS6033358A (en) * | 1983-08-04 | 1985-02-20 | Hitachi Chem Co Ltd | Electroless copper plating liquid |
US4666858A (en) * | 1984-10-22 | 1987-05-19 | International Business Machines Corporation | Determination of amount of anionic material in a liquid sample |
US4617205A (en) * | 1984-12-21 | 1986-10-14 | Omi International Corporation | Formaldehyde-free autocatalytic electroless copper plating |
DE3622090C1 (en) * | 1986-07-02 | 1990-02-15 | Blasberg-Oberflaechentechnik Gmbh, 5650 Solingen, De | |
US4908242A (en) * | 1986-10-31 | 1990-03-13 | Kollmorgen Corporation | Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2472393A (en) * | 1944-09-25 | 1949-06-07 | American Steel & Wire Co | Process and bath for copper coating ferrous metal |
US3095309A (en) * | 1960-05-03 | 1963-06-25 | Day Company | Electroless copper plating |
US3246995A (en) * | 1962-02-19 | 1966-04-19 | Aerojet General Co | Metal marking composition |
US3472664A (en) * | 1966-09-15 | 1969-10-14 | Enthone | Inhibiting stardusting in electroless copper plating |
-
1969
- 1969-02-04 US US796542A patent/US3607317A/en not_active Expired - Lifetime
- 1969-12-22 JP JP44103345A patent/JPS4834975B1/ja active Pending
-
1970
- 1970-01-28 GB GB4211/70A patent/GB1263445A/en not_active Expired
- 1970-02-02 SE SE01310/70A patent/SE366776B/xx unknown
- 1970-02-03 CH CH149370A patent/CH533690A/en not_active IP Right Cessation
- 1970-02-03 AT AT97670A patent/AT313017B/en not_active IP Right Cessation
- 1970-02-03 DK DK51370AA patent/DK139590B/en unknown
- 1970-02-04 FR FR7003856A patent/FR2033925A5/fr not_active Expired
- 1970-02-04 NL NL7001599.A patent/NL165507C/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2610470A1 (en) * | 1975-03-14 | 1976-09-30 | Hitachi Ltd | SOLUTION TO NON-GALVANIC COPPER |
Also Published As
Publication number | Publication date |
---|---|
DK139590B (en) | 1979-03-12 |
CH533690A (en) | 1973-02-15 |
JPS4834975B1 (en) | 1973-10-25 |
DE2005032A1 (en) | 1970-08-20 |
NL165507C (en) | 1981-04-15 |
AT313017B (en) | 1974-01-25 |
DE2005032B2 (en) | 1975-06-12 |
FR2033925A5 (en) | 1970-12-04 |
NL7001599A (en) | 1970-08-06 |
US3607317A (en) | 1971-09-21 |
SE366776B (en) | 1974-05-06 |
DK139590C (en) | 1979-09-03 |
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