GB1218850A - Improvements in autocatalytic copper plating solutions - Google Patents

Improvements in autocatalytic copper plating solutions

Info

Publication number
GB1218850A
GB1218850A GB60309/68A GB6030968A GB1218850A GB 1218850 A GB1218850 A GB 1218850A GB 60309/68 A GB60309/68 A GB 60309/68A GB 6030968 A GB6030968 A GB 6030968A GB 1218850 A GB1218850 A GB 1218850A
Authority
GB
United Kingdom
Prior art keywords
litre
salt
added
dec
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB60309/68A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Photocircuits Corp filed Critical Photocircuits Corp
Publication of GB1218850A publication Critical patent/GB1218850A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Removal Of Specific Substances (AREA)

Abstract

1,218,850. Electroless deposition of copper. PHOTO-CIRCUITS CORP. Dec.19, 1968 [Dec.28, 1967], No.60309/68. Heading C7F. Cu is electrolessly deposited on to e.g. sensitized insulating substrates from a solution comprising a water soluble Cu salt, a complexing agent for cupric ions, a pH adjuster, a reducing agent and 0À001-30 mgms/litre of Os which is preferably added as osmium tetroxide or potassuim osmiate. The Cu salt may be the sulphate, halide, nitrate or acetate, the reducing agents may be formaldehyde, paraformaldehyde, trioxane, 1-hydroxymethyl 5, 5- dimethyl hydantoin, glyoxal, hoxohydrides, boranes and hypophosphites. The complexing agent is the tetrasodium salt of ethylene-diaminetetraacetic acid and less than 5 gms/litre surfactants such as organic phosphate esters and oxyethylated sodium salts may be added. 0À02-0À1 mole/litre of P as organic and inorganic phosphorus compounds, up to 300 p.p. m of S may also be added. Test pieces of steel are treated in the solution.
GB60309/68A 1967-12-28 1968-12-19 Improvements in autocatalytic copper plating solutions Expired GB1218850A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69408667A 1967-12-28 1967-12-28

Publications (1)

Publication Number Publication Date
GB1218850A true GB1218850A (en) 1971-01-13

Family

ID=24787346

Family Applications (1)

Application Number Title Priority Date Filing Date
GB60309/68A Expired GB1218850A (en) 1967-12-28 1968-12-19 Improvements in autocatalytic copper plating solutions

Country Status (5)

Country Link
US (1) US3515563A (en)
DE (1) DE1817355B2 (en)
FR (1) FR1599408A (en)
GB (1) GB1218850A (en)
NL (1) NL157661B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE757573A (en) * 1969-10-16 1971-04-15 Philips Nv FLEXIBLE COPPER CURRENT FREE DEPOSIT
US3650777A (en) * 1971-02-11 1972-03-21 Kollmorgen Corp Electroless copper plating
US4211564A (en) * 1978-05-09 1980-07-08 Hitachi, Ltd. Chemical copper plating solution
WO1983002287A1 (en) * 1981-12-21 1983-07-07 Macdermid Inc Electroless copper deposition solutions
DE3790128C2 (en) * 1986-03-04 1995-07-27 Ishihara Chemical Co Ltd Electroless plating soln. for palladium deposition
JP5525762B2 (en) * 2008-07-01 2014-06-18 上村工業株式会社 Electroless plating solution, electroless plating method using the same, and method for manufacturing wiring board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3310430A (en) * 1965-06-30 1967-03-21 Day Company Electroless copper plating

Also Published As

Publication number Publication date
DE1817355A1 (en) 1969-08-07
FR1599408A (en) 1970-07-15
US3515563A (en) 1970-06-02
NL6818581A (en) 1969-07-01
DE1817355B2 (en) 1971-08-12
NL157661B (en) 1978-08-15

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