FR1599408A - - Google Patents
Info
- Publication number
- FR1599408A FR1599408A FR1599408DA FR1599408A FR 1599408 A FR1599408 A FR 1599408A FR 1599408D A FR1599408D A FR 1599408DA FR 1599408 A FR1599408 A FR 1599408A
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Removal Of Specific Substances (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69408667A | 1967-12-28 | 1967-12-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1599408A true FR1599408A (en) | 1970-07-15 |
Family
ID=24787346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1599408D Expired FR1599408A (en) | 1967-12-28 | 1968-12-23 |
Country Status (5)
Country | Link |
---|---|
US (1) | US3515563A (en) |
DE (1) | DE1817355B2 (en) |
FR (1) | FR1599408A (en) |
GB (1) | GB1218850A (en) |
NL (1) | NL157661B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BE757573A (en) * | 1969-10-16 | 1971-04-15 | Philips Nv | FLEXIBLE COPPER CURRENT FREE DEPOSIT |
US3650777A (en) * | 1971-02-11 | 1972-03-21 | Kollmorgen Corp | Electroless copper plating |
US4211564A (en) * | 1978-05-09 | 1980-07-08 | Hitachi, Ltd. | Chemical copper plating solution |
JPS58502101A (en) * | 1981-12-21 | 1983-12-08 | マツクデ−ミツド インコ−ポレ−テツド | Electroless copper deposition solution |
DE3790128T (en) * | 1986-03-04 | 1988-03-31 | ||
JP5525762B2 (en) * | 2008-07-01 | 2014-06-18 | 上村工業株式会社 | Electroless plating solution, electroless plating method using the same, and method for manufacturing wiring board |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3310430A (en) * | 1965-06-30 | 1967-03-21 | Day Company | Electroless copper plating |
-
1967
- 1967-12-28 US US694086A patent/US3515563A/en not_active Expired - Lifetime
-
1968
- 1968-12-19 GB GB60309/68A patent/GB1218850A/en not_active Expired
- 1968-12-23 FR FR1599408D patent/FR1599408A/fr not_active Expired
- 1968-12-24 NL NL6818581.A patent/NL157661B/en not_active IP Right Cessation
- 1968-12-28 DE DE19681817355 patent/DE1817355B2/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
NL157661B (en) | 1978-08-15 |
DE1817355A1 (en) | 1969-08-07 |
DE1817355B2 (en) | 1971-08-12 |
NL6818581A (en) | 1969-07-01 |
US3515563A (en) | 1970-06-02 |
GB1218850A (en) | 1971-01-13 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |