GB965859A - Improvements in and relating to the deposition of palladium - Google Patents
Improvements in and relating to the deposition of palladiumInfo
- Publication number
- GB965859A GB965859A GB25789/62A GB2578962A GB965859A GB 965859 A GB965859 A GB 965859A GB 25789/62 A GB25789/62 A GB 25789/62A GB 2578962 A GB2578962 A GB 2578962A GB 965859 A GB965859 A GB 965859A
- Authority
- GB
- United Kingdom
- Prior art keywords
- sodium
- acid
- dinitrito
- palladite
- potassium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Chemically Coating (AREA)
Abstract
The electroless deposition of palladium on a metal base is effected by immersing said base in a bath comprising an aqueous solution of a complex nitrito-palladite compound of general formula: A2[Pd(NO2)aR14-a] or <FORM:0965859/C6-C7/1> wherein A2 represents an alkali metal or a hydrogen cation, R1 represents a monovalent acid radicle, R11 represents a divalent acid radicle, and a is 1, 2 or 3, said solution being buffered to a pH within the range 2-5. The plating bath is preferably buffered to the required pH by the addition of a potassium or sodium or other alkali metal salt of a weak acid; or the corresponding acid may first be added and then KOH, NaOH or other alkali hydroxide introduced until the required pH is obtained. Examples of suitable weak acid salts are sodium citrate, sodium acetate, sodium oxalate, sodium tartrate, sodium phosphate, sodium borate, and sodium metaborate, or the corresponding potassium salts. The acid radicle of the nitrito-palladite compound may be a sulphate, citrate, oxalate, tartrate, acetate, phosphate, selenate, perchlorate, nitrate, chloride, bromide, or fluoride. The cation constituent is preferably an alkali metal. Suitable palladium compounds are potassium- (or sodium-) dichloro-dinitrito-palladite, K2Pd(NO2)2Cl2; potassium- (or sodium-) sulphato-dinitrito-palladite, K2Pd(NO2)2SO4; dinitrito-sulphato-palladou acid, H2Pd(NO2)2SO4; potassium- (or sodium-) nitrato-dinitrito-palladite, K2Pd(NO2)2(NO3)2; dinitrito-selenato-palladous acid, H2Pd(NO2)2SeO4; dinitrito-perchlorato-palladous acid, H2Pd(NO2)2 (ClO4)2. Plating baths containing 1-30 gms./litre of palladium are operated at 20-70 DEG C. for 15 minutes to 3 hours to form a palladium deposit of 1/4 -10 mgm. per sq. inch. The bath may be used for the plating of base metals and also noble metals, but with the exception of silver noble metals must be in contact with a base metal. Metals specified are copper, silver, brass, aluminium bronze, phosphor bronze, beryllium-copper, and mild steel. Specification 897,690 is referred to.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB25789/62A GB965859A (en) | 1962-07-05 | 1962-07-05 | Improvements in and relating to the deposition of palladium |
US287773A US3285754A (en) | 1962-07-05 | 1963-06-14 | Deposition of palladium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB25789/62A GB965859A (en) | 1962-07-05 | 1962-07-05 | Improvements in and relating to the deposition of palladium |
Publications (1)
Publication Number | Publication Date |
---|---|
GB965859A true GB965859A (en) | 1964-08-06 |
Family
ID=10233333
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB25789/62A Expired GB965859A (en) | 1962-07-05 | 1962-07-05 | Improvements in and relating to the deposition of palladium |
Country Status (2)
Country | Link |
---|---|
US (1) | US3285754A (en) |
GB (1) | GB965859A (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1035850A (en) * | 1964-06-12 | 1966-07-13 | Johnson Matthey Co Ltd | Improvements in and relating to the electrodeposition of palladium |
ZA764709B (en) * | 1976-01-26 | 1978-02-22 | Borg Warner | Catalytically active composition for electroless plating |
DE3347384A1 (en) * | 1983-12-29 | 1985-07-11 | Inovan-Stroebe GmbH & Co KG, 7534 Birkenfeld | PALLADIUM BATH |
US5264288A (en) * | 1992-10-01 | 1993-11-23 | Ppg Industries, Inc. | Electroless process using silylated polyamine-noble metal complexes |
US5882736A (en) * | 1993-05-13 | 1999-03-16 | Atotech Deutschland Gmbh | palladium layers deposition process |
DE4316679C1 (en) * | 1993-05-13 | 1994-07-28 | Atotech Deutschland Gmbh | Palladium surface-coating of copper, nickel and their alloys |
GB9425031D0 (en) * | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Printed circuit board manufacture |
GB9425030D0 (en) | 1994-12-09 | 1995-02-08 | Alpha Metals Ltd | Silver plating |
US6905587B2 (en) | 1996-03-22 | 2005-06-14 | Ronald Redline | Method for enhancing the solderability of a surface |
DE102007018845B4 (en) * | 2007-04-20 | 2009-11-12 | Carl Von Ossietzky Universität Oldenburg | Process for depositing a metal-containing substance on a substrate and coating material therefor |
EP3960898A1 (en) | 2020-08-31 | 2022-03-02 | Atotech Deutschland GmbH & Co. KG | Compostion for depositing a palladium coating on a substrate |
EP4215642A1 (en) | 2022-01-25 | 2023-07-26 | Atotech Deutschland GmbH & Co. KG | Compostion for depositing a palladium coating on an activated copper-coated substrate |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2720494A (en) * | 1950-01-09 | 1955-10-11 | Harold R Suter | Process of preparing catalytic elements |
GB897690A (en) * | 1959-09-30 | 1962-05-30 | Johnson Matthey Co Ltd | Improvements in and relating to the electrodeposition of platinum or palladium |
-
1962
- 1962-07-05 GB GB25789/62A patent/GB965859A/en not_active Expired
-
1963
- 1963-06-14 US US287773A patent/US3285754A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US3285754A (en) | 1966-11-15 |
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