GB965859A - Improvements in and relating to the deposition of palladium - Google Patents

Improvements in and relating to the deposition of palladium

Info

Publication number
GB965859A
GB965859A GB25789/62A GB2578962A GB965859A GB 965859 A GB965859 A GB 965859A GB 25789/62 A GB25789/62 A GB 25789/62A GB 2578962 A GB2578962 A GB 2578962A GB 965859 A GB965859 A GB 965859A
Authority
GB
United Kingdom
Prior art keywords
sodium
acid
dinitrito
palladite
potassium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB25789/62A
Inventor
Norman Hopkin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Johnson Matthey PLC
Original Assignee
Johnson Matthey PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Johnson Matthey PLC filed Critical Johnson Matthey PLC
Priority to GB25789/62A priority Critical patent/GB965859A/en
Priority to US287773A priority patent/US3285754A/en
Publication of GB965859A publication Critical patent/GB965859A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Chemically Coating (AREA)

Abstract

The electroless deposition of palladium on a metal base is effected by immersing said base in a bath comprising an aqueous solution of a complex nitrito-palladite compound of general formula: A2[Pd(NO2)aR14-a] or <FORM:0965859/C6-C7/1> wherein A2 represents an alkali metal or a hydrogen cation, R1 represents a monovalent acid radicle, R11 represents a divalent acid radicle, and a is 1, 2 or 3, said solution being buffered to a pH within the range 2-5. The plating bath is preferably buffered to the required pH by the addition of a potassium or sodium or other alkali metal salt of a weak acid; or the corresponding acid may first be added and then KOH, NaOH or other alkali hydroxide introduced until the required pH is obtained. Examples of suitable weak acid salts are sodium citrate, sodium acetate, sodium oxalate, sodium tartrate, sodium phosphate, sodium borate, and sodium metaborate, or the corresponding potassium salts. The acid radicle of the nitrito-palladite compound may be a sulphate, citrate, oxalate, tartrate, acetate, phosphate, selenate, perchlorate, nitrate, chloride, bromide, or fluoride. The cation constituent is preferably an alkali metal. Suitable palladium compounds are potassium- (or sodium-) dichloro-dinitrito-palladite, K2Pd(NO2)2Cl2; potassium- (or sodium-) sulphato-dinitrito-palladite, K2Pd(NO2)2SO4; dinitrito-sulphato-palladou acid, H2Pd(NO2)2SO4; potassium- (or sodium-) nitrato-dinitrito-palladite, K2Pd(NO2)2(NO3)2; dinitrito-selenato-palladous acid, H2Pd(NO2)2SeO4; dinitrito-perchlorato-palladous acid, H2Pd(NO2)2 (ClO4)2. Plating baths containing 1-30 gms./litre of palladium are operated at 20-70 DEG C. for 15 minutes to 3 hours to form a palladium deposit of 1/4 -10 mgm. per sq. inch. The bath may be used for the plating of base metals and also noble metals, but with the exception of silver noble metals must be in contact with a base metal. Metals specified are copper, silver, brass, aluminium bronze, phosphor bronze, beryllium-copper, and mild steel. Specification 897,690 is referred to.
GB25789/62A 1962-07-05 1962-07-05 Improvements in and relating to the deposition of palladium Expired GB965859A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB25789/62A GB965859A (en) 1962-07-05 1962-07-05 Improvements in and relating to the deposition of palladium
US287773A US3285754A (en) 1962-07-05 1963-06-14 Deposition of palladium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB25789/62A GB965859A (en) 1962-07-05 1962-07-05 Improvements in and relating to the deposition of palladium

Publications (1)

Publication Number Publication Date
GB965859A true GB965859A (en) 1964-08-06

Family

ID=10233333

Family Applications (1)

Application Number Title Priority Date Filing Date
GB25789/62A Expired GB965859A (en) 1962-07-05 1962-07-05 Improvements in and relating to the deposition of palladium

Country Status (2)

Country Link
US (1) US3285754A (en)
GB (1) GB965859A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1035850A (en) * 1964-06-12 1966-07-13 Johnson Matthey Co Ltd Improvements in and relating to the electrodeposition of palladium
ZA764709B (en) * 1976-01-26 1978-02-22 Borg Warner Catalytically active composition for electroless plating
DE3347384A1 (en) * 1983-12-29 1985-07-11 Inovan-Stroebe GmbH & Co KG, 7534 Birkenfeld PALLADIUM BATH
US5264288A (en) * 1992-10-01 1993-11-23 Ppg Industries, Inc. Electroless process using silylated polyamine-noble metal complexes
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process
DE4316679C1 (en) * 1993-05-13 1994-07-28 Atotech Deutschland Gmbh Palladium surface-coating of copper, nickel and their alloys
GB9425031D0 (en) * 1994-12-09 1995-02-08 Alpha Metals Ltd Printed circuit board manufacture
GB9425030D0 (en) 1994-12-09 1995-02-08 Alpha Metals Ltd Silver plating
US6905587B2 (en) 1996-03-22 2005-06-14 Ronald Redline Method for enhancing the solderability of a surface
DE102007018845B4 (en) * 2007-04-20 2009-11-12 Carl Von Ossietzky Universität Oldenburg Process for depositing a metal-containing substance on a substrate and coating material therefor
EP3960898A1 (en) 2020-08-31 2022-03-02 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on a substrate
EP4215642A1 (en) 2022-01-25 2023-07-26 Atotech Deutschland GmbH & Co. KG Compostion for depositing a palladium coating on an activated copper-coated substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2720494A (en) * 1950-01-09 1955-10-11 Harold R Suter Process of preparing catalytic elements
GB897690A (en) * 1959-09-30 1962-05-30 Johnson Matthey Co Ltd Improvements in and relating to the electrodeposition of platinum or palladium

Also Published As

Publication number Publication date
US3285754A (en) 1966-11-15

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