GB1373895A - Composition and process for electroless copper plating - Google Patents
Composition and process for electroless copper platingInfo
- Publication number
- GB1373895A GB1373895A GB1147673A GB1147673A GB1373895A GB 1373895 A GB1373895 A GB 1373895A GB 1147673 A GB1147673 A GB 1147673A GB 1147673 A GB1147673 A GB 1147673A GB 1373895 A GB1373895 A GB 1373895A
- Authority
- GB
- United Kingdom
- Prior art keywords
- halo
- march
- bromide
- chloride
- optionally substituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010949 copper Substances 0.000 title abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 238000007747 plating Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- -1 halide ions Chemical class 0.000 abstract 2
- 125000001475 halogen functional group Chemical group 0.000 abstract 2
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 abstract 2
- 150000003512 tertiary amines Chemical class 0.000 abstract 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 abstract 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 abstract 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 abstract 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 1
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 abstract 1
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 abstract 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 abstract 1
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 abstract 1
- 235000011167 hydrochloric acid Nutrition 0.000 abstract 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 150000002500 ions Chemical class 0.000 abstract 1
- 239000000314 lubricant Substances 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- 229920001515 polyalkylene glycol Polymers 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 125000001424 substituent group Chemical group 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
1373895 Electroless copper plating PYRENE CHEMICAL SERVICES Ltd 9 March 1973 [13 March 1972] 11476/73 Heading C7F An electroless aqueous, acidic Cu-plating solution comprises Cu ions, halide ions selected from chloride, bromide or iodide, polyalkylene glycol and tertiary amine of the formula:- R a N[(CH 2 ) n R<SP>1</SP>] 3-a , where a is 0 or 1, n is 0 to 4, R is C 1-4 alkyl optionally substituted by hydroxy or halo and R<SP>1</SP> is phenyl optionally substituted by up to three substituents selected from halo and C 1-4 alkyl. Many tertiary amines are referred to. The Cu may be present as sulphate, chloride, bromide, acetate, citrate, benzoate, metaborate, butyrate, formate, and sulphanate. Sulphuric acid may be added to the solution. The substrate may be steel wire cleaned in muriatic acid and alkali metal hydroxide or permanganate. The copper may be subsequently coated with a lubricant.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23430272A | 1972-03-13 | 1972-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB1373895A true GB1373895A (en) | 1974-11-13 |
Family
ID=22880806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1147673A Expired GB1373895A (en) | 1972-03-13 | 1973-03-09 | Composition and process for electroless copper plating |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3793037A (en) |
| JP (1) | JPS5518782B2 (en) |
| AR (1) | AR197980A1 (en) |
| AU (1) | AU467404B2 (en) |
| BE (1) | BE793376A (en) |
| CA (1) | CA989105A (en) |
| ES (1) | ES410196A1 (en) |
| FR (1) | FR2175729B1 (en) |
| GB (1) | GB1373895A (en) |
| ZA (1) | ZA731439B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2192197A (en) * | 1986-05-19 | 1988-01-06 | Harima Chemicals Inc | A method of forming a metal film on the surface of a substrate metal |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4981725A (en) * | 1972-07-11 | 1991-01-01 | Amp-Akzo Corporation | Process and composition for sensitizing articles for metallization |
| US4259113A (en) * | 1976-05-26 | 1981-03-31 | Kollmorgen Technologies Corporation | Composition for sensitizing articles for metallization |
| JPS52144901A (en) * | 1976-05-28 | 1977-12-02 | Shin Shirasuna Electric Corp | Device for monitoring power supply voltage |
| JPS546731U (en) * | 1977-06-16 | 1979-01-17 | ||
| JPS645617Y2 (en) * | 1981-05-29 | 1989-02-13 | ||
| US4758025A (en) * | 1985-06-18 | 1988-07-19 | Mobil Oil Corporation | Use of electroless metal coating to prevent galling of threaded tubular joints |
| JPH0332385U (en) * | 1989-08-07 | 1991-03-28 | ||
| DE4440299A1 (en) | 1994-11-11 | 1996-05-15 | Metallgesellschaft Ag | Process for the electroless deposition of copper coatings on iron and iron alloy surfaces |
| GB0031806D0 (en) * | 2000-12-29 | 2001-02-07 | Chemetall Plc | Electroless copper plating of ferrous metal substrates |
| AU2002248343A1 (en) * | 2001-01-12 | 2002-08-19 | University Of Rochester | Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| JP2009001872A (en) * | 2007-06-22 | 2009-01-08 | Kobe Steel Ltd | Copper-plating method of wire-like material, and copper-plated wire |
| WO2012022660A1 (en) * | 2010-08-17 | 2012-02-23 | Chemetall Gmbh | Process for the electroless copper plating of metallic substrates |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2049517A (en) * | 1934-06-06 | 1936-08-04 | American Chem Paint Co | Method of and material for inhibiting or retarding acid corrosion of ferrous metals |
| US2217921A (en) * | 1938-03-23 | 1940-10-15 | American Chem Paint Co | Art of drawing ferrous metal |
| US3141780A (en) * | 1962-03-30 | 1964-07-21 | Minnesota Mining & Mfg | Copper coating compositions |
-
0
- BE BE793376D patent/BE793376A/en unknown
-
1972
- 1972-03-13 US US3793037D patent/US3793037A/en not_active Expired - Lifetime
- 1972-11-22 FR FR7241497A patent/FR2175729B1/fr not_active Expired
- 1972-12-29 ES ES72410196A patent/ES410196A1/en not_active Expired
-
1973
- 1973-02-28 AU AU52697/73A patent/AU467404B2/en not_active Expired
- 1973-02-28 CA CA164,876A patent/CA989105A/en not_active Expired
- 1973-03-01 ZA ZA731439A patent/ZA731439B/en unknown
- 1973-03-09 GB GB1147673A patent/GB1373895A/en not_active Expired
- 1973-03-12 JP JP2890973A patent/JPS5518782B2/ja not_active Expired
- 1973-03-13 AR AR24702373A patent/AR197980A1/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2192197A (en) * | 1986-05-19 | 1988-01-06 | Harima Chemicals Inc | A method of forming a metal film on the surface of a substrate metal |
| GB2192197B (en) * | 1986-05-19 | 1991-02-06 | Harima Chemicals Inc | Method of forming a metal film on the surface of a substrate metal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5518782B2 (en) | 1980-05-21 |
| ES410196A1 (en) | 1976-01-01 |
| ZA731439B (en) | 1973-11-28 |
| FR2175729B1 (en) | 1976-08-20 |
| AR197980A1 (en) | 1974-05-24 |
| AU5269773A (en) | 1974-08-29 |
| US3793037A (en) | 1974-02-19 |
| CA989105A (en) | 1976-05-18 |
| AU467404B2 (en) | 1975-11-27 |
| BE793376A (en) | 1973-04-16 |
| FR2175729A1 (en) | 1973-10-26 |
| JPS492726A (en) | 1974-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PS | Patent sealed [section 19, patents act 1949] | ||
| PCNP | Patent ceased through non-payment of renewal fee |