US2905602A - Production of metal electrodeposits - Google Patents

Production of metal electrodeposits Download PDF

Info

Publication number
US2905602A
US2905602A US544586A US54458655A US2905602A US 2905602 A US2905602 A US 2905602A US 544586 A US544586 A US 544586A US 54458655 A US54458655 A US 54458655A US 2905602 A US2905602 A US 2905602A
Authority
US
United States
Prior art keywords
impurities
quaternary ammonium
copper
electrodeposits
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
US544586A
Inventor
Kirstahler Alfred
Willmund Wolf-Dieter
Strauss Wennemar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dehydag Deutsche Hydrierwerke GmbH
Original Assignee
Dehydag Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dehydag Gmbh filed Critical Dehydag Gmbh
Application granted granted Critical
Publication of US2905602A publication Critical patent/US2905602A/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • AHUMAN NECESSITIES
    • A21BAKING; EDIBLE DOUGHS
    • A21DTREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS; PRESERVATION THEREOF
    • A21D2/00Treatment of flour or dough by adding materials thereto before or during baking
    • A21D2/08Treatment of flour or dough by adding materials thereto before or during baking by adding organic substances
    • A21D2/30Organic phosphorus compounds
    • A21D2/32Phosphatides
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Definitions

  • This invention relates to a process for the production of bright metal electrodeposits, and more particularly to electroplating solutions having quaternary ammonium compounds dissolved therein which eliminate the adverse effects of impurities in such solutionsuponthe brightness of the electrodeposits producedtherefrom.
  • quaternary ammonium compounds thus formed need not be isolated or specially purified prior to their use as additives for electroplatin g ba'ths in accordance
  • Specific examples of halogenated tertiary amines which may be transformed into quaternary ammonium compounds suitable for use as electroplating bath additives according to our invention are the following:
  • ⁇ gm./liter of bath preferably fro'm"2 to 8 gm./liter of trodeposits are produced despite the presence of interfering impurities in the electroplating bath.
  • Another object of this invention is to provide additives for electroplating baths containing brighteners, which Will render impurities present in the bath impotent as interfering substances in the production of bright electrodeposits.
  • objects are electroplated in a bath modified in accordance with our invention at temperatures ranging from 30 to 60 C. and at current densities between 0.5 and 15 amp./dm.
  • Electroplating baths containing brighteningagents and modified in the above manner in accordance with our. invention will produce bright and lustrous electrodeposits over the entire effective range of current densities, de spite the presence of impurities of the above-described nature in the bath.
  • the quaternary am'-' monium additives according to our invention have the further advantage that they increase the ductility of the electrodeposits produced from baths modified therewith.
  • the quaternary ammonium compounds are eifective in the manner described in all those electroplating baths which contain magnesium and calcium ions introduced by the use of hard tap water, and ferric ions introduced by the use of metal salts of technical purity in the prep- 'aration of the electroplating solution. We havefound, however, that they do not act as water-softening agents in the usual sense, and that they can not be replaced by the typical Water-softening agents, such as sequestering agents and detergents. Nevertheless, these quaternary ammonia um additives are capable of completely eliminating "the adverse effects of the above-described impurities upon the brightness of electrodeposits produced from baths containing such impurities and brighteners.
  • Patented Sept. 22, 1959v which is indicated by the high concentrations in which 7 1) a 0,115 on,
  • the employment of the quaternary ammonium compounds .in the manner above set forth does not necessitate any changes in the conditions under which objects are usually electroplated in metalisalt baths, particularly with respect to temperatures and current densities.
  • the quaternary ammonium additives are soluble in acid metal salt solutions, particularly in electroplating baths made from copper salts, and they are not decomposed by the action of'heat or electric current during the plating process.
  • the additives described above can be successfully employed to modify all types of electroplating baths in which the presence of impurities of the type mentioned previously adversely affects the qualities of electrodeposits produced therefrom.
  • the quaternary ammonium additives may be used in electroplating baths for electrodepositing zinc, nickel, chromium, precious metals, .and particularly copper.
  • Iron objects were then electroplated in this bath at a current density between 0.5 and 8 amp/dmfi.
  • the copper electrodeposits produced thereby were bright and lustrous.
  • the quaternary ammonium additives may be used in conjunction with other brightening agents whose brightening power is adversely affected by the presence of impurities in the electroplating bath, such as N,N-diethyldithiocarbamic-acid-n-propylester-w-sodium sulfonate and 0 the like.
  • a quaternary ammonium compound having the general structural formula formed by the internal rearrangement of tertiary amines, free from carboxyl groups, having the general structural formula wherein G is a halogen atom, R is selected from the group consisting of lower alkylene and monohydroxy lower alkylene, and R and R are selected from the group consisting of lower alkyl, monohydroxy lower alkyl, phenyl, cyclohexy'l and a heterocyclic radical, which includes the nitrogen atom and the R and R groups, selected from the group consisting of morpholino and piperidino radicals, and R represents the internally rearranged R radical.
  • G is a halogen atom
  • R is selected from the group consisting of lower alkylene and monohydroxy lower alkylene
  • R and R are selected from the group consisting of lower alkyl, monohydroxy lower alkyl, phenyl, cyclohexy'l and a heterocyclic radical, which includes the nitrogen atom and the R and
  • a quaternary ammonium compound having the general structural formula formed by the internal rearrangement of tertiary amines, free from carboxyl groups, having the general structural formula R2 wherein G is a halogen atom, R is selected from the group consisting of lower alkylene and monohydroxy lower alkylene, and R and R together with the N atom represent a heterocyclic radical selected from the group consisting of morpholino and piperidino radicals, and
  • R represents the internally rearranged R radical.
  • BIO-CHr-C'Ha CH2 I N ⁇ /CHOH CF HO-CHz-Oz CH2 formed by internal rearrangement of l-dioxyethylamino- 3-chloropropanol-2, whereby said impurities are prevented from interfering with the production of bright metal deposits.
  • the step which comprises adding to said baths 1 to 6 gm./liter of the quaternary ammonium compound having the general structural formula:

Description

United States Patent F 2,905,602 T PRODUCTION OF MET L ELECTRODEPOSITS Alfred Kirstahler, Dusseldorf, and Wolf-Dieter Willmund and Weunemar Strauss, Dusseldorf-Holthausen, Germany, assignors to Dehydag, Deutsche Hydrierwerke G.m.b.H., Dusseldorf, Germany, a corporation of Germany No Drawing. Application November 2, 1955 7 Serial No. 544,586 7 I Claims priority, application Germany November '5, 1954' 7 Claims. (Cl. .204-46) This invention relates to a process for the production of bright metal electrodeposits, and more particularly to electroplating solutions having quaternary ammonium compounds dissolved therein which eliminate the adverse effects of impurities in such solutionsuponthe brightness of the electrodeposits producedtherefrom.
It is well known in the electroplating art that the brightening elfect of brightners added to electroplating 1dwthylammo'ethylchlondeiz solutions is impaired by certain inorganic impurities con tained in such solutions. Impurities which usually have such an impairing effect upon metal electrodeposits are those substances WhlCh cause the hardness of water and y a m impurities which occur in technical grade metal salts employed to prepare electroplatingbaths, particularly in inorganic copper salts used to compound acid copperplating baths. v
The obvious solution to this problem would be to employ distilled water and chemically pure metal salts in the preparation of electroplating bathsintended to be modified with brighteners. the use of such chemically pure components would not only be very impractical, but would also render the cost of electroplating objects so high as to make bright plated articles too costly. t
It is an object of the present invention to provide a method of electroplating objects in platingbaths con-. taining brightening agents, whereby bright metal elec- 9 N-(3-chloro-2-oxy propyl) morpholine However, it is evident that with the present invention.
allowed to stand for extended periods of time, or are slightly heated. In either case, the transformation 'will take place when the tertiary amines are kept for some time or warmed as such or in solution respectively. According to Rothste'in and Binovic, Comptes Rendus, 236, pp. 1050-1052 (1953), for example the transformation of N,N-diethylamino-3-chloro-propanol-2 is said to take place as follows: 5
The quaternary ammonium compounds thus formed need not be isolated or specially purified prior to their use as additives for electroplatin g ba'ths in accordance Specific examples of halogenated tertiary amines which may be transformed into quaternary ammonium compounds suitable for use as electroplating bath additives according to our invention are the following:
l-dioxyethylamino-ethylchloride-2 l-diethylamino-3-chloropropano1-2 1-dioxyethylamino-3-chloropropanol-2 N-( 2-chloroethyl -N-ethyl-aniline N- 3 -chloro-2-oxy-propyl) -N-methyl'-cyclohexylamine N,N-dicyclohexyl-N-2-chloroethyl-amine N-2-chloroethyl-piperidine Bis-(2-bromoethyl)-benzylamine, and the like.
} gm./liter of bath, preferably fro'm"2 to 8 gm./liter of trodeposits are produced despite the presence of interfering impurities in the electroplating bath.
Another object of this invention is to provide additives for electroplating baths containing brighteners, which Will render impurities present in the bath impotent as interfering substances in the production of bright electrodeposits.
Other objects and advantages of our invention will become apparent as the description thereof proceeds.
We have found that the interfering effects of impurities in electroplating baths containing brighteners can be readily eliminated by adding to such electroplating baths quaternary ammonium compounds which are formed by internal rearrangement of the molecular structure of halogen-substituted tertiary amines having the general formula bath. The particular "amount required varies from one specific quaternary ammonium compound to the other, and also depends upon the natureof the brightening agent employed as well as upon the type and amount of impurities present in'the bath.. 1 1;
In general, objects are electroplated in a bath modified in accordance with our invention at temperatures ranging from 30 to 60 C. and at current densities between 0.5 and 15 amp./dm.
Electroplating baths containing brighteningagents and modified in the above manner in accordance with our. invention will produce bright and lustrous electrodeposits over the entire effective range of current densities, de spite the presence of impurities of the above-described nature in the bath. Moreover, the quaternary am'-' monium additives according to our invention have the further advantage that they increase the ductility of the electrodeposits produced from baths modified therewith.
The quaternary ammonium compounds are eifective in the manner described in all those electroplating baths which contain magnesium and calcium ions introduced by the use of hard tap water, and ferric ions introduced by the use of metal salts of technical purity in the prep- 'aration of the electroplating solution. We havefound, however, that they do not act as water-softening agents in the usual sense, and that they can not be replaced by the typical Water-softening agents, such as sequestering agents and detergents. Nevertheless, these quaternary ammonia um additives are capable of completely eliminating "the adverse effects of the above-described impurities upon the brightness of electrodeposits produced from baths containing such impurities and brighteners.
Although the exact theoretical reason for the beneficial action of these quaternary ammonium compounds is not fully understood, it is believed that their elfect comes into' play at the surface .of the metal object being electroplated;
Patented Sept. 22, 1959v which is indicated by the high concentrations in which 7 1) a 0,115 on,
The employment of the quaternary ammonium compounds .in the manner above set forth does not necessitate any changes in the conditions under which objects are usually electroplated in metalisalt baths, particularly with respect to temperatures and current densities. The quaternary ammonium additives are soluble in acid metal salt solutions, particularly in electroplating baths made from copper salts, and they are not decomposed by the action of'heat or electric current during the plating process.
The additives described above can be successfully employed to modify all types of electroplating baths in which the presence of impurities of the type mentioned previously adversely affects the qualities of electrodeposits produced therefrom. Thus, the quaternary ammonium additives may be used in electroplating baths for electrodepositing zinc, nickel, chromium, precious metals, .and particularly copper.
The following example will further illustrate our invention and enable others .skilledin the art to understand it more completely. Itis understood, however, we do not intendto limit the invention to this example.
Example 0.75 gm./liter N,N-dipropyl-dithiocarbamic acid-n butylester-w-sodium sulfonate was added as brightening agent to an acid copper plating bath prepared with distilled water, 200 gmJliter crystalline chemically pure copper sulfate and 60 gm/liter chemically puresulfuric acid.
Iron objects were then electroplated in this bath at a current density between 0.5 and 8 amp/dmfi. The copper electrodeposits produced thereby were bright and lustrous.
As a comparison, other iron objects were electroplated under the same conditions in a bath composed of the same quantities of water, copper sulfate and brightening agent as above, except that the water was hard tap water and the copper sulfate was technically pure instead of chemicallyv pure. The copper .electrodeposits produced thereby were not nearly as bright and lustrous as those produced from thebath composed of distilled water and chemically pure copper sulfate.
Thereafter, 2.5 gm./ liter .of the quaternary ammonium compound formed by internal rearrangement of 3-diethylamino-lbhloropropanol-2 to this electroplating bath are added to eliminate the. adverse efiects of the inorganic impurities introduced by the tap water and the technical grade copper sulfate. Iron objects electroplated in this modified bath were provided with very bright and exceptionally ductile copper electroplate.
The same advantageous results were obtained by sub stituting for the quaternary ammonium compound described above the indicated quantities of the following quaternary ammonium compounds:
Amount of quaternary ammonium Quaternary ammonium compound compound added to both, gmJliter CEOH Cl 4-6 nootm on,
CHFCHI CH3 [0%, \i on.on]or 1-6 CEC: C l
CHI-CH} CH1 [o ri on.on]or 2 CHr-Cz C 1 Similarly, the quaternary ammonium additives may be used in conjunction with other brightening agents whose brightening power is adversely affected by the presence of impurities in the electroplating bath, such as N,N-diethyldithiocarbamic-acid-n-propylester-w-sodium sulfonate and 0 the like.
While we have illustrated our invention by certain specific embodiments, it will be obvious to persons skilled in the art that various changes and modifications may be made therein without departing from the spirit of the present invention or the scope of the appended claims.
We claim:
1. In a process of producing bright metal electrodeposits of metals selected from the group consisting of copper, Zinc, nickel, chromium and precious metals from acidic electroplating baths containing impurities found in hard water and in technical grade metal salts, and containing a brightening agent whose brightening power is adversely affected by the presence of such impurities, the step which comprises adding to such electroplating baths 0.01 to 20 gm. per liter of a quaternary ammonium compound having the general structural formula formed by the internal rearrangement of tertiary amines, free from carboxyl groups, having the general structural formula wherein G is a halogen atom, R is selected from the group consisting of lower alkylene and monohydroxy lower alkylene, and R and R are selected from the group consisting of lower alkyl, monohydroxy lower alkyl, phenyl, cyclohexy'l and a heterocyclic radical, which includes the nitrogen atom and the R and R groups, selected from the group consisting of morpholino and piperidino radicals, and R represents the internally rearranged R radical.
2. In a process of producing bright metal electrodeposits of metals selected from the group consisting of copper, zinc, nickel, chromium and precious metals from acidic electroplating baths containing impurities found in hard water and in technical grade metal salts, and containing a brightening agent whose brightening power is adversely aifected by the presence of such impurities, the step which comprises adding to such electroplating baths 0.01 to 20 gm. per liter of a quaternary ammonium compound having the general structural formula formed by the internal rearrangement of tertiary amines, free from carboxyl groups, having the general structural formula R2 wherein G is a halogen atom, R is selected from the group consisting of lower alkylene and monohydroxy lower alkylene, and R and R together with the N atom represent a heterocyclic radical selected from the group consisting of morpholino and piperidino radicals, and
R represents the internally rearranged R radical.
3. In a process of producing bright metal electrodeposits of metals selected from the group consisting of copper, zinc, nickel, chromium and precious metals from acidic electroplating baths containing impurities found in hard water and in technical grade metal salts, and containing a brightening agent whose brightening power is adversely afiected by the presence of such impurities, the step which comprises adding to such electroplating baths 0.01 to 20 gm. per liter of a quaternary ammonium compound having the structural formula formed by the internal rearrangement of tertiary amines, free from carboxyl groups, having the general structural formula 1 zinc, nickel, chromium and precious metals, from acidic electroplating baths containing impurities found in hard water and in technical grade metal salts, and containing a brightening agent whose brightening power is adversely affected by the presence of such impurities, the step which comprises adding to said baths 4 to 6 gm./liter of the quaternary ammonium compound having the general structural formula:
BIO-CHr-C'Ha CH2 I: N\ /CHOH CF HO-CHz-Oz CH2 formed by internal rearrangement of l-dioxyethylamino- 3-chloropropanol-2, whereby said impurities are prevented from interfering with the production of bright metal deposits.
5. In a process of producing bright copper electrodeposits from acidic copper electroplating baths containing impurities found in hard water and in technical grade copper salts, and containing a brightening agent whose brightening power is adversely affected by the presence of such impurities, the step which comprises adding to said baths 1 to 6 gm./liter of the quaternary ammonium compound having the general structural formula:
formed by internal rearrangement of N-3-chlo-ro-propanol- Z-piperidine, whereby said impurities are prevented from interfering with the production of bright copper deposits.
6. In a process of producing bright copper electrodeposits from acidic copper electroplating baths containing impurities found in hard water and in technical grade copper salts, and containing a brightening agent whose brightening power is adversely affected by the presence of such impurities, the step of adding to said baths 2 gm./ liter of the quaternary ammonium compound having the general structural formula:
formed by internal rearrangement of N-(3-chloro-2-oxypropyl)-morpholine, whereby said impurities are prevented from interfering with the production of bright copper deposits.
7. In a process of producing bright metal electrodeposits of metals selected from the group consisting of copper, zinc, nickel, chromium and precious metals, from acidic electroplating baths containing said metals wherein said baths contain impurities found in hard water and in technical grade metal salts, and a brightening agent whose brightening power is adversely affected by the presence of such impurities, the steps which comprise adding to said baths 2 to 8 gm. per liter of the quaternary ammonium compound having the general structural formula:
from interfering with the production of bright deposits of said metals.
References Cited in the file of this patent UNITED STATES PATENTS Pierce Dec. 22, 1953 Brown et a1 Apr. 26, 1955

Claims (1)

1. IN A PROCESS OF PRODUCING BRIGHT METAL ELECTRODEPOSITS OF METALS SELECTED FROM THE GROUP CONSISTING OF COPPER, ZINC, NICKEL, CHROMIUM AND PRECIOUS METALS FROM ACIDIC ELECTROPLATING BATHS CONTAINING IMPURITIES FOUND IN HARD WATER AND IN TECHNICAL GRADEMETAL SALTS, AND CONTAINING A BRIGHTENING AGENT WHOSE BRIGHTENING POWER IS ADVERSELY AFFECTED BY THE PRESENCE OF SUCH IMPURITIES, THE STEP WHICH COMPRISES ADDING TO SUCH ELECTROPLATING BATHS 0.001 TO 20GM. PER LITER OF A QUATERNARY AMMONIUM COMPOUND HAVING THE GENERAL STRUCTURAL FORMULA
US544586A 1954-11-05 1955-11-02 Production of metal electrodeposits Expired - Lifetime US2905602A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DED19045A DE1014404B (en) 1954-11-05 1954-11-05 Process for the production of galvanic metal coatings

Publications (1)

Publication Number Publication Date
US2905602A true US2905602A (en) 1959-09-22

Family

ID=7036238

Family Applications (2)

Application Number Title Priority Date Filing Date
US458985A Expired - Lifetime US2842488A (en) 1954-11-05 1954-09-28 Process for the production of metal electrodeposits
US544586A Expired - Lifetime US2905602A (en) 1954-11-05 1955-11-02 Production of metal electrodeposits

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US458985A Expired - Lifetime US2842488A (en) 1954-11-05 1954-09-28 Process for the production of metal electrodeposits

Country Status (7)

Country Link
US (2) US2842488A (en)
BE (2) BE536575A (en)
CH (2) CH333941A (en)
DE (2) DE934508C (en)
FR (2) FR1120948A (en)
GB (2) GB806403A (en)
NL (2) NL92673C (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3006822A (en) * 1957-05-08 1961-10-31 Langbein Pfanhauser Werke Ag Electro-deposition of nickel coatings
US3075899A (en) * 1958-04-26 1963-01-29 Dehydag Gmbh Baths for the production of metal electroplates
US3120462A (en) * 1960-09-16 1964-02-04 Trifari Krussman And Fishel In Apparatus for recovering electroplating salts by evaporative concentration
US3180808A (en) * 1963-05-28 1965-04-27 Sture Granberger Fa Nickel plating bath
US3255096A (en) * 1963-11-01 1966-06-07 Harshaw Chem Corp Electrodeposition of nickel
US4479856A (en) * 1982-08-09 1984-10-30 Meidensha Electric Mfg. Co., Ltd. Zinc dendrite inhibitor

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1133610B (en) * 1959-06-06 1962-07-19 Dehydag Gmbh Acid galvanic copper baths
US3318787A (en) * 1964-02-07 1967-05-09 Udylite Corp Electrodeposition of zinc
US3423297A (en) * 1965-05-12 1969-01-21 Surface Research Inc Chromium electroplating bath including mist suppressors
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
GB8312104D0 (en) * 1983-05-04 1983-06-08 Shell Int Research Preparation of 1-substituted azetidin-3-ol derivatives
GB8412814D0 (en) * 1984-05-18 1984-06-27 Shell Int Research 1-substituted azetidine-3-ol derivatives
US5972192A (en) * 1997-07-23 1999-10-26 Advanced Micro Devices, Inc. Pulse electroplating copper or copper alloys
US6793796B2 (en) 1998-10-26 2004-09-21 Novellus Systems, Inc. Electroplating process for avoiding defects in metal features of integrated circuit devices
US20050109627A1 (en) * 2003-10-10 2005-05-26 Applied Materials, Inc. Methods and chemistry for providing initial conformal electrochemical deposition of copper in sub-micron features
CN100526515C (en) * 2002-12-18 2009-08-12 日矿金属株式会社 Copper electrolytic solution and electrolytic copper foil produced therewith
US20040154926A1 (en) * 2002-12-24 2004-08-12 Zhi-Wen Sun Multiple chemistry electrochemical plating method
US7473339B2 (en) * 2003-04-18 2009-01-06 Applied Materials, Inc. Slim cell platform plumbing
ES2761883T3 (en) * 2017-06-16 2020-05-21 Atotech Deutschland Gmbh Aqueous acid copper electroplating bath and method for electrolytically depositing a copper coating

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2663684A (en) * 1952-06-02 1953-12-22 Houdaille Hershey Corp Method of and composition for plating copper
US2707166A (en) * 1952-05-26 1955-04-26 Udylite Corp Electrodeposition of copper from an acid bath

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA461186A (en) * 1949-11-22 John Franklin Beaver, Jr. Bright copper plating
US2541700A (en) * 1946-02-28 1951-02-13 Du Pont Electroplating copper
DE888493C (en) * 1951-11-03 1953-09-03 Hydrierwerke A G Deutsche Process for the production of firmly adhering and shiny galvanic copper coatings

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2707166A (en) * 1952-05-26 1955-04-26 Udylite Corp Electrodeposition of copper from an acid bath
US2663684A (en) * 1952-06-02 1953-12-22 Houdaille Hershey Corp Method of and composition for plating copper

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3006822A (en) * 1957-05-08 1961-10-31 Langbein Pfanhauser Werke Ag Electro-deposition of nickel coatings
US3075899A (en) * 1958-04-26 1963-01-29 Dehydag Gmbh Baths for the production of metal electroplates
US3120462A (en) * 1960-09-16 1964-02-04 Trifari Krussman And Fishel In Apparatus for recovering electroplating salts by evaporative concentration
US3180808A (en) * 1963-05-28 1965-04-27 Sture Granberger Fa Nickel plating bath
US3255096A (en) * 1963-11-01 1966-06-07 Harshaw Chem Corp Electrodeposition of nickel
US4479856A (en) * 1982-08-09 1984-10-30 Meidensha Electric Mfg. Co., Ltd. Zinc dendrite inhibitor

Also Published As

Publication number Publication date
NL95110C (en) 1960-08-15
BE540855A (en) 1959-08-14
US2842488A (en) 1958-07-08
DE934508C (en) 1955-10-27
BE536575A (en) 1959-01-30
FR1120948A (en) 1956-07-17
FR68634E (en) 1958-05-05
GB815908A (en) 1959-07-01
GB806403A (en) 1958-12-23
DE1014404B (en) 1957-08-22
NL92673C (en) 1959-11-16
CH337380A (en) 1959-03-31
CH333941A (en) 1958-11-15

Similar Documents

Publication Publication Date Title
US2905602A (en) Production of metal electrodeposits
US4488942A (en) Zinc and zinc alloy electroplating bath and process
US2849352A (en) Electroplating process
US2910413A (en) Brighteners for electroplating baths
US3023150A (en) Bath for the production of metal electroplates
US4098656A (en) Bright palladium electroplating baths
US2893932A (en) Production of metal electrodeposits
US3035991A (en) Wetting agents for electroplating baths
US3458409A (en) Method and electrolyte for thick,brilliant plating of palladium
US3000800A (en) Copper-electroplating baths
SE8302549L (en) ELECTROLYTIC DRAINING BATH AND SET TO ELECTROLYTIC DRAINING COPPER, COPPER ALLOY OR CHROME FROM A METAL SUBSTRATE USING THE BATH
IT8047741A1 (en) ACID BATH AND ZINC ELECTROPLATING PROCEDURE
US3075899A (en) Baths for the production of metal electroplates
US2986498A (en) Process for the production of metal electrodeposits
US3990954A (en) Sulfite gold plating bath and process
US3575826A (en) Method and composition for electroplating tin
US2495668A (en) Electrodeposition of copper
ES472577A1 (en) Acid zinc electroplating process and composition
US2859159A (en) Bright copper plating bath containing mixtures of metal compounds
US2781305A (en) Electrodeposition of nickel
US2694041A (en) Electrodeposition of nickel
US3051634A (en) Baths for the production of copper electroplates
US3111465A (en) Electrodeposition of copper and copper alloys
US3748237A (en) Zinc plating
US3092559A (en) Gold plating