CH333941A - Process for the production of electroplated metal coatings - Google Patents
Process for the production of electroplated metal coatingsInfo
- Publication number
- CH333941A CH333941A CH333941DA CH333941A CH 333941 A CH333941 A CH 333941A CH 333941D A CH333941D A CH 333941DA CH 333941 A CH333941 A CH 333941A
- Authority
- CH
- Switzerland
- Prior art keywords
- production
- metal coatings
- electroplated metal
- electroplated
- coatings
- Prior art date
Links
Classifications
-
- A—HUMAN NECESSITIES
- A21—BAKING; EDIBLE DOUGHS
- A21D—TREATMENT OF FLOUR OR DOUGH FOR BAKING, e.g. BY ADDITION OF MATERIALS; BAKING; BAKERY PRODUCTS
- A21D2/00—Treatment of flour or dough by adding materials thereto before or during baking
- A21D2/08—Treatment of flour or dough by adding materials thereto before or during baking by adding organic substances
- A21D2/30—Organic phosphorus compounds
- A21D2/32—Phosphatides
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Food Science & Technology (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DED19045A DE1014404B (en) | 1954-11-05 | 1954-11-05 | Process for the production of galvanic metal coatings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH333941A true CH333941A (en) | 1958-11-15 |
Family
ID=7036238
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH333941D CH333941A (en) | 1954-11-05 | 1955-03-08 | Process for the production of electroplated metal coatings |
| CH337380D CH337380A (en) | 1954-11-05 | 1955-07-21 | Process for the production of electroplated metal coatings |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH337380D CH337380A (en) | 1954-11-05 | 1955-07-21 | Process for the production of electroplated metal coatings |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US2842488A (en) |
| BE (2) | BE536575A (en) |
| CH (2) | CH333941A (en) |
| DE (2) | DE934508C (en) |
| FR (2) | FR1120948A (en) |
| GB (2) | GB806403A (en) |
| NL (2) | NL92673C (en) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3006822A (en) * | 1957-05-08 | 1961-10-31 | Langbein Pfanhauser Werke Ag | Electro-deposition of nickel coatings |
| NL238490A (en) * | 1958-04-26 | |||
| DE1133610B (en) * | 1959-06-06 | 1962-07-19 | Dehydag Gmbh | Acid galvanic copper baths |
| US3120462A (en) * | 1960-09-16 | 1964-02-04 | Trifari Krussman And Fishel In | Apparatus for recovering electroplating salts by evaporative concentration |
| SE302227B (en) * | 1963-05-28 | 1968-07-08 | Candor Kemiska Ab | |
| US3255096A (en) * | 1963-11-01 | 1966-06-07 | Harshaw Chem Corp | Electrodeposition of nickel |
| US3318787A (en) * | 1964-02-07 | 1967-05-09 | Udylite Corp | Electrodeposition of zinc |
| US3423297A (en) * | 1965-05-12 | 1969-01-21 | Surface Research Inc | Chromium electroplating bath including mist suppressors |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| JPS5928588A (en) * | 1982-08-09 | 1984-02-15 | Meidensha Electric Mfg Co Ltd | Inhibitor for dendrite of zinc |
| GB8312104D0 (en) * | 1983-05-04 | 1983-06-08 | Shell Int Research | Preparation of 1-substituted azetidin-3-ol derivatives |
| GB8412814D0 (en) * | 1984-05-18 | 1984-06-27 | Shell Int Research | 1-substituted azetidine-3-ol derivatives |
| US5972192A (en) * | 1997-07-23 | 1999-10-26 | Advanced Micro Devices, Inc. | Pulse electroplating copper or copper alloys |
| US6793796B2 (en) | 1998-10-26 | 2004-09-21 | Novellus Systems, Inc. | Electroplating process for avoiding defects in metal features of integrated circuit devices |
| US20050109627A1 (en) * | 2003-10-10 | 2005-05-26 | Applied Materials, Inc. | Methods and chemistry for providing initial conformal electrochemical deposition of copper in sub-micron features |
| DE60333308D1 (en) * | 2002-12-18 | 2010-08-19 | Nippon Mining Co | COPPER ELECTROLYSOL SOLUTION AND ELECTROLYTE COPPER FILM MANUFACTURED THEREWITH |
| US20040154926A1 (en) * | 2002-12-24 | 2004-08-12 | Zhi-Wen Sun | Multiple chemistry electrochemical plating method |
| US7473339B2 (en) * | 2003-04-18 | 2009-01-06 | Applied Materials, Inc. | Slim cell platform plumbing |
| EP3415664B1 (en) | 2017-06-16 | 2019-09-18 | ATOTECH Deutschland GmbH | Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA461186A (en) * | 1949-11-22 | John Franklin Beaver, Jr. | Bright copper plating | |
| US2541700A (en) * | 1946-02-28 | 1951-02-13 | Du Pont | Electroplating copper |
| DE888493C (en) * | 1951-11-03 | 1953-09-03 | Hydrierwerke A G Deutsche | Process for the production of firmly adhering and shiny galvanic copper coatings |
| BE520209A (en) * | 1952-05-26 | |||
| US2663684A (en) * | 1952-06-02 | 1953-12-22 | Houdaille Hershey Corp | Method of and composition for plating copper |
-
1954
- 1954-04-23 DE DED17614A patent/DE934508C/en not_active Expired
- 1954-09-28 US US458985A patent/US2842488A/en not_active Expired - Lifetime
- 1954-11-05 DE DED19045A patent/DE1014404B/en active Pending
-
1955
- 1955-03-08 CH CH333941D patent/CH333941A/en unknown
- 1955-03-17 BE BE536575D patent/BE536575A/xx unknown
- 1955-03-18 FR FR1120948D patent/FR1120948A/en not_active Expired
- 1955-03-30 GB GB9226/55A patent/GB806403A/en not_active Expired
- 1955-04-21 NL NL196635A patent/NL92673C/xx active
- 1955-07-21 CH CH337380D patent/CH337380A/en unknown
- 1955-08-02 FR FR68634D patent/FR68634E/en not_active Expired
- 1955-08-27 BE BE540855D patent/BE540855A/xx unknown
- 1955-10-05 NL NL200993A patent/NL95110C/xx active
- 1955-11-02 US US544586A patent/US2905602A/en not_active Expired - Lifetime
- 1955-11-04 GB GB31541/55A patent/GB815908A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| GB815908A (en) | 1959-07-01 |
| GB806403A (en) | 1958-12-23 |
| FR68634E (en) | 1958-05-05 |
| US2842488A (en) | 1958-07-08 |
| FR1120948A (en) | 1956-07-17 |
| BE536575A (en) | 1959-01-30 |
| NL95110C (en) | 1960-08-15 |
| US2905602A (en) | 1959-09-22 |
| BE540855A (en) | 1959-08-14 |
| CH337380A (en) | 1959-03-31 |
| DE1014404B (en) | 1957-08-22 |
| DE934508C (en) | 1955-10-27 |
| NL92673C (en) | 1959-11-16 |
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