|
DE934508C
(en)
*
|
1954-04-23 |
1955-10-27 |
Dehydag Gmbh |
Process for the production of galvanic metal coatings
|
|
US2738318A
(en)
*
|
1954-12-28 |
1956-03-13 |
Udylite Res Corp |
Electrodeposition of copper from an acid bath
|
|
US2882209A
(en)
*
|
1957-05-20 |
1959-04-14 |
Udylite Res Corp |
Electrodeposition of copper from an acid bath
|
|
NL291575A
(en)
*
|
1962-04-16 |
|
|
|
|
US3288690A
(en)
*
|
1962-04-16 |
1966-11-29 |
Udylite Corp |
Electrodeposition of copper from acidic baths
|
|
US3328273A
(en)
*
|
1966-08-15 |
1967-06-27 |
Udylite Corp |
Electro-deposition of copper from acidic baths
|
|
DE2039831C3
(en)
*
|
1970-06-06 |
1979-09-06 |
Schering Ag, 1000 Berlin Und 4619 Bergkamen |
Acid bath for the galvanic deposition of shiny copper coatings
|
|
US4316778A
(en)
*
|
1980-09-24 |
1982-02-23 |
Rca Corporation |
Method for the manufacture of recording substrates for capacitance electronic discs
|
|
US4376685A
(en)
*
|
1981-06-24 |
1983-03-15 |
M&T Chemicals Inc. |
Acid copper electroplating baths containing brightening and leveling additives
|
|
US4469564A
(en)
*
|
1982-08-11 |
1984-09-04 |
At&T Bell Laboratories |
Copper electroplating process
|
|
AU554236B2
(en)
*
|
1983-06-10 |
1986-08-14 |
Omi International Corp. |
Electrolyte composition and process for electrodepositing copper
|
|
US4551212A
(en)
*
|
1985-03-11 |
1985-11-05 |
Rca Corporation |
Bath and process for the electrodeposition of micromachinable copper and additive for said bath
|
|
US7438788B2
(en)
|
1999-04-13 |
2008-10-21 |
Semitool, Inc. |
Apparatus and methods for electrochemical processing of microelectronic workpieces
|
|
US7264698B2
(en)
|
1999-04-13 |
2007-09-04 |
Semitool, Inc. |
Apparatus and methods for electrochemical processing of microelectronic workpieces
|
|
US6709568B2
(en)
|
2002-06-13 |
2004-03-23 |
Advanced Technology Materials, Inc. |
Method for determining concentrations of additives in acid copper electrochemical deposition baths
|
|
US20060266648A1
(en)
*
|
2002-12-17 |
2006-11-30 |
King Mackenzie E |
Process analyzer for monitoring electrochemical deposition solutions
|
|
DE10261852B3
(en)
|
2002-12-20 |
2004-06-03 |
Atotech Deutschland Gmbh |
Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
|
|
US20050067304A1
(en)
*
|
2003-09-26 |
2005-03-31 |
King Mackenzie E. |
Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
|
|
DE10354860B4
(en)
*
|
2003-11-19 |
2008-06-26 |
Atotech Deutschland Gmbh |
Halogenated or pseudohalogenated monomeric phenazinium compounds, process for their preparation and acid bath containing these compounds and process for the electrolytic deposition of a copper precipitate
|
|
US20050109624A1
(en)
*
|
2003-11-25 |
2005-05-26 |
Mackenzie King |
On-wafer electrochemical deposition plating metrology process and apparatus
|
|
US20050224370A1
(en)
*
|
2004-04-07 |
2005-10-13 |
Jun Liu |
Electrochemical deposition analysis system including high-stability electrode
|
|
US6984299B2
(en)
*
|
2004-04-27 |
2006-01-10 |
Advanced Technology Material, Inc. |
Methods for determining organic component concentrations in an electrolytic solution
|
|
US7435320B2
(en)
|
2004-04-30 |
2008-10-14 |
Advanced Technology Materials, Inc. |
Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
|
|
US7427346B2
(en)
*
|
2004-05-04 |
2008-09-23 |
Advanced Technology Materials, Inc. |
Electrochemical drive circuitry and method
|
|
DE102005011708B3
(en)
|
2005-03-11 |
2007-03-01 |
Atotech Deutschland Gmbh |
A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate
|
|
EP3415664B1
(en)
|
2017-06-16 |
2019-09-18 |
ATOTECH Deutschland GmbH |
Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating
|
|
PL3483307T3
(en)
|
2017-11-09 |
2020-11-16 |
Atotech Deutschland Gmbh |
Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate
|