NL83873C - - Google Patents

Info

Publication number
NL83873C
NL83873C NL83873DA NL83873C NL 83873 C NL83873 C NL 83873C NL 83873D A NL83873D A NL 83873DA NL 83873 C NL83873 C NL 83873C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL83873C publication Critical patent/NL83873C/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
NL83873D 1952-05-26 NL83873C (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US290091A US2707166A (en) 1952-05-26 1952-05-26 Electrodeposition of copper from an acid bath

Publications (1)

Publication Number Publication Date
NL83873C true NL83873C (xx)

Family

ID=23114498

Family Applications (2)

Application Number Title Priority Date Filing Date
NL83873D NL83873C (xx) 1952-05-26
NLAANVRAGE7804190,A NL178453B (nl) 1952-05-26 Werkwijze voor het elektrostatisch copieren.

Family Applications After (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7804190,A NL178453B (nl) 1952-05-26 Werkwijze voor het elektrostatisch copieren.

Country Status (6)

Country Link
US (1) US2707166A (xx)
BE (1) BE520209A (xx)
DE (1) DE947656C (xx)
FR (1) FR1077492A (xx)
GB (1) GB736252A (xx)
NL (2) NL178453B (xx)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE934508C (de) * 1954-04-23 1955-10-27 Dehydag Gmbh Verfahren zur Herstellung galvanischer Metallueberzuege
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (xx) * 1962-04-16
US3288690A (en) * 1962-04-16 1966-11-29 Udylite Corp Electrodeposition of copper from acidic baths
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
DE2039831C3 (de) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Saures Bad zur galvanischen Abscheidung glänzender Kupferüberzüge
US4316778A (en) * 1980-09-24 1982-02-23 Rca Corporation Method for the manufacture of recording substrates for capacitance electronic discs
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4469564A (en) * 1982-08-11 1984-09-04 At&T Bell Laboratories Copper electroplating process
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US4551212A (en) * 1985-03-11 1985-11-05 Rca Corporation Bath and process for the electrodeposition of micromachinable copper and additive for said bath
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
US20060266648A1 (en) * 2002-12-17 2006-11-30 King Mackenzie E Process analyzer for monitoring electrochemical deposition solutions
DE10261852B3 (de) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
DE10354860B4 (de) * 2003-11-19 2008-06-26 Atotech Deutschland Gmbh Halogenierte oder pseudohalogenierte monomere Phenaziniumverbindungen, Verfahren zu deren Herstellung sowie diese Verbindungen enthaltendes saures Bad und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
DE102005011708B3 (de) 2005-03-11 2007-03-01 Atotech Deutschland Gmbh Polyvinylammoniumverbindung und Verfahren zu deren Herstellung sowie diese Verbindung enthaltende saure Lösung und Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages
ES2761883T3 (es) 2017-06-16 2020-05-21 Atotech Deutschland Gmbh Baño de galvanoplastia de cobre ácido acuoso y método para depositar electrolíticamente un revestimiento de cobre
ES2800292T3 (es) 2017-11-09 2020-12-29 Atotech Deutschland Gmbh Composiciones de electrodeposición para deposición electrolítica de cobre, su uso y un método para depositar electrolíticamente una capa de cobre o aleación de cobre sobre al menos una superficie de un sustrato

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2326999A (en) * 1940-03-11 1943-08-17 Harshaw Chem Corp Nickel plating
US2291590A (en) * 1940-03-11 1942-07-28 Harshaw Chem Corp Electrodeposition of metals
US2489538A (en) * 1941-05-24 1949-11-29 Gen Motors Corp Electrodeposition of copper
US2563360A (en) * 1941-05-24 1951-08-07 Gen Motors Corp Electrodeposition of copper
USRE24253E (en) * 1948-05-11 1956-12-11 Method of producing a composite liquid

Also Published As

Publication number Publication date
DE947656C (de) 1956-08-23
FR1077492A (fr) 1954-11-08
BE520209A (xx)
NL178453B (nl)
US2707166A (en) 1955-04-26
GB736252A (en) 1955-09-07

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