GB736252A - Improvements in electrodeposition of copper from an acid bath - Google Patents
Improvements in electrodeposition of copper from an acid bathInfo
- Publication number
- GB736252A GB736252A GB13949/53A GB1394953A GB736252A GB 736252 A GB736252 A GB 736252A GB 13949/53 A GB13949/53 A GB 13949/53A GB 1394953 A GB1394953 A GB 1394953A GB 736252 A GB736252 A GB 736252A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- sulphate
- electrodeposition
- bath
- safranine azo
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 238000004070 electrodeposition Methods 0.000 title abstract 3
- 239000002253 acid Substances 0.000 title 1
- -1 naphthyl radical Chemical class 0.000 abstract 4
- RGLYKWWBQGJZGM-ZCXUNETKSA-N 4-[(z)-4-(4-hydroxyphenyl)hex-3-en-3-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(/CC)=C(/CC)C1=CC=C(O)C=C1 RGLYKWWBQGJZGM-ZCXUNETKSA-N 0.000 abstract 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 abstract 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 2
- JLTDJTHDQAWBAV-UHFFFAOYSA-N N,N-dimethylaniline Chemical compound CN(C)C1=CC=CC=C1 JLTDJTHDQAWBAV-UHFFFAOYSA-N 0.000 abstract 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- MWKFXSUHUHTGQN-UHFFFAOYSA-N decan-1-ol Chemical compound CCCCCCCCCCO MWKFXSUHUHTGQN-UHFFFAOYSA-N 0.000 abstract 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract 2
- OARRHUQTFTUEOS-UHFFFAOYSA-N safranin Chemical compound [Cl-].C=12C=C(N)C(C)=CC2=NC2=CC(C)=C(N)C=C2[N+]=1C1=CC=CC=C1 OARRHUQTFTUEOS-UHFFFAOYSA-N 0.000 abstract 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 abstract 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 abstract 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 abstract 1
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 abstract 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract 1
- 229910002651 NO3 Inorganic materials 0.000 abstract 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 abstract 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 abstract 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 1
- 239000003929 acidic solution Substances 0.000 abstract 1
- 125000003545 alkoxy group Chemical group 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 abstract 1
- 150000001450 anions Chemical class 0.000 abstract 1
- QAOWNCQODCNURD-UHFFFAOYSA-M bisulphate group Chemical group S([O-])(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-M 0.000 abstract 1
- JFEVWPNAOCPRHQ-UHFFFAOYSA-N chembl1316021 Chemical compound OC1=CC=CC=C1N=NC1=CC=CC=C1O JFEVWPNAOCPRHQ-UHFFFAOYSA-N 0.000 abstract 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 abstract 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- QUPDWYMUPZLYJZ-UHFFFAOYSA-N ethyl Chemical compound C[CH2] QUPDWYMUPZLYJZ-UHFFFAOYSA-N 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- 229910017604 nitric acid Inorganic materials 0.000 abstract 1
- JDBKXCSZIPHUBR-UHFFFAOYSA-N oxirane;sulfuric acid Chemical compound C1CO1.OS(O)(=O)=O JDBKXCSZIPHUBR-UHFFFAOYSA-N 0.000 abstract 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 abstract 1
- 229910052700 potassium Inorganic materials 0.000 abstract 1
- 239000011591 potassium Substances 0.000 abstract 1
- 229910052708 sodium Inorganic materials 0.000 abstract 1
- 239000011734 sodium Substances 0.000 abstract 1
- XZTJQQLJJCXOLP-UHFFFAOYSA-M sodium;decyl sulfate Chemical compound [Na+].CCCCCCCCCCOS([O-])(=O)=O XZTJQQLJJCXOLP-UHFFFAOYSA-M 0.000 abstract 1
- 125000001424 substituent group Chemical group 0.000 abstract 1
- 229910021653 sulphate ion Inorganic materials 0.000 abstract 1
- 239000001117 sulphuric acid Substances 0.000 abstract 1
- 235000011149 sulphuric acid Nutrition 0.000 abstract 1
- 239000000080 wetting agent Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
736,252. Electrodeposition of copper. UDYLITE CORPORATION. May 18, 1953 [May 26, 1952], No. 13949/53. Class 41. A bath for the electrodeposition of copper comprises an aqueous acidic solution of copper sulphate and/or copper nitrate containing a minor proportion of at least one compound of the general formula where R1 and R2 may be the same or different and each represents a hydrogen atom or a methyl or ethyl radical, X represents an anion and Z represents a phenyl or naphthyl radical which may carry one or more hydroxy, alkoxy, amino or alkyl substituted amino substituent groups. X may be a chloride, bromide, iodide, fluoride, sulphate, bisulphate, nitrate, formate, acetate or propionate anion. Examples of compounds which may be used are diethyl safranine azo dimethyl aniline, diethyl safranine azo phenol, safranine azo naphthol, Janus Gray (Schultz No. 284), and dimethyl safranine azo dimethyl aniline. The bath contains sulphuric acid, nitric acid or phosphoric acid, and may also contain sodium, potassium or ammonium ions. The bath preferably contains chloride, bromide or iodide ions. Wetting agents such as sodium decyl sulphate and the sulphate mono-ethylene oxide condensate of decyl alcohol may be present. Specification 736,230 is referred to.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US290091A US2707166A (en) | 1952-05-26 | 1952-05-26 | Electrodeposition of copper from an acid bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB736252A true GB736252A (en) | 1955-09-07 |
Family
ID=23114498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB13949/53A Expired GB736252A (en) | 1952-05-26 | 1953-05-18 | Improvements in electrodeposition of copper from an acid bath |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US2707166A (en) |
| BE (1) | BE520209A (en) |
| DE (1) | DE947656C (en) |
| FR (1) | FR1077492A (en) |
| GB (1) | GB736252A (en) |
| NL (2) | NL83873C (en) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE934508C (en) * | 1954-04-23 | 1955-10-27 | Dehydag Gmbh | Process for the production of galvanic metal coatings |
| US2738318A (en) * | 1954-12-28 | 1956-03-13 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
| US2882209A (en) * | 1957-05-20 | 1959-04-14 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
| NL291575A (en) * | 1962-04-16 | |||
| US3288690A (en) * | 1962-04-16 | 1966-11-29 | Udylite Corp | Electrodeposition of copper from acidic baths |
| US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
| DE2039831C3 (en) * | 1970-06-06 | 1979-09-06 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Acid bath for the galvanic deposition of shiny copper coatings |
| US4316778A (en) * | 1980-09-24 | 1982-02-23 | Rca Corporation | Method for the manufacture of recording substrates for capacitance electronic discs |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
| AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
| US4551212A (en) * | 1985-03-11 | 1985-11-05 | Rca Corporation | Bath and process for the electrodeposition of micromachinable copper and additive for said bath |
| US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
| US6709568B2 (en) | 2002-06-13 | 2004-03-23 | Advanced Technology Materials, Inc. | Method for determining concentrations of additives in acid copper electrochemical deposition baths |
| US20060266648A1 (en) * | 2002-12-17 | 2006-11-30 | King Mackenzie E | Process analyzer for monitoring electrochemical deposition solutions |
| DE10261852B3 (en) | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling |
| US20050067304A1 (en) * | 2003-09-26 | 2005-03-31 | King Mackenzie E. | Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism |
| DE10354860B4 (en) * | 2003-11-19 | 2008-06-26 | Atotech Deutschland Gmbh | Halogenated or pseudohalogenated monomeric phenazinium compounds, process for their preparation and acid bath containing these compounds and process for the electrolytic deposition of a copper precipitate |
| US20050109624A1 (en) * | 2003-11-25 | 2005-05-26 | Mackenzie King | On-wafer electrochemical deposition plating metrology process and apparatus |
| US20050224370A1 (en) * | 2004-04-07 | 2005-10-13 | Jun Liu | Electrochemical deposition analysis system including high-stability electrode |
| US6984299B2 (en) * | 2004-04-27 | 2006-01-10 | Advanced Technology Material, Inc. | Methods for determining organic component concentrations in an electrolytic solution |
| US7435320B2 (en) | 2004-04-30 | 2008-10-14 | Advanced Technology Materials, Inc. | Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions |
| US7427346B2 (en) * | 2004-05-04 | 2008-09-23 | Advanced Technology Materials, Inc. | Electrochemical drive circuitry and method |
| DE102005011708B3 (en) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate |
| ES2761883T3 (en) | 2017-06-16 | 2020-05-21 | Atotech Deutschland Gmbh | Aqueous acid copper electroplating bath and method for electrolytically depositing a copper coating |
| PT3483307T (en) | 2017-11-09 | 2020-07-03 | Atotech Deutschland Gmbh | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2291590A (en) * | 1940-03-11 | 1942-07-28 | Harshaw Chem Corp | Electrodeposition of metals |
| US2326999A (en) * | 1940-03-11 | 1943-08-17 | Harshaw Chem Corp | Nickel plating |
| US2489538A (en) * | 1941-05-24 | 1949-11-29 | Gen Motors Corp | Electrodeposition of copper |
| US2563360A (en) * | 1941-05-24 | 1951-08-07 | Gen Motors Corp | Electrodeposition of copper |
| USRE24253E (en) * | 1948-05-11 | 1956-12-11 | Method of producing a composite liquid |
-
0
- NL NLAANVRAGE7804190,A patent/NL178453B/en unknown
- BE BE520209D patent/BE520209A/xx unknown
- NL NL83873D patent/NL83873C/xx active
-
1952
- 1952-05-26 US US290091A patent/US2707166A/en not_active Expired - Lifetime
-
1953
- 1953-05-18 GB GB13949/53A patent/GB736252A/en not_active Expired
- 1953-05-21 FR FR1077492D patent/FR1077492A/en not_active Expired
- 1953-05-23 DE DEU2199A patent/DE947656C/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE947656C (en) | 1956-08-23 |
| US2707166A (en) | 1955-04-26 |
| BE520209A (en) | |
| NL83873C (en) | |
| NL178453B (en) | |
| FR1077492A (en) | 1954-11-08 |
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