NL178453B - PROCEDURE FOR ELECTROSTATIC COPYING. - Google Patents
PROCEDURE FOR ELECTROSTATIC COPYING.Info
- Publication number
- NL178453B NL178453B NLAANVRAGE7804190,A NL178453DA NL178453B NL 178453 B NL178453 B NL 178453B NL 178453D A NL178453D A NL 178453DA NL 178453 B NL178453 B NL 178453B
- Authority
- NL
- Netherlands
- Prior art keywords
- procedure
- electrostatic copying
- copying
- electrostatic
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US290091A US2707166A (en) | 1952-05-26 | 1952-05-26 | Electrodeposition of copper from an acid bath |
Publications (1)
Publication Number | Publication Date |
---|---|
NL178453B true NL178453B (en) |
Family
ID=23114498
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NLAANVRAGE7804190,A NL178453B (en) | 1952-05-26 | PROCEDURE FOR ELECTROSTATIC COPYING. | |
NL83873D NL83873C (en) | 1952-05-26 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
NL83873D NL83873C (en) | 1952-05-26 |
Country Status (6)
Country | Link |
---|---|
US (1) | US2707166A (en) |
BE (1) | BE520209A (en) |
DE (1) | DE947656C (en) |
FR (1) | FR1077492A (en) |
GB (1) | GB736252A (en) |
NL (2) | NL83873C (en) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE934508C (en) * | 1954-04-23 | 1955-10-27 | Dehydag Gmbh | Process for the production of galvanic metal coatings |
US2738318A (en) * | 1954-12-28 | 1956-03-13 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
US2882209A (en) * | 1957-05-20 | 1959-04-14 | Udylite Res Corp | Electrodeposition of copper from an acid bath |
NL291575A (en) * | 1962-04-16 | |||
US3288690A (en) * | 1962-04-16 | 1966-11-29 | Udylite Corp | Electrodeposition of copper from acidic baths |
US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
DE2028803C3 (en) * | 1970-06-06 | 1980-08-14 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Polymeric phenazonium compounds |
US4316778A (en) * | 1980-09-24 | 1982-02-23 | Rca Corporation | Method for the manufacture of recording substrates for capacitance electronic discs |
US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
US4469564A (en) * | 1982-08-11 | 1984-09-04 | At&T Bell Laboratories | Copper electroplating process |
AU554236B2 (en) * | 1983-06-10 | 1986-08-14 | Omi International Corp. | Electrolyte composition and process for electrodepositing copper |
US4551212A (en) * | 1985-03-11 | 1985-11-05 | Rca Corporation | Bath and process for the electrodeposition of micromachinable copper and additive for said bath |
US7264698B2 (en) | 1999-04-13 | 2007-09-04 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US7438788B2 (en) | 1999-04-13 | 2008-10-21 | Semitool, Inc. | Apparatus and methods for electrochemical processing of microelectronic workpieces |
US6709568B2 (en) | 2002-06-13 | 2004-03-23 | Advanced Technology Materials, Inc. | Method for determining concentrations of additives in acid copper electrochemical deposition baths |
US20060266648A1 (en) * | 2002-12-17 | 2006-11-30 | King Mackenzie E | Process analyzer for monitoring electrochemical deposition solutions |
DE10261852B3 (en) | 2002-12-20 | 2004-06-03 | Atotech Deutschland Gmbh | Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling |
US20050067304A1 (en) * | 2003-09-26 | 2005-03-31 | King Mackenzie E. | Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism |
DE10354860B4 (en) * | 2003-11-19 | 2008-06-26 | Atotech Deutschland Gmbh | Halogenated or pseudohalogenated monomeric phenazinium compounds, process for their preparation and acid bath containing these compounds and process for the electrolytic deposition of a copper precipitate |
US20050109624A1 (en) * | 2003-11-25 | 2005-05-26 | Mackenzie King | On-wafer electrochemical deposition plating metrology process and apparatus |
US20050224370A1 (en) * | 2004-04-07 | 2005-10-13 | Jun Liu | Electrochemical deposition analysis system including high-stability electrode |
US6984299B2 (en) * | 2004-04-27 | 2006-01-10 | Advanced Technology Material, Inc. | Methods for determining organic component concentrations in an electrolytic solution |
US7435320B2 (en) | 2004-04-30 | 2008-10-14 | Advanced Technology Materials, Inc. | Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions |
US7427346B2 (en) * | 2004-05-04 | 2008-09-23 | Advanced Technology Materials, Inc. | Electrochemical drive circuitry and method |
DE102005011708B3 (en) | 2005-03-11 | 2007-03-01 | Atotech Deutschland Gmbh | A polyvinylammonium compound and process for the production thereof, and an acidic solution containing the compound and a process for electrolytically depositing a copper precipitate |
EP3415664B1 (en) | 2017-06-16 | 2019-09-18 | ATOTECH Deutschland GmbH | Aqueous acidic copper electroplating bath and method for electrolytically depositing of a copper coating |
ES2800292T3 (en) | 2017-11-09 | 2020-12-29 | Atotech Deutschland Gmbh | Electrodeposition compositions for the electrodeposition of copper, their use and a method for electrolytically depositing a layer of copper or copper alloy on at least one surface of a substrate |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2291590A (en) * | 1940-03-11 | 1942-07-28 | Harshaw Chem Corp | Electrodeposition of metals |
US2326999A (en) * | 1940-03-11 | 1943-08-17 | Harshaw Chem Corp | Nickel plating |
US2563360A (en) * | 1941-05-24 | 1951-08-07 | Gen Motors Corp | Electrodeposition of copper |
US2489538A (en) * | 1941-05-24 | 1949-11-29 | Gen Motors Corp | Electrodeposition of copper |
USRE24253E (en) * | 1948-05-11 | 1956-12-11 | Method of producing a composite liquid |
-
0
- NL NLAANVRAGE7804190,A patent/NL178453B/en unknown
- BE BE520209D patent/BE520209A/xx unknown
- NL NL83873D patent/NL83873C/xx active
-
1952
- 1952-05-26 US US290091A patent/US2707166A/en not_active Expired - Lifetime
-
1953
- 1953-05-18 GB GB13949/53A patent/GB736252A/en not_active Expired
- 1953-05-21 FR FR1077492D patent/FR1077492A/en not_active Expired
- 1953-05-23 DE DEU2199A patent/DE947656C/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
DE947656C (en) | 1956-08-23 |
NL83873C (en) | |
GB736252A (en) | 1955-09-07 |
FR1077492A (en) | 1954-11-08 |
BE520209A (en) | |
US2707166A (en) | 1955-04-26 |
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