GB736230A - Improvements in or relating to the electrodeposition of copper - Google Patents

Improvements in or relating to the electrodeposition of copper

Info

Publication number
GB736230A
GB736230A GB28755/52A GB2875552A GB736230A GB 736230 A GB736230 A GB 736230A GB 28755/52 A GB28755/52 A GB 28755/52A GB 2875552 A GB2875552 A GB 2875552A GB 736230 A GB736230 A GB 736230A
Authority
GB
United Kingdom
Prior art keywords
thiourea
safranine
copper
azo
bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB28755/52A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Udylite Corp
Original Assignee
Udylite Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Udylite Corp filed Critical Udylite Corp
Publication of GB736230A publication Critical patent/GB736230A/en
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

736,230. Electrodeposition of copper. UDYLITE CORPORATION. Nov. 14, 1952 [May 26, 1952], No. 28755/52. Class 41. A bath for the electrodeposition of copper comprises an aqueous acidic solution of one or more copper salts, and contains at least one thiourea and at least one safranine or azosafranine. The thiourea may be thiourea itself or a bath-soluble thiourea substituted solely at either or each of the nitrogen atoms by a monovalent substituent ; examples are N- acetyl thiourea, N-propionyl thiourea, N-trifluoracetyl thiourea, N-pentafluoropropionyl thiourea, N-2-furfuroyl thiourea, N: N<1>-dimethyl thiourea, and N-cyanoacetyl thiourea. The safranine may be phenosafranine, tolusafranine, fuchsia, amethyst violet, mauveine, diethyl safranine, and dimethyl safranine. The azosafranine may be a compound having the general formula wherein R11 and R2 are the same or different and may be hydrogen, methyl or ethyl radicals ; X may be chloride, bromide, iodide, fluoride, sulphate, bisulphate, nitrate, formate, acetate or propionate anion ; and Z may be a phenyl or naphthyl radical which may carry one or more hydroxy, alkoxy, amino and alkyl-amino substituent groups. Examples of azosafranines are diethyl-safranine-azo-dimethylaniline (Janus Green B), diethyl-safranine-azo-phenol (Janus Black), safranine-azo-#-naphthol (Janus Blue), and dimethyl - safranine - azo - dimethylaniline. The copper salt may be copper sulphate or nitrate, and the bath may contain sulphuric, nitric or phosphoric acid. Wetting agents such as sodium decyl sulphate and the sodium salt of sulphated monoethylene glycol ether of decyl alcohol, may be included. A copper deposit obtained by use of the bath may be coated with chromium or with nickel and then with chromium. Specification 736,252 is referred to.
GB28755/52A 1952-05-26 1952-11-14 Improvements in or relating to the electrodeposition of copper Expired GB736230A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US290092A US2707167A (en) 1952-05-26 1952-05-26 Electrodeposition of copper from an acid bath

Publications (1)

Publication Number Publication Date
GB736230A true GB736230A (en) 1955-09-07

Family

ID=23114503

Family Applications (1)

Application Number Title Priority Date Filing Date
GB28755/52A Expired GB736230A (en) 1952-05-26 1952-11-14 Improvements in or relating to the electrodeposition of copper

Country Status (6)

Country Link
US (1) US2707167A (en)
BE (1) BE520210A (en)
DE (1) DE1004880B (en)
FR (1) FR1071247A (en)
GB (1) GB736230A (en)
NL (2) NL75967C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111074306A (en) * 2020-01-02 2020-04-28 江苏矽智半导体科技有限公司 Copper pillar electroplating solution suitable for ultrahigh current density and electroplating method

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2805193A (en) * 1955-07-18 1957-09-03 John F Beaver Bright copper plating
US2805194A (en) * 1955-07-18 1957-09-03 Dayton Bright Copper Company Bright copper plating
BE565994A (en) * 1957-04-16
US3288690A (en) * 1962-04-16 1966-11-29 Udylite Corp Electrodeposition of copper from acidic baths
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
DE2028803C3 (en) * 1970-06-06 1980-08-14 Schering Ag, 1000 Berlin Und 4619 Bergkamen Polymeric phenazonium compounds
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
DE10261852B3 (en) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US20070261963A1 (en) * 2006-02-02 2007-11-15 Advanced Technology Materials, Inc. Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutions
US8691987B2 (en) * 2010-09-24 2014-04-08 Andrew M. Krol Method of producing polymeric phenazonium compounds

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2291590A (en) * 1940-03-11 1942-07-28 Harshaw Chem Corp Electrodeposition of metals
US2326999A (en) * 1940-03-11 1943-08-17 Harshaw Chem Corp Nickel plating
USRE24253E (en) * 1948-05-11 1956-12-11 Method of producing a composite liquid

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111074306A (en) * 2020-01-02 2020-04-28 江苏矽智半导体科技有限公司 Copper pillar electroplating solution suitable for ultrahigh current density and electroplating method

Also Published As

Publication number Publication date
NL75967C (en)
BE520210A (en)
DE1004880B (en) 1957-03-21
US2707167A (en) 1955-04-26
NL174178B (en)
FR1071247A (en) 1954-08-27

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