NL75967C - - Google Patents

Info

Publication number
NL75967C
NL75967C NL75967DA NL75967C NL 75967 C NL75967 C NL 75967C NL 75967D A NL75967D A NL 75967DA NL 75967 C NL75967 C NL 75967C
Authority
NL
Netherlands
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL75967C publication Critical patent/NL75967C/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
NL75967D 1952-05-26 NL75967C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US290092A US2707167A (en) 1952-05-26 1952-05-26 Electrodeposition of copper from an acid bath

Publications (1)

Publication Number Publication Date
NL75967C true NL75967C (en)

Family

ID=23114503

Family Applications (2)

Application Number Title Priority Date Filing Date
NL75967D NL75967C (en) 1952-05-26
NLAANVRAGE7711060,A NL174178B (en) 1952-05-26 PROCEDURE FOR THE RECOVERY OF HYDROCARBONS FROM A PERMEABLE HYDROCARBON FORMATION BY INJECTION WITH STEAM.

Family Applications After (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7711060,A NL174178B (en) 1952-05-26 PROCEDURE FOR THE RECOVERY OF HYDROCARBONS FROM A PERMEABLE HYDROCARBON FORMATION BY INJECTION WITH STEAM.

Country Status (6)

Country Link
US (1) US2707167A (en)
BE (1) BE520210A (en)
DE (1) DE1004880B (en)
FR (1) FR1071247A (en)
GB (1) GB736230A (en)
NL (2) NL174178B (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2805194A (en) * 1955-07-18 1957-09-03 Dayton Bright Copper Company Bright copper plating
US2805193A (en) * 1955-07-18 1957-09-03 John F Beaver Bright copper plating
BE565994A (en) * 1957-04-16
US3288690A (en) * 1962-04-16 1966-11-29 Udylite Corp Electrodeposition of copper from acidic baths
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
DE2039831C3 (en) * 1970-06-06 1979-09-06 Schering Ag, 1000 Berlin Und 4619 Bergkamen Acid bath for the galvanic deposition of shiny copper coatings
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
AU554236B2 (en) * 1983-06-10 1986-08-14 Omi International Corp. Electrolyte composition and process for electrodepositing copper
US6709568B2 (en) 2002-06-13 2004-03-23 Advanced Technology Materials, Inc. Method for determining concentrations of additives in acid copper electrochemical deposition baths
DE10261852B3 (en) * 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
US20050067304A1 (en) * 2003-09-26 2005-03-31 King Mackenzie E. Electrode assembly for analysis of metal electroplating solution, comprising self-cleaning mechanism, plating optimization mechanism, and/or voltage limiting mechanism
US20050109624A1 (en) * 2003-11-25 2005-05-26 Mackenzie King On-wafer electrochemical deposition plating metrology process and apparatus
US20050224370A1 (en) * 2004-04-07 2005-10-13 Jun Liu Electrochemical deposition analysis system including high-stability electrode
US6984299B2 (en) * 2004-04-27 2006-01-10 Advanced Technology Material, Inc. Methods for determining organic component concentrations in an electrolytic solution
US7435320B2 (en) 2004-04-30 2008-10-14 Advanced Technology Materials, Inc. Methods and apparatuses for monitoring organic additives in electrochemical deposition solutions
US7427346B2 (en) * 2004-05-04 2008-09-23 Advanced Technology Materials, Inc. Electrochemical drive circuitry and method
US20070261963A1 (en) * 2006-02-02 2007-11-15 Advanced Technology Materials, Inc. Simultaneous inorganic, organic and byproduct analysis in electrochemical deposition solutions
US8691987B2 (en) * 2010-09-24 2014-04-08 Andrew M. Krol Method of producing polymeric phenazonium compounds
CN111074306B (en) * 2020-01-02 2020-10-27 江苏矽智半导体科技有限公司 Copper pillar electroplating solution suitable for ultrahigh current density and electroplating method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2291590A (en) * 1940-03-11 1942-07-28 Harshaw Chem Corp Electrodeposition of metals
US2326999A (en) * 1940-03-11 1943-08-17 Harshaw Chem Corp Nickel plating
USRE24253E (en) * 1948-05-11 1956-12-11 Method of producing a composite liquid

Also Published As

Publication number Publication date
BE520210A (en)
GB736230A (en) 1955-09-07
FR1071247A (en) 1954-08-27
NL174178B (en)
DE1004880B (en) 1957-03-21
US2707167A (en) 1955-04-26

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