ES410196A1 - Electroless copper plating solution and process - Google Patents
Electroless copper plating solution and processInfo
- Publication number
- ES410196A1 ES410196A1 ES72410196A ES410196A ES410196A1 ES 410196 A1 ES410196 A1 ES 410196A1 ES 72410196 A ES72410196 A ES 72410196A ES 410196 A ES410196 A ES 410196A ES 410196 A1 ES410196 A1 ES 410196A1
- Authority
- ES
- Spain
- Prior art keywords
- plating solution
- copper plating
- electroless copper
- copper
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 2
- 229910052802 copper Inorganic materials 0.000 title abstract 2
- 239000010949 copper Substances 0.000 title abstract 2
- 238000007747 plating Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- -1 iodide ions Chemical class 0.000 abstract 2
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 1
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 abstract 1
- 239000003929 acidic solution Substances 0.000 abstract 1
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 229910001431 copper ion Inorganic materials 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 229920001515 polyalkylene glycol Polymers 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
A plating solution suitable for the electroless deposition of copper on ferrous metal surfaces which comprises an aqueous acidic solution containing copper ions chloride, bromide, or iodide ions a polyalkylene glycol and a tertiary amine compound of the structure: Ra - N [(CH2)n R']b WHEREIN:
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US23430272A | 1972-03-13 | 1972-03-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES410196A1 true ES410196A1 (en) | 1976-01-01 |
Family
ID=22880806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES72410196A Expired ES410196A1 (en) | 1972-03-13 | 1972-12-29 | Electroless copper plating solution and process |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3793037A (en) |
| JP (1) | JPS5518782B2 (en) |
| AR (1) | AR197980A1 (en) |
| AU (1) | AU467404B2 (en) |
| BE (1) | BE793376A (en) |
| CA (1) | CA989105A (en) |
| ES (1) | ES410196A1 (en) |
| FR (1) | FR2175729B1 (en) |
| GB (1) | GB1373895A (en) |
| ZA (1) | ZA731439B (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4981725A (en) * | 1972-07-11 | 1991-01-01 | Amp-Akzo Corporation | Process and composition for sensitizing articles for metallization |
| US4259113A (en) * | 1976-05-26 | 1981-03-31 | Kollmorgen Technologies Corporation | Composition for sensitizing articles for metallization |
| JPS52144901A (en) * | 1976-05-28 | 1977-12-02 | Shin Shirasuna Electric Corp | Device for monitoring power supply voltage |
| JPS546731U (en) * | 1977-06-16 | 1979-01-17 | ||
| JPS645617Y2 (en) * | 1981-05-29 | 1989-02-13 | ||
| US4758025A (en) * | 1985-06-18 | 1988-07-19 | Mobil Oil Corporation | Use of electroless metal coating to prevent galling of threaded tubular joints |
| KR960003723B1 (en) * | 1986-05-19 | 1996-03-21 | 하라마 카세이 고오교오 가부시끼가이샤 | Method for forming a metal film on the surface of a substrate metal |
| JPH0332385U (en) * | 1989-08-07 | 1991-03-28 | ||
| DE4440299A1 (en) * | 1994-11-11 | 1996-05-15 | Metallgesellschaft Ag | Process for the electroless deposition of copper coatings on iron and iron alloy surfaces |
| GB0031806D0 (en) * | 2000-12-29 | 2001-02-07 | Chemetall Plc | Electroless copper plating of ferrous metal substrates |
| AU2002248343A1 (en) * | 2001-01-12 | 2002-08-19 | University Of Rochester | Methods and systems for electro-or electroless-plating of metal in high-aspect ratio features |
| JP2009001872A (en) * | 2007-06-22 | 2009-01-08 | Kobe Steel Ltd | Copper-plating method of wire-like material, and copper-plated wire |
| BR112013003430A2 (en) * | 2010-08-17 | 2016-06-21 | Chemetall Gmbh | "process for covering metallic substrates without electric current." |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2049517A (en) * | 1934-06-06 | 1936-08-04 | American Chem Paint Co | Method of and material for inhibiting or retarding acid corrosion of ferrous metals |
| US2217921A (en) * | 1938-03-23 | 1940-10-15 | American Chem Paint Co | Art of drawing ferrous metal |
| US3141780A (en) * | 1962-03-30 | 1964-07-21 | Minnesota Mining & Mfg | Copper coating compositions |
-
0
- BE BE793376D patent/BE793376A/en unknown
-
1972
- 1972-03-13 US US3793037D patent/US3793037A/en not_active Expired - Lifetime
- 1972-11-22 FR FR7241497A patent/FR2175729B1/fr not_active Expired
- 1972-12-29 ES ES72410196A patent/ES410196A1/en not_active Expired
-
1973
- 1973-02-28 CA CA164,876A patent/CA989105A/en not_active Expired
- 1973-02-28 AU AU52697/73A patent/AU467404B2/en not_active Expired
- 1973-03-01 ZA ZA731439A patent/ZA731439B/en unknown
- 1973-03-09 GB GB1147673A patent/GB1373895A/en not_active Expired
- 1973-03-12 JP JP2890973A patent/JPS5518782B2/ja not_active Expired
- 1973-03-13 AR AR24702373A patent/AR197980A1/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JPS492726A (en) | 1974-01-11 |
| BE793376A (en) | 1973-04-16 |
| AU467404B2 (en) | 1975-11-27 |
| GB1373895A (en) | 1974-11-13 |
| FR2175729B1 (en) | 1976-08-20 |
| ZA731439B (en) | 1973-11-28 |
| CA989105A (en) | 1976-05-18 |
| AR197980A1 (en) | 1974-05-24 |
| FR2175729A1 (en) | 1973-10-26 |
| AU5269773A (en) | 1974-08-29 |
| US3793037A (en) | 1974-02-19 |
| JPS5518782B2 (en) | 1980-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES410196A1 (en) | Electroless copper plating solution and process | |
| ES8500969A1 (en) | Improved process for the polymerization of epoxides. | |
| FR2476151B1 (en) | ELECTROLYTIC COPPER DEPOSITION BATHS, CONTAINING A SUBSTITUTED RADICAL PHTHALOCYANIN SHINE COMPOUND | |
| EP0172835A4 (en) | Fixation of dissolved metal species with a complexing agent. | |
| IT1019175B (en) | PROCEDURE FOR THE DESULPHORATION OF FERROUS METALS | |
| GB1548170A (en) | Non-cyanide silver bath | |
| IT1010855B (en) | SEALING RINSING FOR PHOSPHATING COATINGS ON METALS | |
| IT8219228A0 (en) | PROCESS FOR THE PHOSPHATING OF METALS. | |
| FR2331626A1 (en) | METHOD AND CATHODE FOR THE ELECTROLYSIS OF ALKALINE METAL CHLORIDE | |
| IT8448353A0 (en) | WATER-SOLUBLE LUBRICANT COMPOSITION FOR METAL PROCESSING | |
| IT8348039A0 (en) | METAL HARDENING PROCESS | |
| IT1063937B (en) | PROCEDURE FOR SELECTIVE GALVANIC METAL DEPOSITION | |
| GB2151071B (en) | Liquid metal ion source | |
| SE7501792L (en) | ||
| US4701350B1 (en) | Process for electroless metal deposition | |
| SE8106867L (en) | ELECTROLYTIC PROPOSAL OF PALLADIUM AND PALLADIUM ALLOYS | |
| ATE71377T1 (en) | CYANATE ELIMINATION FROM PERGOLIDE INTERMEDIATE. | |
| AT321052B (en) | Alkaline, aqueous bath for the electroless deposition of ductile copper | |
| GB2150745B (en) | Liquid metal ion source | |
| ES386925A1 (en) | Electroless copper plating solution and process | |
| GB1185618A (en) | A Process for the Manufacture of Isoindole Derivatives | |
| DE3671452D1 (en) | TECHNETIUM ARENE COMPLEXES AND METHOD. | |
| FR2463823B1 (en) | METHODS AND COMPOSITIONS FOR THE ELECTROLYTIC DEPOSITION OF PALLADIUM USING A SOURCE OF FREE NITRITE IONS | |
| IT1068540B (en) | PROCEDURE FOR THE MAINTENANCE OF AQUEOUS METAL HYDROXIDE AQUEOUS SOLUTIONS, AT HIGH CONCENTRATION OF ALKALINE METAL HALIDE | |
| IL41090A (en) | A process of making a roughing or intermittent cut upon a ferrous metal work piece |