ES386925A1 - Electroless copper plating solution and process - Google Patents

Electroless copper plating solution and process

Info

Publication number
ES386925A1
ES386925A1 ES386925A ES386925A ES386925A1 ES 386925 A1 ES386925 A1 ES 386925A1 ES 386925 A ES386925 A ES 386925A ES 386925 A ES386925 A ES 386925A ES 386925 A1 ES386925 A1 ES 386925A1
Authority
ES
Spain
Prior art keywords
ions
carbon atoms
alkyl group
group containing
metal surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES386925A
Other languages
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STE CONTINENTALE PARKER
Original Assignee
STE CONTINENTALE PARKER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STE CONTINENTALE PARKER filed Critical STE CONTINENTALE PARKER
Publication of ES386925A1 publication Critical patent/ES386925A1/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Lubricants (AREA)
  • Chemical Treatment Of Metals (AREA)

Abstract

Procedure for chemically coppering ferrous surfaces, characterized in that the ferrous metal surface to be coated is treated with an aqueous acidic solution comprising copper ions, halide ions, chosen from chloride, bromide and iodide ions, a polyalkylene glycol, and a compound of dianiline of formula X ** (See formula) ** where R is an alkyl group containing from about 1 to 6 approximately straight or branched carbon atoms, R'is an alkyl group containing from about 1 to 4 approximately straight chain or branched carbon atoms, X is a halogen it is already a number from 0 to 2, and this solution is kept in contact with the ferrous metal surface for a sufficient time to effect the formation of a copper coating. (Machine-translation by Google Translate, not legally binding)
ES386925A 1969-12-30 1970-12-30 Electroless copper plating solution and process Expired ES386925A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US88930969A 1969-12-30 1969-12-30

Publications (1)

Publication Number Publication Date
ES386925A1 true ES386925A1 (en) 1973-04-16

Family

ID=25394885

Family Applications (1)

Application Number Title Priority Date Filing Date
ES386925A Expired ES386925A1 (en) 1969-12-30 1970-12-30 Electroless copper plating solution and process

Country Status (13)

Country Link
US (1) US3664852A (en)
JP (1) JPS491130B1 (en)
AT (1) AT298928B (en)
BE (1) BE759316A (en)
CA (1) CA922056A (en)
CH (1) CH536881A (en)
DE (1) DE2055085A1 (en)
ES (1) ES386925A1 (en)
FR (1) FR2071915A5 (en)
GB (1) GB1280260A (en)
NL (1) NL7018320A (en)
SE (1) SE363853B (en)
ZA (1) ZA706968B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2053860C3 (en) * 1970-10-29 1980-11-06 Schering Ag Acid aqueous bath for the galvanic deposition of shiny copper coatings
ES529705A0 (en) * 1983-02-21 1984-11-01 Rca Corp IMPROVEMENTS INTRODUCED IN AN IMAGE SIZE CONTROL CIRCUIT FOR A VISUAL PRESENTATION DEVICE
US7297190B1 (en) * 2006-06-28 2007-11-20 Lam Research Corporation Plating solutions for electroless deposition of copper
JP2009001872A (en) * 2007-06-22 2009-01-08 Kobe Steel Ltd Copper-plating method of wire-like material, and copper-plated wire
JP6270681B2 (en) * 2014-09-29 2018-01-31 学校法人 関西大学 Wiring structure manufacturing method, copper displacement plating solution, and wiring structure
US20230063860A1 (en) * 2021-08-24 2023-03-02 ACS ENTERPRISES, LLC d/b/a AMERICAN CHEMICAL Copper treatment additive
CN114106595B (en) * 2021-11-08 2023-05-12 凯明(常州)新材料科技有限公司 Surface treatment method of steel wire for needle bearing

Also Published As

Publication number Publication date
AT298928B (en) 1972-05-25
BE759316A (en) 1971-04-30
DE2055085A1 (en) 1971-07-01
GB1280260A (en) 1972-07-05
NL7018320A (en) 1971-07-02
SE363853B (en) 1974-02-04
ZA706968B (en) 1971-07-28
US3664852A (en) 1972-05-23
CA922056A (en) 1973-03-06
JPS491130B1 (en) 1974-01-11
CH536881A (en) 1973-05-15
FR2071915A5 (en) 1971-09-17

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