US3664852A - Electroless copper plating solution and process - Google Patents
Electroless copper plating solution and process Download PDFInfo
- Publication number
- US3664852A US3664852A US889309A US3664852DA US3664852A US 3664852 A US3664852 A US 3664852A US 889309 A US889309 A US 889309A US 3664852D A US3664852D A US 3664852DA US 3664852 A US3664852 A US 3664852A
- Authority
- US
- United States
- Prior art keywords
- copper
- solution
- bath
- ions
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/12917—Next to Fe-base component
Definitions
- a plating solution suitable for the electroless deposisition of copper on ferrous metal surfaces which comprises an aqueous acidic solution containing copper ions; chloride, bromide, or iodide ions; a polyalkylene glycol; and a dianiline compound of the structure:
- R a RIB NH: N H2 This invention relates to a novel composition and process for the treatment of metal surfaces and more particularly it relates to a composition and process for the electroless copper plating of ferrous metal surfaces.
- compositions and processes which have heretofore been developed have been generally satisfactory, some difficulties have been encountered where different types and grades of ferrous metal surfaces have been treated.
- variations in the type of ferrous metal being treated have resulted in similar variations in the quality of the copper coating which has been produced.
- these copper coating solutions have been used for treating steel wire, prior to wire drawing operations, it has often been found to be difficult to consistently obtain a bright, adherent coating.
- the compositions of the prior art have had a relatively low tolerance for ferrous iron.
- adherent copper coatings may be obtained on a variety of ferrous metal surfaces, without the use of electric current.
- a further object of the present invention is to provide an improved process for forming a bright, adherent copper coating on a variety of ferrous metal surfaces without the use of electric current.
- Another object of the present invention is to provide an improved composition and process for forming a bright, adherent copper coating on ferrous metal surfaces, which composition and process will tolerate the buildup of appreciable quantities of ferrous iron in the coating solution without adversely affecting the quality of the copper coating which is produced.
- the present invention includes an aqueous acidic solution containing copper ions; halide ions selected from chloride, bromide and iodide ions; a polyalkylene glycol; and a dianiline having the formula:
- R is an alkyl group containing from about 1 to 6 carbon atoms in a straight or branched chain; R is an alkyl group containing from about 1 to 4 carbon atoms in a straight or branched chain;
- X is halogen; and a is a number from 0 to 2; b is 0 or 1.
- the novel plating solutions are aqueous acidic solutions containing copper ions, which solutions desirably have a pH within the range of about 0 to 2, and preferably without the range of about 0.2 to 0.4.
- the copper ions are desirably present in the plating solutions in amounts within the range of about 0.1 to 3.0 percent by weight of the solution and preferably in an amount within the range of about 0.3 to 0.8% by weight of this solution.
- the copper ions may be incorporated in the plating solutions in any suitable form, such as copper metal, and/or various copper salts.
- the bath pH may be maintained within the desired range by the addition of sulfuric acid.
- the aqueous acidic plating baths used contain such sulfate ions, they are typically present in amounts within the range of about 0.1 to 30% by weight of the solution.
- copper salts may also be used as the source of copper ions, such as copper chloride, copper bromide, copper acetate, copper citrate, copper benzoate, copper metaborate, copper butyrate, copper formate, copper sulfamates, and the like, and that other acids may be used for the pH adjustment of the bath. It is to be appreciated, however, that in using such other salts or acids, particularly those containing halide ions, care should be taken that the amounts of such latter ions introduced do not exceed the maximum amounts which can be present in the solution without detrimental effect.
- the plating solutions of the present invention contain halide ions, selected from chloride, bromide, and iodide ions.
- the chloride ions are preferred.
- they are desirably present in amounts within the range of about 0.001 to about 10% by weight of the solution and preferably in amounts within the range of about 0.01 to 0.5%.
- bromide ions are used, they are desirably present in amounts within the range of about 0.001 to by weight and preferably in amounts within the range of about 0.02 to 0.5% by weight of the solution, while the iodide ions, if used, are desirably present in amounts within the range of about 0.001 to 5% by weight and preferably in amounts within the range of about 0.01 to 0.2% by weight of the solution. These are desirably added as the alkali metal salts.
- the polyalkylene glycol used in the plating baths of the present invention desirably has a molecular Weight in excess of about 600 and preferably has a molecular weight within the range of about 1000 to 20,000.
- the amount of the polyalkylene glycol in the treating solutions will vary, depending upon the particular molecular weight of the polyalkylene glycol which is used. In general, it has been found that the higher the molecular weight of the polyalkylene glycol, the lower is the concentration required to produce the desired results in the treating solution.
- the polyalkylene glycol is present in the treating bath in amounts within the range of about 0.001% by weight of the solution up to its saturation concentration in the bath, with amounts within the range of about 0.006 to 1.0% by weight of the solution being preferred, the higher concentrations typically being used with the lower molecular weight materials, and vice versa.
- various polyalkylene glycols may be used, such as polyethylene glycol, polypropylene glycol, polybutylene glycol, and the like. Of these, the polyethylene glycols are generally preferred and, hence, particular reference will be made to these materials hereinafter.
- the plating solutions of the present invention also contain at least one dianiline compound, having the structural formula as has been indicated hereinabove.
- the dianiline compounds used will be present in amounts within the range of about 0.01% by weight of the solution up to their saturation concentration in the solution.
- amounts of the dianiline compound within the range of about 0.005 to 0.1% by weight of the solution will be used.
- dianiline compounds falling within the above-indicated formula may be used to give satisfactory results in the present solutions, in many instances, the preferred dianiline compound has been found to be p,p'-methylene dianiline. Accordingly, primary reference hereinafter will be made to this material. This is not, however, to be taken as a limitation on the dianiline compounds which may be used, but merely as being exemplary of these materials.
- the aqueous acidic plating baths of the present invention are found to give excellent plating results even where the baths contain appreciable quantities of ferrous iron.
- the plating baths of the present invention may also contain ferrous iron ions in amounts up to the saturation point of the ferrous iron in the bath, with amounts of ferrous iron ions within the range of about 5 to grams per liter being typical. Where such typical amounts of ferrous iron are present in the bath, and even where the ferrous iron content is greater than the saturation point of the bath, it is still found that excellent quality copper coatings can be produced.
- the ferrous metal surface to be treated such as a length of steel wire
- this cleaning may include acid pickling, such as with muriatic acid, alkaline cleaning, such as with alkali metal hydroxide and/ or alkali metal permanganate containing cleaners, and may include a combination of several of these cleaning or pretreating steps.
- acid pickling such as with muriatic acid
- alkaline cleaning such as with alkali metal hydroxide and/ or alkali metal permanganate containing cleaners
- these cleaning or pretreating steps Following the cleaning or pretreating of the steel surface, it is brought into contact with the copper plating bath of the present invention.
- various contacting techniques may be utilized such as immersion, spraying, flooding, and the like.
- the ferrous surface treated is steel wire
- the wire is imersed in the copper plating bath.
- the copper plating bath of the present invention is desirably maintained at a temperature within the range of about 15 to 8-5 degrees C. and preferably 24-66 degrees C. and under these preferred conditions, immersion times of from about 10 seconds to 10 minutes are typical.
- the ferrous metal surface may then be rinsed with water and dried.
- a suitable lubricant may be applied to the coated wire to facilitate a subsequent drawing operation.
- Various lubricant materials such as numerous soap containing compositions, may be applied to the copper plated wire and this lubricant coating then dried thereon.
- the wire may then be subjected to the desired drawing operation and it is found that following the drawing, the copper finish on the wire is very bright and uniform and shows good adhesion.
- the solutions of the present invention may also be used to form a copper coating which is useful as a lubricant ma terial for warm forming operations, as well as a decorative copper coating.
- EXAh IPLE 1 Four liters of an electroless copper plating solution was formulated containing 0.6% copper, as copper sulfate, 30 milliliters per liter of 6 6 degrees B. sulfuric acid, 3 grams per liter sodium chloride, A gram per liter polyethylene glycol of a molecular Weight of about 4,000 and gram per liter of p,p'-methylene dianiline. To simulate an actual operating bath, this solution was aged with steel wool until a ferrous ion content of 0.5% was obtained. The bath was then replenished with the copper sulfate and sulfuric acid to the original concentration level of these components.
- a 25 foot length of steel wire having a diameter of 0.064 inch was pickled for 10 minutes at room temperature in a muriatic acid pickle containing 20% muriatic acid by volume.
- the wire was then rinsed in cold water for 30 seconds, cleaned for minutes at about 80 degrees Centigrade in an aqueous alkali metal hydroxide-alkali metal permanganate cleaning solution. After rinsing in cold water for 30 seconds, the thus-cleaned steel wire was immersed in the copper plating bath for one minute at a temperature of about 43 degrees centigrade.
- the copper coated wire was then immersed for 30 seconds at a temperature of about 90 degrees centigrade in a lubricant composition containing borax, soap, and TSP and was then oven dried for 3 minutes at about 190 degrees centigrade.
- the wire was then drawn through two wire dies having diameters of 0.056 and 0.050 inch, respectively, and it was found that following the drawing, the copper finish on the wire was very bright and uniform and had excellent adhesion.
- EXAMPLE 2 Two 4 litter copper plating solutions were made up, both containing about 0.6% Cu as copper sulfate, 30 ml./l. H 80 3 g./l. NaCl, /2 g./l. polyethylene glycol of molecular weight 4000, and about 0.6% Fe++.
- the Fe++ was introduced into the Ibaths by dissolving steel wool in each, then replenishing the copper and acid to their original buildup concentration.
- To one of the baths was added /2 g./l. of p,p-methylene dianiline. Lengths of wire were cleaned in the manner described in Example 1, processed in the two baths, then lubricated and dried as described in Example 1.
- the wire was then drawn through two wire dies, reducing the cross sectional area by about 20%.
- the wire processed in the bath containing p,p'-methylene dianiline had better adhesion after drawing than the wire processed in the bath without p,p'-methylene dianiline.
- Example 3 The procedure of Example 1 was again repeated with the exception that 4,4-methylene bis(ortho-chloroauiline) was substituted for the methylene dianiline in the copper plating solution. After processing the steel wire in the same manner as Example 1, the results obtained were found to be substantially equivalent to those obtained in Example 1.
- EXAMPLE 4 A copper plating solution was formulated containing 30 ml./l. sulfuric acid, 24 grams per liter CuSO- .5lH O, 0.5% Fe++, 0.5 gram per liter p,p'-methylene dianiline, 0.5 gram per liter polyethylene glycol having a molecular weight of 4000 and 0.25 gram per liter sodium iodide. Steel wire was processed through the bath in the same manner as Example 1 and there was obtained a coating having a quality comparable to that obtained in Example 1.
- Example 5 The procedure of Example 4 was repeated with the exception that the 0.25 gram per liter sodium iodide was replaced with one gram per liter of sodium bromide and a comparable coating was obtained.
- EXAMPLE 6 A copper plating solution was formulated containing 24 grams per liter CuSO .5H O, 3% sulfuric acid, 0.5% Fe++, 0.25 gram per liter p,p'-methylene dianiline, 3 grams per liter sodium chloride and 0.25 gram per liter of polyethylene glycol having a molecular weight of 20,000. Steel wire was processed through the solution in the same manner as in Example 1 and a comparable bright, adherent copper coating was obtained.
- EXAMPLE 7 A copper plating solution was formulated similar to that of Example 6, but without the polyethylene glycol. Steel wire was processed through the bath both before and after adding one gram per liter of polyethylene glycol having a molecular weight of 2000. It was found that the copper coating obtained when the bath contained the polyethylene glycol was of significantly higher quality than that obtained without the polyethylene glycol.
- a 4 l. electroless copper plating bath was made up containing 30 ml./l. of cone. H 24 g./l. Cu SO .5H O, and 0.43% Fe++.
- the iron was introduced by dissolving steel wool pads in the bath. After aging, the acid and copper content were replenished to their original level.
- To the bath was added 20 ml. of a solution containing 20% w./v. p,p'-methylene dianiline, 20% w./v. polyethylene glycol of molecular weight 4000, and 20% v./v. muriatic acid.
- the bath was heated to 43 degrees C. and a length of precleaned steel wire was processed in the bath.
- the resulting copper coating was found to have good luster and adhesion.
- the bath was then aged with steel wool to a total of 10.0% iron.
- the copper and acid were replenished periodically to maintain their original concentration.
- a length of wire was again processed in the bath at this high iron concentration and the subsequent coating was of as high a quality as that obtained at the lower iron concentration.
- An aqueous acidic solution suitable for forming a copper plate on ferrous metal surfaces without the application of electric current which comprises copper ions in an amount from 0.1 to 30% by weight, halide ions in an amount within the range of 0.001 to 10% by weight, wherein the halide ions are independently selected from the group consisting of chloride, bromide, and iodide; a polyalkylene glycol present in an amount of at least about 0.001% by weight and having a molecular weight within a range of about 600 to 20,000; and a dianiline com- 7 pound present in an amount of at least about 0.01% by weight to saturation, having the formula:
- R is an alkyl group containing from about 1 to about 6 carbon atoms in a straight or branched chain; R is an alkyl group containing from about 1 to 4 carbon atoms in a straight or branched chain;
- X is halogen; a is a number from to 2; and b is 0 or 1.
- An aqueous acidic solution suitable for forming a copper plate on ferrous metal surfaces without the application of electric current which comprises copper ions in an amount from 0.1 to 30% by weight, halide ions in an amount from the range of 0.001 to by weight, wherein the halide ions are independently selected from the group consisting of chloride, bromide, and iodide; a polyalkylene glycol present in an amount of at least about 0.001% by weight and having a molecular weight within a range of about 600 to 20,000; and p,p'-methylene dianiline in an amount from about 0.01% by weight to saturation.
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Lubricants (AREA)
- Chemical Treatment Of Metals (AREA)
Abstract
(R''A,(X)B,(H2N-)PHENYL)2-R
WHEREIN R IS AN ALKYL GROUP CONTAINING FROM ABOUT 1 TO 6 CARBON ATOMS IN A STRAIGHT OR BRANCHED CHAIN; R'' IS AN ALKYL GROUP CONTAINING FROM ABOUT 1 TO 4 CARBON ATOMS IN A STRAIGHT OR BRTANCHED CHAIN; X IS HALOGEN; AND A IS A NUMBER FROM 0 TO 2; B IS 0 OR 1. THIS SOLUTION IS PARTICULARLY USEFUL IN FORMING AN ELECTROLESS COPPER COATING ON STEEL WIRE PRIOR TO SUBJECTING IT TO A WIRE DRAWING OPERATION.
Description
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US88930969A | 1969-12-30 | 1969-12-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
US3664852A true US3664852A (en) | 1972-05-23 |
Family
ID=25394885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US889309A Expired - Lifetime US3664852A (en) | 1969-12-30 | 1969-12-30 | Electroless copper plating solution and process |
Country Status (13)
Country | Link |
---|---|
US (1) | US3664852A (en) |
JP (1) | JPS491130B1 (en) |
AT (1) | AT298928B (en) |
BE (1) | BE759316A (en) |
CA (1) | CA922056A (en) |
CH (1) | CH536881A (en) |
DE (1) | DE2055085A1 (en) |
ES (1) | ES386925A1 (en) |
FR (1) | FR2071915A5 (en) |
GB (1) | GB1280260A (en) |
NL (1) | NL7018320A (en) |
SE (1) | SE363853B (en) |
ZA (1) | ZA706968B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3767539A (en) * | 1970-10-29 | 1973-10-23 | Schering Ag | Acid galvanic copper bath |
WO2008002737A1 (en) * | 2006-06-28 | 2008-01-03 | Lam Research Corporation | Plating solutions for electroless deposition of copper |
CN114106595A (en) * | 2021-11-08 | 2022-03-01 | 凯明(常州)新材料科技有限公司 | Surface treatment method for steel wire for needle roller bearing |
US20230063860A1 (en) * | 2021-08-24 | 2023-03-02 | ACS ENTERPRISES, LLC d/b/a AMERICAN CHEMICAL | Copper treatment additive |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES529705A0 (en) * | 1983-02-21 | 1984-11-01 | Rca Corp | IMPROVEMENTS INTRODUCED IN AN IMAGE SIZE CONTROL CIRCUIT FOR A VISUAL PRESENTATION DEVICE |
JP2009001872A (en) * | 2007-06-22 | 2009-01-08 | Kobe Steel Ltd | Copper-plating method of wire-like material, and copper-plated wire |
JP6270681B2 (en) * | 2014-09-29 | 2018-01-31 | 学校法人 関西大学 | Wiring structure manufacturing method, copper displacement plating solution, and wiring structure |
-
0
- BE BE759316D patent/BE759316A/en unknown
-
1969
- 1969-12-30 US US889309A patent/US3664852A/en not_active Expired - Lifetime
-
1970
- 1970-10-13 ZA ZA706968A patent/ZA706968B/en unknown
- 1970-11-04 CA CA097426A patent/CA922056A/en not_active Expired
- 1970-11-06 FR FR7040061A patent/FR2071915A5/fr not_active Expired
- 1970-11-10 DE DE19702055085 patent/DE2055085A1/en active Pending
- 1970-11-24 AT AT1060370A patent/AT298928B/en not_active IP Right Cessation
- 1970-12-02 JP JP45106231A patent/JPS491130B1/ja active Pending
- 1970-12-16 NL NL7018320A patent/NL7018320A/xx unknown
- 1970-12-17 SE SE17154/70A patent/SE363853B/xx unknown
- 1970-12-22 GB GB60913/70A patent/GB1280260A/en not_active Expired
- 1970-12-30 ES ES386925A patent/ES386925A1/en not_active Expired
- 1970-12-30 CH CH1932470A patent/CH536881A/en not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3767539A (en) * | 1970-10-29 | 1973-10-23 | Schering Ag | Acid galvanic copper bath |
WO2008002737A1 (en) * | 2006-06-28 | 2008-01-03 | Lam Research Corporation | Plating solutions for electroless deposition of copper |
US20230063860A1 (en) * | 2021-08-24 | 2023-03-02 | ACS ENTERPRISES, LLC d/b/a AMERICAN CHEMICAL | Copper treatment additive |
WO2023028088A3 (en) * | 2021-08-24 | 2024-04-04 | Acs Enterprises, Llc | Copper treatment additive |
CN114106595A (en) * | 2021-11-08 | 2022-03-01 | 凯明(常州)新材料科技有限公司 | Surface treatment method for steel wire for needle roller bearing |
Also Published As
Publication number | Publication date |
---|---|
CH536881A (en) | 1973-05-15 |
GB1280260A (en) | 1972-07-05 |
BE759316A (en) | 1971-04-30 |
CA922056A (en) | 1973-03-06 |
DE2055085A1 (en) | 1971-07-01 |
NL7018320A (en) | 1971-07-02 |
AT298928B (en) | 1972-05-25 |
SE363853B (en) | 1974-02-04 |
FR2071915A5 (en) | 1971-09-17 |
ES386925A1 (en) | 1973-04-16 |
ZA706968B (en) | 1971-07-28 |
JPS491130B1 (en) | 1974-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: HOOKER CHEMICALS & PLASTICS CORP 32100 STEPHENSON Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OXY METAL INDUSTRIES CORPORATION;REEL/FRAME:003942/0016 Effective date: 19810317 |
|
AS | Assignment |
Owner name: OXY METAL INDUSTRIES CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:OXY METAL FINISHING CORPORATION;REEL/FRAME:003967/0084 Effective date: 19741220 |
|
AS | Assignment |
Owner name: OCCIDENTAL CHEMICAL CORPORATION Free format text: CHANGE OF NAME;ASSIGNOR:HOOKER CHEMICAS & PLASTICS CORP.;REEL/FRAME:004126/0054 Effective date: 19820330 |
|
AS | Assignment |
Owner name: PARKER CHEMICAL COMPANY, 32100 STEPHENSON HWY., MA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST.;ASSIGNOR:OCCIDENTAL CHEMICAL CORPORATION;REEL/FRAME:004194/0047 Effective date: 19830928 |