WO2023028088A3 - Copper treatment additive - Google Patents
Copper treatment additive Download PDFInfo
- Publication number
- WO2023028088A3 WO2023028088A3 PCT/US2022/041276 US2022041276W WO2023028088A3 WO 2023028088 A3 WO2023028088 A3 WO 2023028088A3 US 2022041276 W US2022041276 W US 2022041276W WO 2023028088 A3 WO2023028088 A3 WO 2023028088A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- copper
- treatment additive
- copper treatment
- solution
- coating
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 7
- 229910052802 copper Inorganic materials 0.000 title abstract 7
- 239000010949 copper Substances 0.000 title abstract 7
- 239000000654 additive Substances 0.000 title abstract 4
- 230000000996 additive effect Effects 0.000 title abstract 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 abstract 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 229910000365 copper sulfate Inorganic materials 0.000 abstract 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 abstract 1
- 229910000831 Steel Inorganic materials 0.000 abstract 1
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 230000001464 adherent effect Effects 0.000 abstract 1
- 239000010953 base metal Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- 229940050929 polyethylene glycol 3350 Drugs 0.000 abstract 1
- 239000010959 steel Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 238000005491 wire drawing Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/02—Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C9/00—Cooling, heating or lubricating drawing material
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Treatment Of Metals (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
A copper treatment additive and methods are provided for applying copper to base metal effectively and efficiently while requiring a reduced frequency of replacing a treatment bath of copper sulfate solution. The copper treatment additive comprises an acidic, liquid mixture for use with a solution of copper sulfate and sulfuric acid to produce a strongly adherent, uniform metallic copper coating on steel. The copper treatment additive includes a first portion of Polyethylene Glycol 3350, a second portion of 4,4'-Methylene Dianiline; and a third portion of 31.45% Hydrochloric Acid. The copper coating has been observed to facilitate wire drawing processes and enhance characteristics associated with welding and decorative wire.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US202163236515P | 2021-08-24 | 2021-08-24 | |
US63/236,515 | 2021-08-24 | ||
US17/892,056 US20230063860A1 (en) | 2021-08-24 | 2022-08-20 | Copper treatment additive |
US17/892,056 | 2022-08-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2023028088A2 WO2023028088A2 (en) | 2023-03-02 |
WO2023028088A3 true WO2023028088A3 (en) | 2024-04-04 |
Family
ID=85286501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2022/041276 WO2023028088A2 (en) | 2021-08-24 | 2022-08-23 | Copper treatment additive |
Country Status (2)
Country | Link |
---|---|
US (1) | US20230063860A1 (en) |
WO (1) | WO2023028088A2 (en) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB346401A (en) * | 1929-01-10 | 1931-04-10 | Parker Rust Proof Co. | Improvements in compositions for coating metals and methods of making and using the same |
US3664852A (en) * | 1969-12-30 | 1972-05-23 | Hooker Chemical Corp | Electroless copper plating solution and process |
US3730853A (en) * | 1971-06-18 | 1973-05-01 | Schloetter M | Electroplating bath for depositing tin-lead alloy plates |
EP0216513A2 (en) * | 1985-08-22 | 1987-04-01 | Amoco Corporation | Treatment of drilled copper-clad thermoplastic laminates |
CZ56587A3 (en) * | 1987-01-29 | 1996-03-13 | Michael Phdr Straka | Bath for currentless copper coating of iron-made articles |
JP2001152387A (en) * | 1999-09-16 | 2001-06-05 | Ishihara Chem Co Ltd | Void-free copper plating method |
KR100779691B1 (en) * | 2006-12-01 | 2007-11-26 | 배명직 | Metal plating method of stone surface |
US20100221574A1 (en) * | 2009-02-27 | 2010-09-02 | Rochester Thomas H | Zinc alloy mechanically deposited coatings and methods of making the same |
US20130313119A1 (en) * | 2012-05-25 | 2013-11-28 | Trevor Pearson | Additives for Producing Copper Electrodeposits Having Low Oxygen Content |
CN108315787A (en) * | 2018-05-08 | 2018-07-24 | 大同新成新材料股份有限公司 | A kind of technique of brush plating |
-
2022
- 2022-08-20 US US17/892,056 patent/US20230063860A1/en active Pending
- 2022-08-23 WO PCT/US2022/041276 patent/WO2023028088A2/en unknown
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB346401A (en) * | 1929-01-10 | 1931-04-10 | Parker Rust Proof Co. | Improvements in compositions for coating metals and methods of making and using the same |
US3664852A (en) * | 1969-12-30 | 1972-05-23 | Hooker Chemical Corp | Electroless copper plating solution and process |
US3730853A (en) * | 1971-06-18 | 1973-05-01 | Schloetter M | Electroplating bath for depositing tin-lead alloy plates |
EP0216513A2 (en) * | 1985-08-22 | 1987-04-01 | Amoco Corporation | Treatment of drilled copper-clad thermoplastic laminates |
CZ56587A3 (en) * | 1987-01-29 | 1996-03-13 | Michael Phdr Straka | Bath for currentless copper coating of iron-made articles |
JP2001152387A (en) * | 1999-09-16 | 2001-06-05 | Ishihara Chem Co Ltd | Void-free copper plating method |
KR100779691B1 (en) * | 2006-12-01 | 2007-11-26 | 배명직 | Metal plating method of stone surface |
US20100221574A1 (en) * | 2009-02-27 | 2010-09-02 | Rochester Thomas H | Zinc alloy mechanically deposited coatings and methods of making the same |
US20130313119A1 (en) * | 2012-05-25 | 2013-11-28 | Trevor Pearson | Additives for Producing Copper Electrodeposits Having Low Oxygen Content |
CN108315787A (en) * | 2018-05-08 | 2018-07-24 | 大同新成新材料股份有限公司 | A kind of technique of brush plating |
Also Published As
Publication number | Publication date |
---|---|
US20230063860A1 (en) | 2023-03-02 |
WO2023028088A2 (en) | 2023-03-02 |
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