JP2000129454A - Electroless palladium plating solution - Google Patents

Electroless palladium plating solution

Info

Publication number
JP2000129454A
JP2000129454A JP10299572A JP29957298A JP2000129454A JP 2000129454 A JP2000129454 A JP 2000129454A JP 10299572 A JP10299572 A JP 10299572A JP 29957298 A JP29957298 A JP 29957298A JP 2000129454 A JP2000129454 A JP 2000129454A
Authority
JP
Japan
Prior art keywords
palladium
plating
mol
formate
plating solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10299572A
Other languages
Japanese (ja)
Inventor
Akio Takahashi
昭男 高橋
Sumiko Nakajima
澄子 中島
Kiyoshi Hasegawa
清 長谷川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP10299572A priority Critical patent/JP2000129454A/en
Publication of JP2000129454A publication Critical patent/JP2000129454A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To improve the deposition rate of electroless plating, into a plating soln., by incorporating a tetraammine palladium compd. as a palladium ion source and formate as a reducing agent. SOLUTION: An electroless palladium plating soln. contains palladium ions, a complexing agent, a reducing agent and a pH conditioner for palladium ions. As the palladium ion source, a tetraammine palladium compd. is used, and, as the reducing agent, formate is used. Preferably, as the tetraammine palladium ion compd., the hydrochloride of tetraammine palladium is used, and, as the formate, sodiumformate is used. The compsn. of the plating bath is, e.g. composed of 0.04 mol/l hydrochloride of tetraammine palladium, 0.16 mol/l ethylenediamine, 0.50 mol/l sodium formate and 0.10 mol/l sodium hydrogenphosphate, and sodium hydroxide by the amt. controlling the pH to about 6.0 is added thereto. The plating temp. is controlled to about 70 deg.C, and the plating time is controlled to about 30 min.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、無電解パラジウム
めっき液に関する。
[0001] The present invention relates to an electroless palladium plating solution.

【0002】[0002]

【従来の技術】従来の無電解パラジウムめっき液は、パ
ラジウムイオン、パラジウムイオンの錯化剤、還元剤、
pH調整剤からなり、パラジウムイオン源には塩化パラ
ジウムを用い、パラジウムイオンの錯化剤にはアンモニ
ウムイオンやエチレンジアミンを用い、還元剤には次亜
燐酸ナトリウム、水素化ホウ素ナトリウム、ジメチルア
ミンボラン、または蟻酸ナトリウムを用い、pH調整剤
には燐酸塩、四ホウ酸塩、フタル酸塩、酢酸塩、クエン
酸塩等を用いている。
2. Description of the Related Art Conventional electroless palladium plating solutions include palladium ions, complexing agents for palladium ions, reducing agents,
It consists of a pH adjuster, uses palladium chloride as a palladium ion source, uses ammonium ions or ethylenediamine as a complexing agent for palladium ions, and uses sodium hypophosphite, sodium borohydride, dimethylamine borane, or Sodium formate is used, and phosphate, tetraborate, phthalate, acetate, citrate and the like are used as pH adjusters.

【0003】このような無電解パラジウムめっき液は、
その還元剤の選択によって、めっき皮膜の組成が異な
る。例えば、還元剤に次亜燐酸ナトリウムを用いたとき
にはめっき被膜がパラジウム−リン合金になり、還元剤
に水素化ホウ素ナトリウム(ジメチルアミンボラン)を
用いたときにはめっき被膜がパラジウム−ホウ素合金に
なり、還元剤に蟻酸ナトリウムを用いたときにはめっき
被膜が純パラジウムになる。
[0003] Such an electroless palladium plating solution is
The composition of the plating film differs depending on the selection of the reducing agent. For example, when sodium hypophosphite is used as the reducing agent, the plating film becomes a palladium-phosphorus alloy, and when sodium borohydride (dimethylamine borane) is used as the reducing agent, the plating film becomes a palladium-boron alloy. When sodium formate is used as the agent, the plating film becomes pure palladium.

【0004】[0004]

【発明が解決しようとする課題】ところが、この無電解
パラジウムめっき液のうち、還元剤に蟻酸ナトリウムを
用いたときには、めっきの析出速度が約2μm/時間と
遅く、実用性に乏しいという課題があった。
However, when sodium formate is used as a reducing agent in this electroless palladium plating solution, the plating deposition rate is as low as about 2 μm / hour, which is not practical. Was.

【0005】本発明は、めっき析出速度に優れた、還元
剤に蟻酸塩を用いた無電解パラジウムめっき液を提供す
ることを目的とする。
An object of the present invention is to provide an electroless palladium plating solution which is excellent in plating deposition rate and uses formate as a reducing agent.

【0006】[0006]

【課題を解決するための手段】本発明の無電解パラジウ
ムめっき液は、パラジウムイオン、パラジウムイオンの
錯化剤、還元剤、pH調整剤からなる無電解パラジウム
めっき液において、パラジウムイオン源としてテトラア
ンミンパラジウム化合物、かつ、還元剤として蟻酸塩を
含むことを特徴とする。
The electroless palladium plating solution of the present invention is an electroless palladium plating solution comprising a palladium ion, a complexing agent for the palladium ion, a reducing agent and a pH adjuster. It is characterized by containing formate as a compound and a reducing agent.

【0007】[0007]

【発明の実施の形態】テトラアンミンパラジウム化合物
には、テトラアンミンパラジウム塩酸塩を用いることが
好ましく、蟻酸塩には、蟻酸ナトリウムを用いることが
好ましい。
BEST MODE FOR CARRYING OUT THE INVENTION It is preferable to use tetraammine palladium hydrochloride as the tetraammine palladium compound, and it is preferable to use sodium formate as the formate.

【0008】[0008]

【実施例】厚さ0.1mm、大きさ25mm×25mm
のニッケル板に、以下に示す無電解パラジウムめっきを
行い、めっき皮膜の厚さを蛍光X線膜厚計であるSFT
−8000型(セイコー電子工業株式会社製、商品名)
で測定し、めっき析出速度=めっき皮膜の厚さ/めっき
時間として計算した。前記ニッケル板の汚れを除去する
ために、酸性脱脂液であるZ−200(株式会社ワール
ドメタル製、商品名)に液温50℃で1分間浸漬し、流
水洗を2分間行い、下記の組成と条件の無電解パラジウ
ムめっきを行い、流水洗を2分間行い、85℃で15分
間、乾燥して試料とした。 (無電解パラジウムめっき液の組成) ・テトラアンミンパラジウム塩酸塩… 0.04モル/リットル ・エチレンジアミン… 0.16モル/リットル ・蟻酸ナトリウム… 0.50モル/リットル ・リン酸水素二ナトリウム… 0.10モル/リットル ・水酸化ナトリウム… 上記と合わせてpHを6.0とする量 (めっき条件) ・めっき液温度:70℃ ・めっき時間:30分間
[Example] thickness 0.1 mm, size 25 mm x 25 mm
The following electroless palladium plating is performed on the nickel plate, and the thickness of the plating film is measured by SFT which is a fluorescent X-ray film thickness meter.
-8000 type (Seiko Electronics Co., Ltd., trade name)
The plating deposition rate was calculated as: plating film thickness / plating time. In order to remove the stain on the nickel plate, the plate was immersed in an acidic degreasing solution Z-200 (trade name, manufactured by World Metal Co., Ltd.) at a liquid temperature of 50 ° C. for 1 minute, washed with running water for 2 minutes, and subjected to the following composition. Electroless palladium plating was performed under the conditions described above, washed with running water for 2 minutes, and dried at 85 ° C. for 15 minutes to obtain a sample. (Composition of electroless palladium plating solution) Tetraammine palladium hydrochloride: 0.04 mol / L Ethylenediamine: 0.16 mol / L Sodium formate: 0.50 mol / L Disodium hydrogen phosphate: 0.10 Mol / liter ・ Sodium hydroxide ... The amount to adjust the pH to 6.0 in combination with the above (plating conditions) ・ Plating solution temperature: 70 ° C. ・ Plating time: 30 minutes

【0009】比較例1 無電解パラジウムめっき液の組成を以下のようにした以
外は、実施例と同様にしてめっきを行い、析出速度を測
定した。 (無電解パラジウムめっき液の組成) ・塩化パラジウム… 0.04モル/リットル ・エチレンジアミン… 0.16モル/リットル ・蟻酸ナトリウム… 0.50モル/リットル ・リン酸二水素ナトリウム… 0.10モル/リットル ・水酸化ナトリウム… 上記と合わせてpHを6.0とする量
Comparative Example 1 Plating was carried out in the same manner as in the Example except that the composition of the electroless palladium plating solution was as follows, and the deposition rate was measured. (Composition of electroless palladium plating solution) Palladium chloride: 0.04 mol / L Ethylenediamine: 0.16 mol / L Sodium formate: 0.50 mol / L Sodium dihydrogen phosphate: 0.10 mol / L 1 liter ・ Sodium hydroxide ... The amount to make the pH 6.0 together with the above

【0010】比較例2 無電解パラジウムめっき液の組成を以下のようにした以
外は、実施例と同様にしてめっきを行い、析出速度を測
定した。 (無電解パラジウムめっき液の組成) ・塩化パラジウム… 0.04モル/リットル ・塩化アンモニウム… 0.05モル/リットル ・エチレンジアミン… 0.16モル/リットル ・蟻酸ナトリウム… 0.50モル/リットル ・リン酸二水素ナトリウム… 0.10モル/リットル ・水酸化ナトリウム… 上記と合わせてpHを6.0とする量
Comparative Example 2 Plating was carried out in the same manner as in the Example except that the composition of the electroless palladium plating solution was as follows, and the deposition rate was measured. (Composition of electroless palladium plating solution) Palladium chloride: 0.04 mol / L Ammonium chloride: 0.05 mol / L Ethylenediamine: 0.16 mol / L Sodium formate: 0.50 mol / L Phosphorus Sodium dihydrogen acid ... 0.10 mol / l ・ Sodium hydroxide ... The amount to make the pH 6.0 together with the above

【0011】以上のようにして、無電解パラジウムめっ
きの析出速度を測定した結果、実施例が4μm/時間で
あったのに対し、比較例のめっき析出速度はいずれも2
μm/時間であった。
As a result of measuring the deposition rate of electroless palladium plating as described above, the plating rate of the comparative example was 2 μm / hour, whereas the plating rate of the comparative example was 2 μm / hour.
μm / hour.

【0012】[0012]

【発明の効果】以上に説明したとおり、本発明によっ
て、めっき析出速度に優れた、還元剤に蟻酸塩を用いた
無電解パラジウムめっき液を提供することができる。
As described above, according to the present invention, it is possible to provide an electroless palladium plating solution excellent in plating deposition rate and using formate as a reducing agent.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 長谷川 清 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 Fターム(参考) 4K022 AA02 BA18 BA31 CA03 DB02 DB04 DB07 EA02  ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kiyoshi Hasegawa 1500 Ogawa Oji, Shimodate-shi, Ibaraki F-term in Shimodate Research Laboratory, Hitachi Chemical Co., Ltd. 4K022 AA02 BA18 BA31 CA03 DB02 DB04 DB07 EA02

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】パラジウムイオン、パラジウムイオンの錯
化剤、還元剤、pH調整剤からなる無電解パラジウムめ
っき液において、パラジウムイオン源としてテトラアン
ミンパラジウム化合物、かつ、還元剤として蟻酸塩を含
むことを特徴とする無電解パラジウムめっき液。
1. An electroless palladium plating solution comprising palladium ion, a palladium ion complexing agent, a reducing agent and a pH adjuster, characterized in that it contains a tetraammine palladium compound as a palladium ion source and a formate as a reducing agent. Electroless palladium plating solution.
【請求項2】テトラアンミンパラジウム化合物が、テト
ラアンミンパラジウム塩酸塩であることを特徴とする請
求項1に記載の無電解パラジウムめっき液。
2. The electroless palladium plating solution according to claim 1, wherein the tetraammine palladium compound is tetraammine palladium hydrochloride.
【請求項3】蟻酸塩が、蟻酸ナトリウムであることを特
徴とする請求項1または2に記載の無電解パラジウムめ
っき液。
3. The electroless palladium plating solution according to claim 1, wherein the formate is sodium formate.
JP10299572A 1998-10-21 1998-10-21 Electroless palladium plating solution Pending JP2000129454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10299572A JP2000129454A (en) 1998-10-21 1998-10-21 Electroless palladium plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10299572A JP2000129454A (en) 1998-10-21 1998-10-21 Electroless palladium plating solution

Publications (1)

Publication Number Publication Date
JP2000129454A true JP2000129454A (en) 2000-05-09

Family

ID=17874376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10299572A Pending JP2000129454A (en) 1998-10-21 1998-10-21 Electroless palladium plating solution

Country Status (1)

Country Link
JP (1) JP2000129454A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076595A (en) * 2000-08-24 2002-03-15 Kyocera Corp Wiring board
WO2007010760A1 (en) * 2005-07-20 2007-01-25 Nippon Mining & Metals Co., Ltd. Plating solution for electroless palladium plating
WO2008105104A1 (en) * 2007-02-28 2008-09-04 Kojima Chemicals Co., Ltd. Electroless pure palladium plating solution
JP2009533858A (en) * 2006-04-10 2009-09-17 リネア・テルジ・リミテッド Method for applying metal to a substrate
KR101023306B1 (en) 2007-08-15 2011-03-18 고지마 가가쿠 야쿠힌 가부시키가이샤 Electroless palladium plating solution
CN103290399A (en) * 2013-06-19 2013-09-11 广东东硕科技有限公司 Chemical palladium plating liquid employing composite stabilizer

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076595A (en) * 2000-08-24 2002-03-15 Kyocera Corp Wiring board
WO2007010760A1 (en) * 2005-07-20 2007-01-25 Nippon Mining & Metals Co., Ltd. Plating solution for electroless palladium plating
JPWO2007010760A1 (en) * 2005-07-20 2009-01-29 日鉱金属株式会社 Electroless palladium plating solution
US7704307B2 (en) 2005-07-20 2010-04-27 Nippon Mining & Metals Co., Ltd. Electroless palladium plating liquid
CN101228293B (en) * 2005-07-20 2010-12-08 日矿金属株式会社 Plating solution for electroless palladium plating
JP4596553B2 (en) * 2005-07-20 2010-12-08 Jx日鉱日石金属株式会社 Electroless palladium plating solution
JP2009533858A (en) * 2006-04-10 2009-09-17 リネア・テルジ・リミテッド Method for applying metal to a substrate
WO2008105104A1 (en) * 2007-02-28 2008-09-04 Kojima Chemicals Co., Ltd. Electroless pure palladium plating solution
US7981202B2 (en) 2007-02-28 2011-07-19 Kojima Chemicals Co., Ltd. Electroless pure palladium plating solution
KR101023306B1 (en) 2007-08-15 2011-03-18 고지마 가가쿠 야쿠힌 가부시키가이샤 Electroless palladium plating solution
CN103290399A (en) * 2013-06-19 2013-09-11 广东东硕科技有限公司 Chemical palladium plating liquid employing composite stabilizer

Similar Documents

Publication Publication Date Title
Schlesinger Electroless deposition of nickel
US4337091A (en) Electroless gold plating
ES2688547T3 (en) Coating bath for non-electrolytic deposition of nickel layers
EP0060294B1 (en) Electroless alloy plating
US4833041A (en) Corrosion/wear-resistant metal alloy coating compositions
JP2004502871A (en) Electroless silver plating
JPS5818430B2 (en) Electroless plating bath and plating method
US6020021A (en) Method for depositing electroless nickel phosphorus alloys
US5364459A (en) Electroless plating solution
GB2053284A (en) Palladium alloy plate
US5019163A (en) Corrosion/wear-resistant metal alloy coating compositions
US5935306A (en) Electroless gold plating bath
JP2000129454A (en) Electroless palladium plating solution
US4830668A (en) Acidic bath for electroless deposition of gold films
US5130168A (en) Electroless gold plating bath and method of using same
Warwick et al. The autocatalytic deposition of tin
US3698939A (en) Method and composition of platinum plating
GB2121444A (en) Electroless gold plating
US4474838A (en) Electroless direct deposition of gold on metallized ceramics
JPH08269727A (en) Electroless palladium plating solution and plating method
JP4230813B2 (en) Gold plating solution
JP3035763B2 (en) Electroless palladium plating solution
JP3033455B2 (en) Electroless nickel plating of aluminum
JPS6141774A (en) Modified aqueous bath for nickel plating and method
GB2225026A (en) Electroless gold plating composition