GB1397091A - Process and solution for the sensitization of substrates for electroless metal deposition - Google Patents

Process and solution for the sensitization of substrates for electroless metal deposition

Info

Publication number
GB1397091A
GB1397091A GB3532072A GB3532072A GB1397091A GB 1397091 A GB1397091 A GB 1397091A GB 3532072 A GB3532072 A GB 3532072A GB 3532072 A GB3532072 A GB 3532072A GB 1397091 A GB1397091 A GB 1397091A
Authority
GB
United Kingdom
Prior art keywords
solution
metal salt
cupric
salt
sulphate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3532072A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of GB1397091A publication Critical patent/GB1397091A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Surface Treatment Of Glass (AREA)
  • Decoration Of Textiles (AREA)

Abstract

1397091 Sensitization of substrates KOLLMORGEN CORP 28 July 1972 [29 July 1971] 35320/72 Heading C7F In sensitizing an insulating base, the base is first contacted with a solution of a reducible metal salt and a secondary reducing agent which is incapable of reducing the metal salt at the pH of the solution, and then contacted with a solution of a primary reducing agent to effect the reduction. The metal salt may be cupric acetate, cupric nitrate, cupric sulphate, nickel sulphate, nickelous chloride, cobaltous acetate or ferrous sulphate. The secondary reducer may be formaldehyde, paraformaldehyde, trioxane, glyoxal, dimethylhydantoin or trioxymethylene. The salt solution may also contain a complexing agent selected from Rochelle salt, salts of aminoalkanoic acids, salts of nitrilotriacetic acid, gluconic acid and gluconates and alkanolamines; and a metal accelerator selected from compounds of Ag, Pd, Au, Hg, SnCl 2 , CoCl 2 NiCl 2 and ZnCl 2 The primary reducer comprises a solution of a borohydride, a substituted borohydride, or an amine borane. Suitable solvents for the metal salt include water, dimethyl formamide, methanol, ethyl acetate, acetone, n-butanol, and 1,1,1-trichloroethylene. The treated base is subsequently electrolessly plated, e.g. with Cu.
GB3532072A 1971-07-29 1972-07-28 Process and solution for the sensitization of substrates for electroless metal deposition Expired GB1397091A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16750671A 1971-07-29 1971-07-29

Publications (1)

Publication Number Publication Date
GB1397091A true GB1397091A (en) 1975-06-11

Family

ID=22607641

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3532072A Expired GB1397091A (en) 1971-07-29 1972-07-28 Process and solution for the sensitization of substrates for electroless metal deposition

Country Status (11)

Country Link
JP (3) JPS533732B1 (en)
AT (1) AT316956B (en)
AU (1) AU462961B2 (en)
CA (1) CA968908A (en)
CH (1) CH606204A5 (en)
DK (1) DK145681C (en)
FR (1) FR2147338B1 (en)
GB (1) GB1397091A (en)
IT (1) IT961765B (en)
NL (1) NL174739C (en)
SE (1) SE385129B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2264717A (en) * 1992-03-06 1993-09-08 Zinex Corp Cyanide-free copper plating bath
GB2295624A (en) * 1994-12-02 1996-06-05 Motorola Inc Method and reduction solution for metallizing a surface
US7501014B2 (en) 2006-07-07 2009-03-10 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper compositions
US7527681B2 (en) 2006-07-07 2009-05-05 Rohm And Haas Electronic Materials Llp Electroless copper and redox couples
US7611569B2 (en) 2006-07-07 2009-11-03 Rohm And Haas Electronic Materials Llc Electroless copper compositions
EP2818242A1 (en) * 2013-06-28 2014-12-31 Rohm and Haas Electronic Materials LLC Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
WO2016097084A1 (en) * 2014-12-17 2016-06-23 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
CN114150299A (en) * 2021-04-27 2022-03-08 天津大学 Chemical deposition method for preparing ultra-low profile copper foil and copper-clad plate thereof

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2847298A1 (en) * 1978-10-27 1980-05-08 Schering Ag METHOD FOR PRODUCING METAL PATTERNS ON AN INSULATING SUPPORT
JPS6079604A (en) * 1983-10-05 1985-05-07 株式会社村田製作所 Method of producing polyacrylonitrile conductive film
DE3417563C2 (en) * 1984-05-11 1986-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Process for the production of metal patterns on insulating substrates, in particular printed circuits
GB8613161D0 (en) * 1986-05-30 1986-07-02 Exxon Chemical Patents Inc Sealable films
JPH0826462B2 (en) * 1987-11-30 1996-03-13 龍徳 四十宮 Method for producing molded product of surface metallized polymer
KR20140019175A (en) * 2012-08-06 2014-02-14 삼성전기주식회사 Catalyst solution for electroless copper plating, producing method thereof, and electroless copper plating method using the same
US11541468B2 (en) 2018-01-29 2023-01-03 Kyocera Corporation Coated tool and cutting tool including same
KR102492360B1 (en) 2018-01-29 2023-01-27 교세라 가부시키가이샤 Coated tool and cutting tool equipped with the same
WO2019146785A1 (en) 2018-01-29 2019-08-01 京セラ株式会社 Coated tool, and cutting tool comprising same
US11911829B2 (en) 2018-11-29 2024-02-27 Kyocera Corporation Coated tool and cutting tool including same

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2264717A (en) * 1992-03-06 1993-09-08 Zinex Corp Cyanide-free copper plating bath
GB2295624A (en) * 1994-12-02 1996-06-05 Motorola Inc Method and reduction solution for metallizing a surface
GB2295624B (en) * 1994-12-02 1998-07-29 Motorola Inc Method for metallizing a surface
US7501014B2 (en) 2006-07-07 2009-03-10 Rohm And Haas Electronic Materials Llc Formaldehyde free electroless copper compositions
US7527681B2 (en) 2006-07-07 2009-05-05 Rohm And Haas Electronic Materials Llp Electroless copper and redox couples
US7611569B2 (en) 2006-07-07 2009-11-03 Rohm And Haas Electronic Materials Llc Electroless copper compositions
EP2818242A1 (en) * 2013-06-28 2014-12-31 Rohm and Haas Electronic Materials LLC Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
CN104250731A (en) * 2013-06-28 2014-12-31 罗门哈斯电子材料有限公司 Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US9364822B2 (en) 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
US9914115B2 (en) 2013-06-28 2018-03-13 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
WO2016097084A1 (en) * 2014-12-17 2016-06-23 Atotech Deutschland Gmbh Plating bath composition and method for electroless plating of palladium
CN114150299A (en) * 2021-04-27 2022-03-08 天津大学 Chemical deposition method for preparing ultra-low profile copper foil and copper-clad plate thereof

Also Published As

Publication number Publication date
FR2147338B1 (en) 1974-10-04
AT316956B (en) 1974-08-12
FR2147338A1 (en) 1973-03-09
DE2238003A1 (en) 1973-02-15
CH606204A5 (en) 1978-10-31
JPS52155138A (en) 1977-12-23
NL7210533A (en) 1973-01-31
DE2238003B2 (en) 1976-12-30
JPS52151636A (en) 1977-12-16
AU4502272A (en) 1974-01-31
JPS533732B1 (en) 1978-02-09
DK145681C (en) 1983-08-01
DK145681B (en) 1983-01-24
IT961765B (en) 1973-12-10
JPS564144B2 (en) 1981-01-28
NL174739B (en) 1984-03-01
NL174739C (en) 1984-08-01
AU462961B2 (en) 1975-07-10
JPS5726344B2 (en) 1982-06-03
SE385129B (en) 1976-06-08
CA968908A (en) 1975-06-10

Similar Documents

Publication Publication Date Title
GB1397091A (en) Process and solution for the sensitization of substrates for electroless metal deposition
US3589916A (en) Autocatalytic gold plating solutions
US4478883A (en) Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
GB1121282A (en) Process for stabilizing autocatalytic metal plating solutions
GB1482708A (en) Catalytic treatment of non-conductors for chemical platin
US3485643A (en) Electroless copper plating
US4181760A (en) Method for rendering non-platable surfaces platable
US3993801A (en) Catalytic developer
US3962496A (en) Composition and method for neutralizing and sensitizing resinous surfaces and improved sensitized resinous surfaces for adherent metallization
US4303443A (en) Electroless copper plating solution
US4167601A (en) Method of depositing a stress-free electroless copper deposit
GB1382101A (en) Electroless plating
US4981725A (en) Process and composition for sensitizing articles for metallization
US3674550A (en) Method of electroless deposition of a substrate and sensitizing solution therefor
US5035744A (en) Electroless gold plating solution
US4450191A (en) Ammonium ions used as electroless copper plating rate controller
GB1242995A (en) Electroless nickel plating on a nonconductive substrate
US3697296A (en) Electroless gold plating bath and process
US4419390A (en) Method for rendering non-platable semiconductor substrates platable
ES405960A2 (en) Electroless copper plating
CN103233212A (en) Method for plating nickel-copper-phosphorus ternary alloy on wood surface
US3738849A (en) Chemical plating solutions
US4228213A (en) Method of depositing a stress-free electroless copper deposit
GB1305468A (en)
GB1430853A (en) Activation of substrates for metallisation

Legal Events

Date Code Title Description
PS Patent sealed
PCNP Patent ceased through non-payment of renewal fee