AU462961B2 - Sensitized substrates for chemical metallization - Google Patents

Sensitized substrates for chemical metallization

Info

Publication number
AU462961B2
AU462961B2 AU45022/72A AU4502272A AU462961B2 AU 462961 B2 AU462961 B2 AU 462961B2 AU 45022/72 A AU45022/72 A AU 45022/72A AU 4502272 A AU4502272 A AU 4502272A AU 462961 B2 AU462961 B2 AU 462961B2
Authority
AU
Australia
Prior art keywords
chemical metallization
sensitized
substrates
sensitized substrates
metallization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU45022/72A
Other versions
AU4502272A (en
Inventor
JOSEPH NUZZI and JOSEPH TOUCHETTE FRANCIS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of AU4502272A publication Critical patent/AU4502272A/en
Application granted granted Critical
Publication of AU462961B2 publication Critical patent/AU462961B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
AU45022/72A 1971-07-29 1972-07-26 Sensitized substrates for chemical metallization Expired AU462961B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16750671A 1971-07-29 1971-07-29
USUS167506 1971-07-29

Publications (2)

Publication Number Publication Date
AU4502272A AU4502272A (en) 1974-01-31
AU462961B2 true AU462961B2 (en) 1975-07-10

Family

ID=22607641

Family Applications (1)

Application Number Title Priority Date Filing Date
AU45022/72A Expired AU462961B2 (en) 1971-07-29 1972-07-26 Sensitized substrates for chemical metallization

Country Status (11)

Country Link
JP (3) JPS533732B1 (en)
AT (1) AT316956B (en)
AU (1) AU462961B2 (en)
CA (1) CA968908A (en)
CH (1) CH606204A5 (en)
DK (1) DK145681C (en)
FR (1) FR2147338B1 (en)
GB (1) GB1397091A (en)
IT (1) IT961765B (en)
NL (1) NL174739C (en)
SE (1) SE385129B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2847298A1 (en) * 1978-10-27 1980-05-08 Schering Ag METHOD FOR PRODUCING METAL PATTERNS ON AN INSULATING SUPPORT
JPS6079604A (en) * 1983-10-05 1985-05-07 株式会社村田製作所 Method of producing polyacrylonitrile conductive film
DE3417563C2 (en) * 1984-05-11 1986-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Process for the production of metal patterns on insulating substrates, in particular printed circuits
GB8613161D0 (en) * 1986-05-30 1986-07-02 Exxon Chemical Patents Inc Sealable films
JPH0826462B2 (en) * 1987-11-30 1996-03-13 龍徳 四十宮 Method for producing molded product of surface metallized polymer
GB2264717A (en) * 1992-03-06 1993-09-08 Zinex Corp Cyanide-free copper plating bath
US5545430A (en) * 1994-12-02 1996-08-13 Motorola, Inc. Method and reduction solution for metallizing a surface
TWI348499B (en) 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
EP1876260B1 (en) 2006-07-07 2018-11-28 Rohm and Haas Electronic Materials LLC Improved electroless copper compositions
TWI347373B (en) 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
KR20140019175A (en) * 2012-08-06 2014-02-14 삼성전기주식회사 Catalyst solution for electroless copper plating, producing method thereof, and electroless copper plating method using the same
US9364822B2 (en) * 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
EP3234219B1 (en) * 2014-12-17 2019-03-27 ATOTECH Deutschland GmbH Plating bath composition and method for electroless deposition of palladium
KR102471907B1 (en) 2018-01-29 2022-11-29 교세라 가부시키가이샤 Coated tool and cutting tool equipped with the same
KR102492360B1 (en) 2018-01-29 2023-01-27 교세라 가부시키가이샤 Coated tool and cutting tool equipped with the same
KR102471905B1 (en) 2018-01-29 2022-11-29 교세라 가부시키가이샤 Covered tool and cutting tool equipped with the same
KR102591245B1 (en) 2018-11-29 2023-10-19 교세라 가부시키가이샤 Covered tools and cutting tools equipped therewith
CN114150299A (en) * 2021-04-27 2022-03-08 天津大学 Chemical deposition method for preparing ultra-low profile copper foil and copper-clad plate thereof

Also Published As

Publication number Publication date
DK145681C (en) 1983-08-01
JPS533732B1 (en) 1978-02-09
FR2147338B1 (en) 1974-10-04
CH606204A5 (en) 1978-10-31
NL7210533A (en) 1973-01-31
AU4502272A (en) 1974-01-31
CA968908A (en) 1975-06-10
JPS52151636A (en) 1977-12-16
IT961765B (en) 1973-12-10
GB1397091A (en) 1975-06-11
SE385129B (en) 1976-06-08
DE2238003A1 (en) 1973-02-15
FR2147338A1 (en) 1973-03-09
DK145681B (en) 1983-01-24
JPS5726344B2 (en) 1982-06-03
NL174739C (en) 1984-08-01
AT316956B (en) 1974-08-12
NL174739B (en) 1984-03-01
JPS52155138A (en) 1977-12-23
JPS564144B2 (en) 1981-01-28
DE2238003B2 (en) 1976-12-30

Similar Documents

Publication Publication Date Title
CA966937A (en) Sensitized substrates for chemical metallization
CA975503A (en) Solution for activating surfaces for metallization
AU462961B2 (en) Sensitized substrates for chemical metallization
CA950981A (en) Substrate connector
AU4028772A (en) Chemical processes
CA978303A (en) Chemical filming solution and process for plating therewith
AU3733171A (en) Chemical process
AU4478672A (en) Chemical process
AU458631B2 (en) Chemical processes
AU478100B2 (en) Sensitized substrates for chemical metallization
AU4502172A (en) Sensitized substrates for chemical metallization
AU4190672A (en) Chemical compounds
CA980618A (en) Photosensitive substrates for metallization and process
AU461447B2 (en) Chemical process
AU4859772A (en) Chemical processes
CA863913A (en) Metallizing substrates
CA868644A (en) Planar semiconductor components
AU420427B2 (en) Lenoweave substrate construction
AU460908B2 (en) Chemical processes
CA887057A (en) Chemical compounds
CA887056A (en) Chemical compounds
AU467874B2 (en) Metallization process
AU448764B2 (en) Film deposition
CA872179A (en) Photographic process
CA865657A (en) Photographic process