FR2147338A1 - - Google Patents

Info

Publication number
FR2147338A1
FR2147338A1 FR7227535A FR7227535A FR2147338A1 FR 2147338 A1 FR2147338 A1 FR 2147338A1 FR 7227535 A FR7227535 A FR 7227535A FR 7227535 A FR7227535 A FR 7227535A FR 2147338 A1 FR2147338 A1 FR 2147338A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7227535A
Other languages
French (fr)
Other versions
FR2147338B1 (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of FR2147338A1 publication Critical patent/FR2147338A1/fr
Application granted granted Critical
Publication of FR2147338B1 publication Critical patent/FR2147338B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Surface Treatment Of Glass (AREA)
  • Decoration Of Textiles (AREA)
FR7227535A 1971-07-29 1972-07-31 Expired FR2147338B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16750671A 1971-07-29 1971-07-29

Publications (2)

Publication Number Publication Date
FR2147338A1 true FR2147338A1 (en) 1973-03-09
FR2147338B1 FR2147338B1 (en) 1974-10-04

Family

ID=22607641

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7227535A Expired FR2147338B1 (en) 1971-07-29 1972-07-31

Country Status (11)

Country Link
JP (3) JPS533732B1 (en)
AT (1) AT316956B (en)
AU (1) AU462961B2 (en)
CA (1) CA968908A (en)
CH (1) CH606204A5 (en)
DK (1) DK145681C (en)
FR (1) FR2147338B1 (en)
GB (1) GB1397091A (en)
IT (1) IT961765B (en)
NL (1) NL174739C (en)
SE (1) SE385129B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2440139A1 (en) * 1978-10-27 1980-05-23 Schering Ag PROCESS FOR MAKING METAL DRAWINGS ON AN INSULATING SUPPORT
EP0160966A2 (en) * 1984-05-11 1985-11-13 Dr.Ing. Max Schlötter GmbH & Co. KG Process for producing a metallic pattern on an insulating substrate, and insulating substrate with a metallic pattern, particularly a printed circuit

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079604A (en) * 1983-10-05 1985-05-07 株式会社村田製作所 Method of producing polyacrylonitrile conductive film
GB8613161D0 (en) * 1986-05-30 1986-07-02 Exxon Chemical Patents Inc Sealable films
JPH0826462B2 (en) * 1987-11-30 1996-03-13 龍徳 四十宮 Method for producing molded product of surface metallized polymer
GB2264717A (en) * 1992-03-06 1993-09-08 Zinex Corp Cyanide-free copper plating bath
US5545430A (en) * 1994-12-02 1996-08-13 Motorola, Inc. Method and reduction solution for metallizing a surface
TWI347982B (en) 2006-07-07 2011-09-01 Rohm & Haas Elect Mat Improved electroless copper compositions
TWI347373B (en) 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
TWI348499B (en) 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
KR20140019175A (en) * 2012-08-06 2014-02-14 삼성전기주식회사 Catalyst solution for electroless copper plating, producing method thereof, and electroless copper plating method using the same
US9364822B2 (en) * 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
TWI680207B (en) * 2014-12-17 2019-12-21 德商德國艾托特克公司 Plating bath composition and method for electroless plating of palladium
EP3747575B1 (en) 2018-01-29 2024-01-31 Kyocera Corporation Coated tool, and cutting tool comprising same
KR102471907B1 (en) 2018-01-29 2022-11-29 교세라 가부시키가이샤 Coated tool and cutting tool equipped with the same
JP7037580B2 (en) 2018-01-29 2022-03-16 京セラ株式会社 Covering tool and cutting tool equipped with it
CN113165083B (en) 2018-11-29 2024-01-26 京瓷株式会社 Coated cutting tool and cutting tool provided with same
CN114150299A (en) * 2021-04-27 2022-03-08 天津大学 Chemical deposition method for preparing ultra-low profile copper foil and copper-clad plate thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2440139A1 (en) * 1978-10-27 1980-05-23 Schering Ag PROCESS FOR MAKING METAL DRAWINGS ON AN INSULATING SUPPORT
EP0160966A2 (en) * 1984-05-11 1985-11-13 Dr.Ing. Max Schlötter GmbH & Co. KG Process for producing a metallic pattern on an insulating substrate, and insulating substrate with a metallic pattern, particularly a printed circuit
EP0160966A3 (en) * 1984-05-11 1987-07-01 Dr.Ing. Max Schlotter Gmbh & Co. Kg Process for producing a metallic pattern on an insulating substrate, and insulating substrate with a metallic pattern, particularly a printed circuit

Also Published As

Publication number Publication date
IT961765B (en) 1973-12-10
NL174739B (en) 1984-03-01
FR2147338B1 (en) 1974-10-04
NL174739C (en) 1984-08-01
JPS5726344B2 (en) 1982-06-03
AU4502272A (en) 1974-01-31
NL7210533A (en) 1973-01-31
DK145681C (en) 1983-08-01
JPS533732B1 (en) 1978-02-09
JPS52151636A (en) 1977-12-16
JPS52155138A (en) 1977-12-23
CH606204A5 (en) 1978-10-31
DE2238003B2 (en) 1976-12-30
GB1397091A (en) 1975-06-11
AT316956B (en) 1974-08-12
AU462961B2 (en) 1975-07-10
DE2238003A1 (en) 1973-02-15
CA968908A (en) 1975-06-10
SE385129B (en) 1976-06-08
JPS564144B2 (en) 1981-01-28
DK145681B (en) 1983-01-24

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Legal Events

Date Code Title Description
ST Notification of lapse