FR2147338B1 - - Google Patents
Info
- Publication number
- FR2147338B1 FR2147338B1 FR7227535A FR7227535A FR2147338B1 FR 2147338 B1 FR2147338 B1 FR 2147338B1 FR 7227535 A FR7227535 A FR 7227535A FR 7227535 A FR7227535 A FR 7227535A FR 2147338 B1 FR2147338 B1 FR 2147338B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
- Surface Treatment Of Glass (AREA)
- Decoration Of Textiles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16750671A | 1971-07-29 | 1971-07-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2147338A1 FR2147338A1 (en) | 1973-03-09 |
FR2147338B1 true FR2147338B1 (en) | 1974-10-04 |
Family
ID=22607641
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7227535A Expired FR2147338B1 (en) | 1971-07-29 | 1972-07-31 |
Country Status (11)
Country | Link |
---|---|
JP (3) | JPS533732B1 (en) |
AT (1) | AT316956B (en) |
AU (1) | AU462961B2 (en) |
CA (1) | CA968908A (en) |
CH (1) | CH606204A5 (en) |
DK (1) | DK145681C (en) |
FR (1) | FR2147338B1 (en) |
GB (1) | GB1397091A (en) |
IT (1) | IT961765B (en) |
NL (1) | NL174739C (en) |
SE (1) | SE385129B (en) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2847298A1 (en) * | 1978-10-27 | 1980-05-08 | Schering Ag | METHOD FOR PRODUCING METAL PATTERNS ON AN INSULATING SUPPORT |
JPS6079604A (en) * | 1983-10-05 | 1985-05-07 | 株式会社村田製作所 | Method of producing polyacrylonitrile conductive film |
DE3417563C2 (en) * | 1984-05-11 | 1986-12-04 | Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen | Process for the production of metal patterns on insulating substrates, in particular printed circuits |
GB8613161D0 (en) * | 1986-05-30 | 1986-07-02 | Exxon Chemical Patents Inc | Sealable films |
JPH0826462B2 (en) * | 1987-11-30 | 1996-03-13 | 龍徳 四十宮 | Method for producing molded product of surface metallized polymer |
GB2264717A (en) * | 1992-03-06 | 1993-09-08 | Zinex Corp | Cyanide-free copper plating bath |
US5545430A (en) * | 1994-12-02 | 1996-08-13 | Motorola, Inc. | Method and reduction solution for metallizing a surface |
TWI347982B (en) | 2006-07-07 | 2011-09-01 | Rohm & Haas Elect Mat | Improved electroless copper compositions |
TWI347373B (en) | 2006-07-07 | 2011-08-21 | Rohm & Haas Elect Mat | Formaldehyde free electroless copper compositions |
TWI348499B (en) | 2006-07-07 | 2011-09-11 | Rohm & Haas Elect Mat | Electroless copper and redox couples |
KR20140019175A (en) * | 2012-08-06 | 2014-02-14 | 삼성전기주식회사 | Catalyst solution for electroless copper plating, producing method thereof, and electroless copper plating method using the same |
US9364822B2 (en) * | 2013-06-28 | 2016-06-14 | Rohm And Haas Electronic Materials Llc | Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds |
TWI680207B (en) * | 2014-12-17 | 2019-12-21 | 德商德國艾托特克公司 | Plating bath composition and method for electroless plating of palladium |
US11541468B2 (en) | 2018-01-29 | 2023-01-03 | Kyocera Corporation | Coated tool and cutting tool including same |
EP3747575B1 (en) | 2018-01-29 | 2024-01-31 | Kyocera Corporation | Coated tool, and cutting tool comprising same |
WO2019146784A1 (en) | 2018-01-29 | 2019-08-01 | 京セラ株式会社 | Coated tool, and cutting tool comprising same |
WO2020111123A1 (en) | 2018-11-29 | 2020-06-04 | 京セラ株式会社 | Coated tool and cutting tool comprising same |
CN114150299A (en) * | 2021-04-27 | 2022-03-08 | 天津大学 | Chemical deposition method for preparing ultra-low profile copper foil and copper-clad plate thereof |
-
1972
- 1972-06-13 CA CA144,575A patent/CA968908A/en not_active Expired
- 1972-07-25 AT AT638772A patent/AT316956B/en not_active IP Right Cessation
- 1972-07-26 AU AU45022/72A patent/AU462961B2/en not_active Expired
- 1972-07-28 GB GB3532072A patent/GB1397091A/en not_active Expired
- 1972-07-28 DK DK375872A patent/DK145681C/en active
- 1972-07-28 SE SE991172A patent/SE385129B/en unknown
- 1972-07-28 CH CH1125672A patent/CH606204A5/xx not_active IP Right Cessation
- 1972-07-29 IT IT5185872A patent/IT961765B/en active
- 1972-07-29 JP JP7641472A patent/JPS533732B1/ja active Pending
- 1972-07-31 FR FR7227535A patent/FR2147338B1/fr not_active Expired
- 1972-07-31 NL NL7210533A patent/NL174739C/en not_active IP Right Cessation
-
1977
- 1977-04-14 JP JP4402577A patent/JPS52155138A/en active Granted
- 1977-04-14 JP JP4402677A patent/JPS52151636A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS564144B2 (en) | 1981-01-28 |
FR2147338A1 (en) | 1973-03-09 |
DK145681B (en) | 1983-01-24 |
NL174739C (en) | 1984-08-01 |
AU4502272A (en) | 1974-01-31 |
AU462961B2 (en) | 1975-07-10 |
DE2238003A1 (en) | 1973-02-15 |
AT316956B (en) | 1974-08-12 |
SE385129B (en) | 1976-06-08 |
NL174739B (en) | 1984-03-01 |
NL7210533A (en) | 1973-01-31 |
DE2238003B2 (en) | 1976-12-30 |
CH606204A5 (en) | 1978-10-31 |
DK145681C (en) | 1983-08-01 |
JPS52155138A (en) | 1977-12-23 |
JPS533732B1 (en) | 1978-02-09 |
JPS52151636A (en) | 1977-12-16 |
IT961765B (en) | 1973-12-10 |
GB1397091A (en) | 1975-06-11 |
JPS5726344B2 (en) | 1982-06-03 |
CA968908A (en) | 1975-06-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |