JPS5726344B2 - - Google Patents

Info

Publication number
JPS5726344B2
JPS5726344B2 JP4402677A JP4402677A JPS5726344B2 JP S5726344 B2 JPS5726344 B2 JP S5726344B2 JP 4402677 A JP4402677 A JP 4402677A JP 4402677 A JP4402677 A JP 4402677A JP S5726344 B2 JPS5726344 B2 JP S5726344B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4402677A
Other languages
Japanese (ja)
Other versions
JPS52151636A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS52151636A publication Critical patent/JPS52151636A/en
Publication of JPS5726344B2 publication Critical patent/JPS5726344B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemically Coating (AREA)
  • Surface Treatment Of Glass (AREA)
  • Decoration Of Textiles (AREA)
JP4402677A 1971-07-29 1977-04-14 Composition for sensitizing treatment Granted JPS52151636A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US16750671A 1971-07-29 1971-07-29

Publications (2)

Publication Number Publication Date
JPS52151636A JPS52151636A (en) 1977-12-16
JPS5726344B2 true JPS5726344B2 (en) 1982-06-03

Family

ID=22607641

Family Applications (3)

Application Number Title Priority Date Filing Date
JP7641472A Pending JPS533732B1 (en) 1971-07-29 1972-07-29
JP4402577A Granted JPS52155138A (en) 1971-07-29 1977-04-14 Production method of metallized products
JP4402677A Granted JPS52151636A (en) 1971-07-29 1977-04-14 Composition for sensitizing treatment

Family Applications Before (2)

Application Number Title Priority Date Filing Date
JP7641472A Pending JPS533732B1 (en) 1971-07-29 1972-07-29
JP4402577A Granted JPS52155138A (en) 1971-07-29 1977-04-14 Production method of metallized products

Country Status (11)

Country Link
JP (3) JPS533732B1 (en)
AT (1) AT316956B (en)
AU (1) AU462961B2 (en)
CA (1) CA968908A (en)
CH (1) CH606204A5 (en)
DK (1) DK145681C (en)
FR (1) FR2147338B1 (en)
GB (1) GB1397091A (en)
IT (1) IT961765B (en)
NL (1) NL174739C (en)
SE (1) SE385129B (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2847298A1 (en) * 1978-10-27 1980-05-08 Schering Ag METHOD FOR PRODUCING METAL PATTERNS ON AN INSULATING SUPPORT
JPS6079604A (en) * 1983-10-05 1985-05-07 株式会社村田製作所 Method of producing polyacrylonitrile conductive film
DE3417563C2 (en) * 1984-05-11 1986-12-04 Dr.-Ing. Max Schlötter GmbH & Co KG, 7340 Geislingen Process for the production of metal patterns on insulating substrates, in particular printed circuits
GB8613161D0 (en) * 1986-05-30 1986-07-02 Exxon Chemical Patents Inc Sealable films
JPH0826462B2 (en) * 1987-11-30 1996-03-13 龍徳 四十宮 Method for producing molded product of surface metallized polymer
GB2264717A (en) * 1992-03-06 1993-09-08 Zinex Corp Cyanide-free copper plating bath
US5545430A (en) * 1994-12-02 1996-08-13 Motorola, Inc. Method and reduction solution for metallizing a surface
TWI347982B (en) 2006-07-07 2011-09-01 Rohm & Haas Elect Mat Improved electroless copper compositions
TWI347373B (en) 2006-07-07 2011-08-21 Rohm & Haas Elect Mat Formaldehyde free electroless copper compositions
TWI348499B (en) 2006-07-07 2011-09-11 Rohm & Haas Elect Mat Electroless copper and redox couples
KR20140019175A (en) * 2012-08-06 2014-02-14 삼성전기주식회사 Catalyst solution for electroless copper plating, producing method thereof, and electroless copper plating method using the same
US9364822B2 (en) * 2013-06-28 2016-06-14 Rohm And Haas Electronic Materials Llc Catalysts for electroless metallization containing five-membered heterocyclic nitrogen compounds
TWI680207B (en) * 2014-12-17 2019-12-21 德商德國艾托特克公司 Plating bath composition and method for electroless plating of palladium
EP3747575B1 (en) 2018-01-29 2024-01-31 Kyocera Corporation Coated tool, and cutting tool comprising same
KR102471907B1 (en) 2018-01-29 2022-11-29 교세라 가부시키가이샤 Coated tool and cutting tool equipped with the same
JP7037580B2 (en) 2018-01-29 2022-03-16 京セラ株式会社 Covering tool and cutting tool equipped with it
CN113165083B (en) 2018-11-29 2024-01-26 京瓷株式会社 Coated cutting tool and cutting tool provided with same
CN114150299A (en) * 2021-04-27 2022-03-08 天津大学 Chemical deposition method for preparing ultra-low profile copper foil and copper-clad plate thereof

Also Published As

Publication number Publication date
IT961765B (en) 1973-12-10
NL174739B (en) 1984-03-01
FR2147338A1 (en) 1973-03-09
FR2147338B1 (en) 1974-10-04
NL174739C (en) 1984-08-01
AU4502272A (en) 1974-01-31
NL7210533A (en) 1973-01-31
DK145681C (en) 1983-08-01
JPS533732B1 (en) 1978-02-09
JPS52151636A (en) 1977-12-16
JPS52155138A (en) 1977-12-23
CH606204A5 (en) 1978-10-31
DE2238003B2 (en) 1976-12-30
GB1397091A (en) 1975-06-11
AT316956B (en) 1974-08-12
AU462961B2 (en) 1975-07-10
DE2238003A1 (en) 1973-02-15
CA968908A (en) 1975-06-10
SE385129B (en) 1976-06-08
JPS564144B2 (en) 1981-01-28
DK145681B (en) 1983-01-24

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