GB1529151A - Electroless copper plating - Google Patents
Electroless copper platingInfo
- Publication number
- GB1529151A GB1529151A GB14464/77A GB1446477A GB1529151A GB 1529151 A GB1529151 A GB 1529151A GB 14464/77 A GB14464/77 A GB 14464/77A GB 1446477 A GB1446477 A GB 1446477A GB 1529151 A GB1529151 A GB 1529151A
- Authority
- GB
- United Kingdom
- Prior art keywords
- copper
- bath
- plating bath
- copper ion
- april
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
1529151 Maintaining the concentration in an electroless Cu plating bath KOLLMORGEN TECHNOLOGY CORP 5 April 1977 [8 April 1976 28 May 1976] 14464/77 Heading C7F Maintaining the copper ion concentration in an electroless plating bath comprising an aqueous alkaline medium, a copper ion complexing agent and a copper ion reducing agent by either interrupting the copper deposition or withdrawing a portion of the plating bath and contacting the bath or portion thereof with a copper containing substance. The salt-forming anion content is substantially less than one equivalent weight per equivalent weight of copper therein and the copper contents of said substance is capable of forming a copper complex with said copper ion complexing agent to replenish the copper content of the bath or portion thereof and the copper deposition in the enriched bath is either continued or the enriched portion returned to the bath.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US67476676A | 1976-04-08 | 1976-04-08 | |
US69113176A | 1976-05-28 | 1976-05-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1529151A true GB1529151A (en) | 1978-10-18 |
Family
ID=27101214
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB14464/77A Expired GB1529151A (en) | 1976-04-08 | 1977-04-05 | Electroless copper plating |
Country Status (13)
Country | Link |
---|---|
JP (1) | JPS5932542B2 (en) |
AT (1) | AT351884B (en) |
AU (1) | AU509685B2 (en) |
CA (1) | CA1093911A (en) |
CH (1) | CH633585A5 (en) |
DE (1) | DE2715850C2 (en) |
DK (1) | DK158977A (en) |
FR (1) | FR2347453A1 (en) |
GB (1) | GB1529151A (en) |
IL (1) | IL51772A (en) |
IT (1) | IT1115850B (en) |
NL (1) | NL7703878A (en) |
SE (1) | SE431351B (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3043065A1 (en) * | 1979-12-29 | 1981-07-02 | Uemura Kogyo Kk | METHOD AND DEVICE FOR CONTROLLING A BATH FOR ELECTRIC PLATING |
GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
FR2569725A1 (en) * | 1984-09-04 | 1986-03-07 | Kollmorgen Tech Corp | METHOD FOR SELECTIVE METALLIZATION OF INSULATING SUBSTRATES OF CIRCUIT PADS |
US4770788A (en) * | 1985-04-25 | 1988-09-13 | Kollmorgen Technologies Corp. | Process for removing metal complexes from waste solutions |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8005024A (en) * | 1980-09-05 | 1982-04-01 | Philips Nv | METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE |
JPS599159A (en) * | 1982-07-07 | 1984-01-18 | Kanto Kasei Kogyo Kk | Method and apparatus for adjusting concentration of electroless plating bath |
JPS5993863A (en) * | 1982-11-17 | 1984-05-30 | Hitachi Chem Co Ltd | Method for supplying copper ion to electroless copper plating solution |
JPS6118538A (en) * | 1984-07-05 | 1986-01-27 | Kasai Kogyo Co Ltd | Insulator dash for car |
JPS6116950U (en) * | 1984-07-05 | 1986-01-31 | 河西工業株式会社 | Automotive insulator dash |
DE3430775A1 (en) * | 1984-08-21 | 1986-03-06 | Dr. Alois Stankiewicz GmbH, 3101 Adelheidsdorf | CARPET PART, METHOD FOR ITS PRODUCTION AND USE |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2955944A (en) * | 1953-07-03 | 1960-10-11 | Gen Motors Corp | Electroless nickel plating bath control |
US3046159A (en) * | 1957-12-17 | 1962-07-24 | Hughes Aircraft Co | Method of copper plating by chemical reduction |
US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
-
1977
- 1977-02-21 CA CA272,215A patent/CA1093911A/en not_active Expired
- 1977-03-22 JP JP52032788A patent/JPS5932542B2/en not_active Expired
- 1977-03-24 AU AU23573/77A patent/AU509685B2/en not_active Expired
- 1977-03-29 IL IL51772A patent/IL51772A/en unknown
- 1977-04-05 GB GB14464/77A patent/GB1529151A/en not_active Expired
- 1977-04-05 SE SE7703989A patent/SE431351B/en not_active IP Right Cessation
- 1977-04-06 DK DK158977A patent/DK158977A/en not_active IP Right Cessation
- 1977-04-06 IT IT48842/77A patent/IT1115850B/en active
- 1977-04-06 DE DE2715850A patent/DE2715850C2/en not_active Expired
- 1977-04-07 CH CH444377A patent/CH633585A5/en not_active IP Right Cessation
- 1977-04-07 AT AT245477A patent/AT351884B/en not_active IP Right Cessation
- 1977-04-07 NL NL7703878A patent/NL7703878A/en not_active Application Discontinuation
- 1977-04-07 FR FR7710553A patent/FR2347453A1/en active Granted
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3043065A1 (en) * | 1979-12-29 | 1981-07-02 | Uemura Kogyo Kk | METHOD AND DEVICE FOR CONTROLLING A BATH FOR ELECTRIC PLATING |
GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
FR2569725A1 (en) * | 1984-09-04 | 1986-03-07 | Kollmorgen Tech Corp | METHOD FOR SELECTIVE METALLIZATION OF INSULATING SUBSTRATES OF CIRCUIT PADS |
EP0176736A1 (en) * | 1984-09-04 | 1986-04-09 | Kollmorgen Technologies Corporation | Process for selective metallization |
US4770788A (en) * | 1985-04-25 | 1988-09-13 | Kollmorgen Technologies Corp. | Process for removing metal complexes from waste solutions |
Also Published As
Publication number | Publication date |
---|---|
IL51772A0 (en) | 1977-05-31 |
CA1093911A (en) | 1981-01-20 |
IT1115850B (en) | 1986-02-10 |
DK158977A (en) | 1977-10-09 |
FR2347453A1 (en) | 1977-11-04 |
AU2357377A (en) | 1978-09-28 |
DE2715850A1 (en) | 1977-10-13 |
SE7703989L (en) | 1977-10-09 |
FR2347453B1 (en) | 1981-01-09 |
DE2715850C2 (en) | 1982-12-02 |
NL7703878A (en) | 1977-10-11 |
JPS52123335A (en) | 1977-10-17 |
ATA245477A (en) | 1979-01-15 |
IL51772A (en) | 1979-09-30 |
CH633585A5 (en) | 1982-12-15 |
JPS5932542B2 (en) | 1984-08-09 |
AT351884B (en) | 1979-08-27 |
SE431351B (en) | 1984-01-30 |
AU509685B2 (en) | 1980-05-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PCNP | Patent ceased through non-payment of renewal fee |