IL51772A - Electroless copper plating - Google Patents
Electroless copper platingInfo
- Publication number
- IL51772A IL51772A IL51772A IL5177277A IL51772A IL 51772 A IL51772 A IL 51772A IL 51772 A IL51772 A IL 51772A IL 5177277 A IL5177277 A IL 5177277A IL 51772 A IL51772 A IL 51772A
- Authority
- IL
- Israel
- Prior art keywords
- copper plating
- electroless copper
- electroless
- plating
- copper
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US67476676A | 1976-04-08 | 1976-04-08 | |
| US69113176A | 1976-05-28 | 1976-05-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL51772A0 IL51772A0 (en) | 1977-05-31 |
| IL51772A true IL51772A (en) | 1979-09-30 |
Family
ID=27101214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL51772A IL51772A (en) | 1976-04-08 | 1977-03-29 | Electroless copper plating |
Country Status (13)
| Country | Link |
|---|---|
| JP (1) | JPS5932542B2 (en) |
| AT (1) | AT351884B (en) |
| AU (1) | AU509685B2 (en) |
| CA (1) | CA1093911A (en) |
| CH (1) | CH633585A5 (en) |
| DE (1) | DE2715850C2 (en) |
| DK (1) | DK158977A (en) |
| FR (1) | FR2347453A1 (en) |
| GB (1) | GB1529151A (en) |
| IL (1) | IL51772A (en) |
| IT (1) | IT1115850B (en) |
| NL (1) | NL7703878A (en) |
| SE (1) | SE431351B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016517B2 (en) * | 1979-12-29 | 1985-04-25 | 上村工業株式会社 | Electroless plating control method |
| NL8005024A (en) * | 1980-09-05 | 1982-04-01 | Philips Nv | METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE |
| JPS599159A (en) * | 1982-07-07 | 1984-01-18 | Kanto Kasei Kogyo Kk | Method and apparatus for adjusting concentration of electroless plating bath |
| JPS5993863A (en) * | 1982-11-17 | 1984-05-30 | Hitachi Chem Co Ltd | Method for supplying copper ion to electroless copper plating solution |
| GB2134931A (en) * | 1982-12-27 | 1984-08-22 | Ibiden Co Ltd | Non-electrolytic copper plating for printed circuit board |
| JPS6118538A (en) * | 1984-07-05 | 1986-01-27 | Kasai Kogyo Co Ltd | Insulator dash for car |
| JPS6116950U (en) * | 1984-07-05 | 1986-01-31 | 河西工業株式会社 | Automotive insulator dash |
| DE3430775C2 (en) * | 1984-08-21 | 1993-01-28 | Dr. Alois Stankiewicz GmbH, 3101 Adelheidsdorf | Carpet part, process for its manufacture and its use |
| US4668532A (en) * | 1984-09-04 | 1987-05-26 | Kollmorgen Technologies Corporation | System for selective metallization of electronic interconnection boards |
| US4770788A (en) * | 1985-04-25 | 1988-09-13 | Kollmorgen Technologies Corp. | Process for removing metal complexes from waste solutions |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2955944A (en) * | 1953-07-03 | 1960-10-11 | Gen Motors Corp | Electroless nickel plating bath control |
| US3046159A (en) * | 1957-12-17 | 1962-07-24 | Hughes Aircraft Co | Method of copper plating by chemical reduction |
| US3403035A (en) * | 1964-06-24 | 1968-09-24 | Process Res Company | Process for stabilizing autocatalytic metal plating solutions |
-
1977
- 1977-02-21 CA CA272,215A patent/CA1093911A/en not_active Expired
- 1977-03-22 JP JP52032788A patent/JPS5932542B2/en not_active Expired
- 1977-03-24 AU AU23573/77A patent/AU509685B2/en not_active Expired
- 1977-03-29 IL IL51772A patent/IL51772A/en unknown
- 1977-04-05 SE SE7703989A patent/SE431351B/en not_active IP Right Cessation
- 1977-04-05 GB GB14464/77A patent/GB1529151A/en not_active Expired
- 1977-04-06 DK DK158977A patent/DK158977A/en not_active IP Right Cessation
- 1977-04-06 IT IT48842/77A patent/IT1115850B/en active
- 1977-04-06 DE DE2715850A patent/DE2715850C2/en not_active Expired
- 1977-04-07 AT AT245477A patent/AT351884B/en not_active IP Right Cessation
- 1977-04-07 FR FR7710553A patent/FR2347453A1/en active Granted
- 1977-04-07 NL NL7703878A patent/NL7703878A/en not_active Application Discontinuation
- 1977-04-07 CH CH444377A patent/CH633585A5/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| SE7703989L (en) | 1977-10-09 |
| IT1115850B (en) | 1986-02-10 |
| DE2715850A1 (en) | 1977-10-13 |
| NL7703878A (en) | 1977-10-11 |
| CH633585A5 (en) | 1982-12-15 |
| JPS52123335A (en) | 1977-10-17 |
| DK158977A (en) | 1977-10-09 |
| GB1529151A (en) | 1978-10-18 |
| AU2357377A (en) | 1978-09-28 |
| CA1093911A (en) | 1981-01-20 |
| JPS5932542B2 (en) | 1984-08-09 |
| SE431351B (en) | 1984-01-30 |
| IL51772A0 (en) | 1977-05-31 |
| DE2715850C2 (en) | 1982-12-02 |
| FR2347453A1 (en) | 1977-11-04 |
| FR2347453B1 (en) | 1981-01-09 |
| AU509685B2 (en) | 1980-05-22 |
| ATA245477A (en) | 1979-01-15 |
| AT351884B (en) | 1979-08-27 |
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