JPS52142774A - Plating - Google Patents
PlatingInfo
- Publication number
- JPS52142774A JPS52142774A JP6077376A JP6077376A JPS52142774A JP S52142774 A JPS52142774 A JP S52142774A JP 6077376 A JP6077376 A JP 6077376A JP 6077376 A JP6077376 A JP 6077376A JP S52142774 A JPS52142774 A JP S52142774A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6077376A JPS52142774A (en) | 1976-05-25 | 1976-05-25 | Plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6077376A JPS52142774A (en) | 1976-05-25 | 1976-05-25 | Plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52142774A true JPS52142774A (en) | 1977-11-28 |
Family
ID=13151931
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6077376A Pending JPS52142774A (en) | 1976-05-25 | 1976-05-25 | Plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52142774A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5531140A (en) * | 1978-08-25 | 1980-03-05 | Tanaka Kikinzoku Kogyo Kk | Pretreatment method of brazing filler metal substrate for electroforming |
WO2001029283A1 (en) * | 1999-10-19 | 2001-04-26 | Ebara Corporation | Plating method, wiring forming method and devices therefor |
US9799594B2 (en) * | 2014-01-27 | 2017-10-24 | Fujifilm Corporation | Microstructure, multilayer wiring board, semiconductor package and microstructure manufacturing method |
-
1976
- 1976-05-25 JP JP6077376A patent/JPS52142774A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5531140A (en) * | 1978-08-25 | 1980-03-05 | Tanaka Kikinzoku Kogyo Kk | Pretreatment method of brazing filler metal substrate for electroforming |
JPS6250558B2 (en) * | 1978-08-25 | 1987-10-26 | Tanaka Precious Metal Ind | |
WO2001029283A1 (en) * | 1999-10-19 | 2001-04-26 | Ebara Corporation | Plating method, wiring forming method and devices therefor |
US6709555B1 (en) | 1999-10-19 | 2004-03-23 | Ebara Corporation | Plating method, interconnection forming method, and apparatus for carrying out those methods |
US9799594B2 (en) * | 2014-01-27 | 2017-10-24 | Fujifilm Corporation | Microstructure, multilayer wiring board, semiconductor package and microstructure manufacturing method |
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