JPS52142774A - Plating - Google Patents

Plating

Info

Publication number
JPS52142774A
JPS52142774A JP6077376A JP6077376A JPS52142774A JP S52142774 A JPS52142774 A JP S52142774A JP 6077376 A JP6077376 A JP 6077376A JP 6077376 A JP6077376 A JP 6077376A JP S52142774 A JPS52142774 A JP S52142774A
Authority
JP
Japan
Prior art keywords
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6077376A
Other languages
Japanese (ja)
Inventor
Yutaka Hosokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP6077376A priority Critical patent/JPS52142774A/en
Publication of JPS52142774A publication Critical patent/JPS52142774A/en
Pending legal-status Critical Current

Links

JP6077376A 1976-05-25 1976-05-25 Plating Pending JPS52142774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6077376A JPS52142774A (en) 1976-05-25 1976-05-25 Plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6077376A JPS52142774A (en) 1976-05-25 1976-05-25 Plating

Publications (1)

Publication Number Publication Date
JPS52142774A true JPS52142774A (en) 1977-11-28

Family

ID=13151931

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6077376A Pending JPS52142774A (en) 1976-05-25 1976-05-25 Plating

Country Status (1)

Country Link
JP (1) JPS52142774A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5531140A (en) * 1978-08-25 1980-03-05 Tanaka Kikinzoku Kogyo Kk Pretreatment method of brazing filler metal substrate for electroforming
WO2001029283A1 (en) * 1999-10-19 2001-04-26 Ebara Corporation Plating method, wiring forming method and devices therefor
US9799594B2 (en) * 2014-01-27 2017-10-24 Fujifilm Corporation Microstructure, multilayer wiring board, semiconductor package and microstructure manufacturing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5531140A (en) * 1978-08-25 1980-03-05 Tanaka Kikinzoku Kogyo Kk Pretreatment method of brazing filler metal substrate for electroforming
JPS6250558B2 (en) * 1978-08-25 1987-10-26 Tanaka Precious Metal Ind
WO2001029283A1 (en) * 1999-10-19 2001-04-26 Ebara Corporation Plating method, wiring forming method and devices therefor
US6709555B1 (en) 1999-10-19 2004-03-23 Ebara Corporation Plating method, interconnection forming method, and apparatus for carrying out those methods
US9799594B2 (en) * 2014-01-27 2017-10-24 Fujifilm Corporation Microstructure, multilayer wiring board, semiconductor package and microstructure manufacturing method

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