AU509685B2 - Electroless Copper Plating - Google Patents

Electroless Copper Plating

Info

Publication number
AU509685B2
AU509685B2 AU23573/77A AU2357377A AU509685B2 AU 509685 B2 AU509685 B2 AU 509685B2 AU 23573/77 A AU23573/77 A AU 23573/77A AU 2357377 A AU2357377 A AU 2357377A AU 509685 B2 AU509685 B2 AU 509685B2
Authority
AU
Australia
Prior art keywords
copper plating
electroless copper
electroless
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU23573/77A
Other versions
AU2357377A (en
Inventor
G. A. McCormack J. F. Williamson J. D. and Zeblisky R. J Butter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of AU2357377A publication Critical patent/AU2357377A/en
Application granted granted Critical
Publication of AU509685B2 publication Critical patent/AU509685B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
AU23573/77A 1976-04-08 1977-03-24 Electroless Copper Plating Expired AU509685B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US67476676A 1976-04-08 1976-04-08
USUS674766 1976-04-08
US69113176A 1976-05-28 1976-05-28
USUS691131 1976-05-28

Publications (2)

Publication Number Publication Date
AU2357377A AU2357377A (en) 1978-09-28
AU509685B2 true AU509685B2 (en) 1980-05-22

Family

ID=27101214

Family Applications (1)

Application Number Title Priority Date Filing Date
AU23573/77A Expired AU509685B2 (en) 1976-04-08 1977-03-24 Electroless Copper Plating

Country Status (13)

Country Link
JP (1) JPS5932542B2 (en)
AT (1) AT351884B (en)
AU (1) AU509685B2 (en)
CA (1) CA1093911A (en)
CH (1) CH633585A5 (en)
DE (1) DE2715850C2 (en)
DK (1) DK158977A (en)
FR (1) FR2347453A1 (en)
GB (1) GB1529151A (en)
IL (1) IL51772A (en)
IT (1) IT1115850B (en)
NL (1) NL7703878A (en)
SE (1) SE431351B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016517B2 (en) * 1979-12-29 1985-04-25 上村工業株式会社 Electroless plating control method
NL8005024A (en) * 1980-09-05 1982-04-01 Philips Nv METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE
JPS599159A (en) * 1982-07-07 1984-01-18 Kanto Kasei Kogyo Kk Method and apparatus for adjusting concentration of electroless plating bath
JPS5993863A (en) * 1982-11-17 1984-05-30 Hitachi Chem Co Ltd Method for supplying copper ion to electroless copper plating solution
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
JPS6118538A (en) * 1984-07-05 1986-01-27 Kasai Kogyo Co Ltd Insulator dash for car
JPS6116950U (en) * 1984-07-05 1986-01-31 河西工業株式会社 Automotive insulator dash
DE3430775C2 (en) * 1984-08-21 1993-01-28 Dr. Alois Stankiewicz GmbH, 3101 Adelheidsdorf Carpet part, process for its manufacture and its use
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4770788A (en) * 1985-04-25 1988-09-13 Kollmorgen Technologies Corp. Process for removing metal complexes from waste solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955944A (en) * 1953-07-03 1960-10-11 Gen Motors Corp Electroless nickel plating bath control
US3046159A (en) * 1957-12-17 1962-07-24 Hughes Aircraft Co Method of copper plating by chemical reduction
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions

Also Published As

Publication number Publication date
SE7703989L (en) 1977-10-09
IT1115850B (en) 1986-02-10
DE2715850A1 (en) 1977-10-13
NL7703878A (en) 1977-10-11
CH633585A5 (en) 1982-12-15
JPS52123335A (en) 1977-10-17
DK158977A (en) 1977-10-09
GB1529151A (en) 1978-10-18
AU2357377A (en) 1978-09-28
CA1093911A (en) 1981-01-20
JPS5932542B2 (en) 1984-08-09
SE431351B (en) 1984-01-30
IL51772A0 (en) 1977-05-31
DE2715850C2 (en) 1982-12-02
FR2347453A1 (en) 1977-11-04
FR2347453B1 (en) 1981-01-09
IL51772A (en) 1979-09-30
ATA245477A (en) 1979-01-15
AT351884B (en) 1979-08-27

Similar Documents

Publication Publication Date Title
AU535517B2 (en) Electroless copper deposition
DE2964079D1 (en) An electroless copper plating process
AU536632B2 (en) Electroless copper deposition solution
JPS52141428A (en) Electroless nickel plating
DE3066952D1 (en) Electroless copper plating solution
AU532144B2 (en) Electroless copper deposition
AU512805B2 (en) Control ofan electroless copper plating bath
AU509685B2 (en) Electroless Copper Plating
AU507305B2 (en) Nickel plating
JPS5370931A (en) Nonnelectrolytic copper plating method
AU501210B2 (en) Electroless copper plating bath
AU544591B2 (en) Electroless copper plating
AU506628B2 (en) Electroless plating
JPS5448646A (en) Copper electroplating
ZA762314B (en) Electroless plating substrates
JPS5217334A (en) Electroless copper plating solution
JPS51135836A (en) Electroless copper plating solusion
JPS52142774A (en) Plating
ZA77431B (en) Electroless copper plating
AU509072B2 (en) Electroless copper plating solution
GB1555434A (en) Electroless copper plating solutions
JPS52152831A (en) Substitution copper plating solution
JPS53142328A (en) Solution for nonnelectrolytic copper plating
JPS5285935A (en) Peeling solution for copper plating
AU504570B2 (en) Brass plating