JPS52123335A - Method of controlling concentration of copper ions and that of salttforming anions in nonnelectrolytic copper deposition bath - Google Patents

Method of controlling concentration of copper ions and that of salttforming anions in nonnelectrolytic copper deposition bath

Info

Publication number
JPS52123335A
JPS52123335A JP3278877A JP3278877A JPS52123335A JP S52123335 A JPS52123335 A JP S52123335A JP 3278877 A JP3278877 A JP 3278877A JP 3278877 A JP3278877 A JP 3278877A JP S52123335 A JPS52123335 A JP S52123335A
Authority
JP
Japan
Prior art keywords
copper
salttforming
nonnelectrolytic
anions
deposition bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3278877A
Other languages
Japanese (ja)
Other versions
JPS5932542B2 (en
Inventor
Oogasuto Bataa Jiyooji
Furanshisu Matsukoomatsu Jiyon
Datsufu Uiriamuson Jiyon
Jiyon Zeburisukii Rudorufu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Technologies Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of JPS52123335A publication Critical patent/JPS52123335A/en
Publication of JPS5932542B2 publication Critical patent/JPS5932542B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP52032788A 1976-04-08 1977-03-22 Method for controlling copper ion concentration and salt-forming anion concentration in electroless copper deposition bath Expired JPS5932542B2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US67476676A 1976-04-08 1976-04-08
US000000674766 1976-04-08
US69113176A 1976-05-28 1976-05-28
US000000691131 1976-05-28

Publications (2)

Publication Number Publication Date
JPS52123335A true JPS52123335A (en) 1977-10-17
JPS5932542B2 JPS5932542B2 (en) 1984-08-09

Family

ID=27101214

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52032788A Expired JPS5932542B2 (en) 1976-04-08 1977-03-22 Method for controlling copper ion concentration and salt-forming anion concentration in electroless copper deposition bath

Country Status (13)

Country Link
JP (1) JPS5932542B2 (en)
AT (1) AT351884B (en)
AU (1) AU509685B2 (en)
CA (1) CA1093911A (en)
CH (1) CH633585A5 (en)
DE (1) DE2715850C2 (en)
DK (1) DK158977A (en)
FR (1) FR2347453A1 (en)
GB (1) GB1529151A (en)
IL (1) IL51772A (en)
IT (1) IT1115850B (en)
NL (1) NL7703878A (en)
SE (1) SE431351B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599159A (en) * 1982-07-07 1984-01-18 Kanto Kasei Kogyo Kk Method and apparatus for adjusting concentration of electroless plating bath
JPS5993863A (en) * 1982-11-17 1984-05-30 Hitachi Chem Co Ltd Method for supplying copper ion to electroless copper plating solution

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016517B2 (en) * 1979-12-29 1985-04-25 上村工業株式会社 Electroless plating control method
NL8005024A (en) * 1980-09-05 1982-04-01 Philips Nv METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
JPS6116950U (en) * 1984-07-05 1986-01-31 河西工業株式会社 Automotive insulator dash
JPS6118538A (en) * 1984-07-05 1986-01-27 Kasai Kogyo Co Ltd Insulator dash for car
DE3430775A1 (en) * 1984-08-21 1986-03-06 Dr. Alois Stankiewicz GmbH, 3101 Adelheidsdorf CARPET PART, METHOD FOR ITS PRODUCTION AND USE
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4770788A (en) * 1985-04-25 1988-09-13 Kollmorgen Technologies Corp. Process for removing metal complexes from waste solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955944A (en) * 1953-07-03 1960-10-11 Gen Motors Corp Electroless nickel plating bath control
US3046159A (en) * 1957-12-17 1962-07-24 Hughes Aircraft Co Method of copper plating by chemical reduction
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599159A (en) * 1982-07-07 1984-01-18 Kanto Kasei Kogyo Kk Method and apparatus for adjusting concentration of electroless plating bath
JPS5993863A (en) * 1982-11-17 1984-05-30 Hitachi Chem Co Ltd Method for supplying copper ion to electroless copper plating solution

Also Published As

Publication number Publication date
IL51772A0 (en) 1977-05-31
SE7703989L (en) 1977-10-09
AU509685B2 (en) 1980-05-22
IT1115850B (en) 1986-02-10
NL7703878A (en) 1977-10-11
DE2715850A1 (en) 1977-10-13
JPS5932542B2 (en) 1984-08-09
DK158977A (en) 1977-10-09
FR2347453B1 (en) 1981-01-09
CA1093911A (en) 1981-01-20
IL51772A (en) 1979-09-30
GB1529151A (en) 1978-10-18
ATA245477A (en) 1979-01-15
CH633585A5 (en) 1982-12-15
AU2357377A (en) 1978-09-28
AT351884B (en) 1979-08-27
FR2347453A1 (en) 1977-11-04
SE431351B (en) 1984-01-30
DE2715850C2 (en) 1982-12-02

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