SE7703989L - PROCEDURE FOR DISCONNECTING COPPER COATINGS - Google Patents

PROCEDURE FOR DISCONNECTING COPPER COATINGS

Info

Publication number
SE7703989L
SE7703989L SE7703989A SE7703989A SE7703989L SE 7703989 L SE7703989 L SE 7703989L SE 7703989 A SE7703989 A SE 7703989A SE 7703989 A SE7703989 A SE 7703989A SE 7703989 L SE7703989 L SE 7703989L
Authority
SE
Sweden
Prior art keywords
copper
bath
plating bath
copper ion
april
Prior art date
Application number
SE7703989A
Other languages
Unknown language ( )
Swedish (sv)
Other versions
SE431351B (en
Inventor
G A Butter
J F Mccormack
J D Williamsom
R J Zeblisky
Original Assignee
Kollmorgen Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp
Publication of SE7703989L publication Critical patent/SE7703989L/en
Publication of SE431351B publication Critical patent/SE431351B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
    • C23C18/405—Formaldehyde
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

1529151 Maintaining the concentration in an electroless Cu plating bath KOLLMORGEN TECHNOLOGY CORP 5 April 1977 [8 April 1976 28 May 1976] 14464/77 Heading C7F Maintaining the copper ion concentration in an electroless plating bath comprising an aqueous alkaline medium, a copper ion complexing agent and a copper ion reducing agent by either interrupting the copper deposition or withdrawing a portion of the plating bath and contacting the bath or portion thereof with a copper containing substance. The salt-forming anion content is substantially less than one equivalent weight per equivalent weight of copper therein and the copper contents of said substance is capable of forming a copper complex with said copper ion complexing agent to replenish the copper content of the bath or portion thereof and the copper deposition in the enriched bath is either continued or the enriched portion returned to the bath.
SE7703989A 1976-04-08 1977-04-05 PROCEDURE FOR OPERATING A COPPER OR COPPER ALLOY BATHROOM SE431351B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US67476676A 1976-04-08 1976-04-08
US69113176A 1976-05-28 1976-05-28

Publications (2)

Publication Number Publication Date
SE7703989L true SE7703989L (en) 1977-10-09
SE431351B SE431351B (en) 1984-01-30

Family

ID=27101214

Family Applications (1)

Application Number Title Priority Date Filing Date
SE7703989A SE431351B (en) 1976-04-08 1977-04-05 PROCEDURE FOR OPERATING A COPPER OR COPPER ALLOY BATHROOM

Country Status (13)

Country Link
JP (1) JPS5932542B2 (en)
AT (1) AT351884B (en)
AU (1) AU509685B2 (en)
CA (1) CA1093911A (en)
CH (1) CH633585A5 (en)
DE (1) DE2715850C2 (en)
DK (1) DK158977A (en)
FR (1) FR2347453A1 (en)
GB (1) GB1529151A (en)
IL (1) IL51772A (en)
IT (1) IT1115850B (en)
NL (1) NL7703878A (en)
SE (1) SE431351B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016517B2 (en) * 1979-12-29 1985-04-25 上村工業株式会社 Electroless plating control method
NL8005024A (en) * 1980-09-05 1982-04-01 Philips Nv METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE
JPS599159A (en) * 1982-07-07 1984-01-18 Kanto Kasei Kogyo Kk Method and apparatus for adjusting concentration of electroless plating bath
JPS5993863A (en) * 1982-11-17 1984-05-30 Hitachi Chem Co Ltd Method for supplying copper ion to electroless copper plating solution
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
JPS6118538A (en) * 1984-07-05 1986-01-27 Kasai Kogyo Co Ltd Insulator dash for car
JPS6116950U (en) * 1984-07-05 1986-01-31 河西工業株式会社 Automotive insulator dash
DE3430775A1 (en) * 1984-08-21 1986-03-06 Dr. Alois Stankiewicz GmbH, 3101 Adelheidsdorf CARPET PART, METHOD FOR ITS PRODUCTION AND USE
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
US4770788A (en) * 1985-04-25 1988-09-13 Kollmorgen Technologies Corp. Process for removing metal complexes from waste solutions

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955944A (en) * 1953-07-03 1960-10-11 Gen Motors Corp Electroless nickel plating bath control
US3046159A (en) * 1957-12-17 1962-07-24 Hughes Aircraft Co Method of copper plating by chemical reduction
US3403035A (en) * 1964-06-24 1968-09-24 Process Res Company Process for stabilizing autocatalytic metal plating solutions

Also Published As

Publication number Publication date
IL51772A0 (en) 1977-05-31
CA1093911A (en) 1981-01-20
IT1115850B (en) 1986-02-10
DK158977A (en) 1977-10-09
FR2347453A1 (en) 1977-11-04
AU2357377A (en) 1978-09-28
DE2715850A1 (en) 1977-10-13
FR2347453B1 (en) 1981-01-09
DE2715850C2 (en) 1982-12-02
NL7703878A (en) 1977-10-11
JPS52123335A (en) 1977-10-17
ATA245477A (en) 1979-01-15
IL51772A (en) 1979-09-30
CH633585A5 (en) 1982-12-15
JPS5932542B2 (en) 1984-08-09
AT351884B (en) 1979-08-27
GB1529151A (en) 1978-10-18
SE431351B (en) 1984-01-30
AU509685B2 (en) 1980-05-22

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