AU532144B2 - Electroless copper deposition - Google Patents

Electroless copper deposition

Info

Publication number
AU532144B2
AU532144B2 AU49567/79A AU4956779A AU532144B2 AU 532144 B2 AU532144 B2 AU 532144B2 AU 49567/79 A AU49567/79 A AU 49567/79A AU 4956779 A AU4956779 A AU 4956779A AU 532144 B2 AU532144 B2 AU 532144B2
Authority
AU
Australia
Prior art keywords
electroless copper
copper deposition
deposition
electroless
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU49567/79A
Other versions
AU4956779A (en
Inventor
John F. Mccormack
Francis J. Nuzzi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Technologies Corp filed Critical Kollmorgen Technologies Corp
Publication of AU4956779A publication Critical patent/AU4956779A/en
Application granted granted Critical
Publication of AU532144B2 publication Critical patent/AU532144B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU49567/79A 1978-09-13 1979-08-03 Electroless copper deposition Ceased AU532144B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US94191278A 1978-09-13 1978-09-13
US941912 1978-09-13

Publications (2)

Publication Number Publication Date
AU4956779A AU4956779A (en) 1980-03-20
AU532144B2 true AU532144B2 (en) 1983-09-22

Family

ID=25477278

Family Applications (1)

Application Number Title Priority Date Filing Date
AU49567/79A Ceased AU532144B2 (en) 1978-09-13 1979-08-03 Electroless copper deposition

Country Status (17)

Country Link
JP (2) JPS5927379B2 (en)
AT (1) AT366105B (en)
AU (1) AU532144B2 (en)
BR (1) BR7905066A (en)
CA (1) CA1135903A (en)
CH (1) CH646200A5 (en)
DE (1) DE2937297C2 (en)
DK (1) DK148920C (en)
ES (1) ES484158A1 (en)
FR (1) FR2436192A1 (en)
GB (1) GB2032462B (en)
IL (1) IL58202A (en)
IT (1) IT1162420B (en)
MX (1) MX152657A (en)
NL (1) NL189523C (en)
SE (1) SE7907531L (en)
ZA (1) ZA793786B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8005024A (en) * 1980-09-05 1982-04-01 Philips Nv METHOD FOR MANUFACTURING COPPER ALLOY LAYERS AND PATTERNS ON SUBSTRATES AND PRODUCTS MADE THEREFORE
DE3585017D1 (en) * 1984-09-27 1992-02-06 Toshiba Kawasaki Kk CURRENT COPPER PLATING SOLUTION.
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
JPH0723539B2 (en) * 1986-11-06 1995-03-15 日本電装株式会社 Chemical copper plating solution and method for forming copper plating film using the same
US4814009A (en) * 1986-11-14 1989-03-21 Nippondenso Co., Ltd. Electroless copper plating solution
JP2615682B2 (en) * 1986-11-14 1997-06-04 株式会社デンソー Chemical copper plating solution
AU3304389A (en) * 1988-04-29 1989-11-02 Kollmorgen Corporation Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures
JP2595319B2 (en) * 1988-07-20 1997-04-02 日本電装株式会社 Chemical copper plating solution and method for forming copper plating film using the same
JPH036383A (en) * 1989-06-02 1991-01-11 Nippondenso Co Ltd Chemical copper plating solution
JPH0448100A (en) * 1990-06-15 1992-02-18 Nkk Corp Washing equipment
US7905994B2 (en) 2007-10-03 2011-03-15 Moses Lake Industries, Inc. Substrate holder and electroplating system
US8262894B2 (en) 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
JP5255015B2 (en) * 2010-04-28 2013-08-07 名古屋メッキ工業株式会社 Electroless copper plating method for polymer fiber
JP5780920B2 (en) * 2011-10-31 2015-09-16 新光電気工業株式会社 Electroless copper plating bath
US20190382901A1 (en) * 2018-06-15 2019-12-19 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
US10590541B2 (en) * 2018-06-15 2020-03-17 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions and methods for electroless plating copper on substrates
CN113881984B (en) * 2021-10-21 2022-09-16 深圳市励高表面处理材料有限公司 Pulse electroplating leveling agent, preparation method and electroplating solution applying leveling solution

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3222195A (en) * 1962-02-23 1965-12-07 Pearlstein Fred Stabilized electroless copper solution
US3361580A (en) * 1963-06-18 1968-01-02 Day Company Electroless copper plating
US3377174A (en) * 1963-10-24 1968-04-09 Torigai Eiichi Method and bath for chemically plating copper
DE1621307B2 (en) * 1966-02-01 1972-01-05 Photocircuits Corp , Glen Cove, N Y (V St A ) REDUCTIVE METALLIZING BATH IN PARTICULAR COPPER BATH
US3720525A (en) * 1971-08-16 1973-03-13 Rca Corp Electroless copper plating solutions with accelerated plating rates
US3708329A (en) * 1971-09-10 1973-01-02 Bell Telephone Labor Inc Electroless copper plating
US3915718A (en) * 1972-10-04 1975-10-28 Schering Ag Chemical silver bath
US3793038A (en) * 1973-01-02 1974-02-19 Crown City Plating Co Process for electroless plating
JPS5173933A (en) * 1974-12-25 1976-06-26 Mitsubishi Rayon Co MUDENKAIDOMETSUKYOKU
JPS5746448B2 (en) * 1975-03-14 1982-10-04
JPS5217335A (en) * 1975-08-01 1977-02-09 Hitachi Ltd Chemical copper plating solution
JPS5288227A (en) * 1976-01-19 1977-07-23 Hitachi Ltd Chemical copper plating solution
IT1059950B (en) * 1976-04-30 1982-06-21 Alfachimici Spa COMPOSITION FOR AUTOCATALYTIC ANELECTRIC COPPERING
JPS56156749A (en) * 1980-05-08 1981-12-03 Toshiba Corp Chemical copper plating solution

Also Published As

Publication number Publication date
DK381979A (en) 1980-03-14
GB2032462B (en) 1983-05-18
CA1135903A (en) 1982-11-23
FR2436192B1 (en) 1983-08-26
IL58202A (en) 1982-08-31
JPS5915981B2 (en) 1984-04-12
JPS5927379B2 (en) 1984-07-05
DK148920C (en) 1986-05-05
SE7907531L (en) 1980-03-14
MX152657A (en) 1985-10-07
FR2436192A1 (en) 1980-04-11
JPS5565355A (en) 1980-05-16
IT7950227A0 (en) 1979-09-11
ES484158A1 (en) 1980-09-01
AU4956779A (en) 1980-03-20
NL7906856A (en) 1980-03-17
ZA793786B (en) 1980-07-30
IT1162420B (en) 1987-04-01
BR7905066A (en) 1980-04-29
NL189523C (en) 1993-05-03
DE2937297A1 (en) 1980-03-20
GB2032462A (en) 1980-05-08
DK148920B (en) 1985-11-18
DE2937297C2 (en) 1982-04-08
ATA600879A (en) 1981-07-15
JPS5925965A (en) 1984-02-10
IL58202A0 (en) 1979-12-30
AT366105B (en) 1982-03-10
CH646200A5 (en) 1984-11-15

Similar Documents

Publication Publication Date Title
AU535517B2 (en) Electroless copper deposition
AU536632B2 (en) Electroless copper deposition solution
GB2039534B (en) Electroless tin-plating solutions
DE2964079D1 (en) An electroless copper plating process
AU526605B2 (en) Deposition method
AU532144B2 (en) Electroless copper deposition
AU557664B2 (en) Deposition process
AU513279B2 (en) Obtaining copper from copper sulphide
JPS5534699A (en) Silver plating
AU509685B2 (en) Electroless Copper Plating
GB2034756B (en) Electroless deposition of transition metals
AU544591B2 (en) Electroless copper plating
JPS54117329A (en) Electroless plating method
AU506628B2 (en) Electroless plating
AU524836B2 (en) Copper alloy cleaning process
AU534916B2 (en) Nickel plating
AU548674B2 (en) Metallization process
AU547739B2 (en) Electroless copper deposition solutions
JPS54124834A (en) Partly electroless plating method
AU8087582A (en) Electroless copper deposition solutions
JPS5517525A (en) Substrate for nonnelectrolysis plating
GB2031022B (en) Copper foilplastic compsites
AU527626B2 (en) Line circuit
DE3175316D1 (en) Electroless copper deposition solutions
AU507410B2 (en) Zinc plating solution