AU3304389A - Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures - Google Patents

Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Info

Publication number
AU3304389A
AU3304389A AU33043/89A AU3304389A AU3304389A AU 3304389 A AU3304389 A AU 3304389A AU 33043/89 A AU33043/89 A AU 33043/89A AU 3304389 A AU3304389 A AU 3304389A AU 3304389 A AU3304389 A AU 3304389A
Authority
AU
Australia
Prior art keywords
deposit
fissures
substrate
essentially free
electroless deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU33043/89A
Inventor
Not Given Name
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US18782288A priority Critical
Priority to US187822 priority
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of AU3304389A publication Critical patent/AU3304389A/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/38Coating with copper
    • C23C18/40Coating with copper using reducing agents
AU33043/89A 1988-04-29 1989-04-14 Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures Abandoned AU3304389A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US18782288A true 1988-04-29 1988-04-29
US187822 1988-04-29

Publications (1)

Publication Number Publication Date
AU3304389A true AU3304389A (en) 1989-11-02

Family

ID=22690615

Family Applications (1)

Application Number Title Priority Date Filing Date
AU33043/89A Abandoned AU3304389A (en) 1988-04-29 1989-04-14 Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures

Country Status (8)

Country Link
EP (1) EP0340649B1 (en)
JP (1) JPH07107193B2 (en)
KR (1) KR890016207A (en)
AU (1) AU3304389A (en)
BR (1) BR8901962A (en)
CA (1) CA1331420C (en)
DE (1) DE3914180C2 (en)
GB (2) GB2218714B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5526458B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
BR112013003430A2 (en) 2010-08-17 2016-06-21 Chemetall Gmbh "process for covering metallic substrates without electric current."

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1522048A (en) * 1966-05-06 1968-04-19 Photocircuits Corp Depositing electroless metal
FR1551275A (en) * 1966-12-19 1968-12-27
ZA7705495B (en) * 1976-11-22 1978-07-26 Kollmorgen Tech Corp Method and apparatus for control of electroless plating solutions
US4301196A (en) 1978-09-13 1981-11-17 Kollmorgen Technologies Corp. Electroless copper deposition process having faster plating rates
CA1135903A (en) * 1978-09-13 1982-11-23 John F. Mccormack Electroless copper deposition process having faster plating rates
JPS5627594A (en) * 1979-08-10 1981-03-17 Matsushita Electric Ind Co Ltd Remote controller
JPS6016517B2 (en) * 1979-12-29 1985-04-25 Uemura Kogyo Kk
JPS5927379A (en) * 1982-08-09 1984-02-13 Hitachi Ltd Pattern video signal processing system
JPH0247550B2 (en) * 1982-08-23 1990-10-22 Chusho Kigyo Jigyodan Mudenkaidometsukiekinokanrihoho
JPH0239596B2 (en) * 1983-03-25 1990-09-06 Uemura Kogyo Kk Kagakudometsukinokontorooruhoho
KR920002710B1 (en) * 1984-06-18 1992-03-31 미다 가쓰시게 Chemical copper plating method
US4692346A (en) * 1986-04-21 1987-09-08 International Business Machines Corporation Method and apparatus for controlling the surface chemistry on objects plated in an electroless plating bath
EP0265895B1 (en) * 1986-10-31 1993-02-10 AMP-AKZO CORPORATION (a Delaware corp.) Method for electrolessly depositing high quality copper
US4814197A (en) * 1986-10-31 1989-03-21 Kollmorgen Corporation Control of electroless plating baths

Also Published As

Publication number Publication date
DE3914180A1 (en) 1989-11-09
EP0340649B1 (en) 1993-02-03
KR890016207A (en) 1989-11-28
GB8909623D0 (en) 1989-06-14
GB9220923D0 (en) 1992-11-18
JPH07107193B2 (en) 1995-11-15
BR8901962A (en) 1989-12-05
JPH0270070A (en) 1990-03-08
EP0340649A1 (en) 1989-11-08
GB2218714B (en) 1992-10-14
DE3914180C2 (en) 1991-04-18
GB2218714A (en) 1989-11-22
CA1331420C (en) 1994-08-16

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