JPS5288227A - Chemical copper plating solution - Google Patents
Chemical copper plating solutionInfo
- Publication number
- JPS5288227A JPS5288227A JP414376A JP414376A JPS5288227A JP S5288227 A JPS5288227 A JP S5288227A JP 414376 A JP414376 A JP 414376A JP 414376 A JP414376 A JP 414376A JP S5288227 A JPS5288227 A JP S5288227A
- Authority
- JP
- Japan
- Prior art keywords
- plating solution
- copper plating
- chemical copper
- chemical
- solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Chemically Coating (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP414376A JPS5288227A (en) | 1976-01-19 | 1976-01-19 | Chemical copper plating solution |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP414376A JPS5288227A (en) | 1976-01-19 | 1976-01-19 | Chemical copper plating solution |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5288227A true JPS5288227A (en) | 1977-07-23 |
Family
ID=11576544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP414376A Pending JPS5288227A (en) | 1976-01-19 | 1976-01-19 | Chemical copper plating solution |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5288227A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2937297A1 (en) * | 1978-09-13 | 1980-03-20 | Kollmorgen Tech Corp | METHOD FOR ELECTRIC METAL DEPOSITION WITH INCREASED DEPOSITION SPEED AND BATH SOLUTION FOR CARRYING OUT THE METHOD |
-
1976
- 1976-01-19 JP JP414376A patent/JPS5288227A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2937297A1 (en) * | 1978-09-13 | 1980-03-20 | Kollmorgen Tech Corp | METHOD FOR ELECTRIC METAL DEPOSITION WITH INCREASED DEPOSITION SPEED AND BATH SOLUTION FOR CARRYING OUT THE METHOD |
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