JPS5299932A - Method of dryyreplenishing chemical plating solution - Google Patents

Method of dryyreplenishing chemical plating solution

Info

Publication number
JPS5299932A
JPS5299932A JP8490976A JP8490976A JPS5299932A JP S5299932 A JPS5299932 A JP S5299932A JP 8490976 A JP8490976 A JP 8490976A JP 8490976 A JP8490976 A JP 8490976A JP S5299932 A JPS5299932 A JP S5299932A
Authority
JP
Japan
Prior art keywords
dryyreplenishing
plating solution
chemical plating
chemical
solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8490976A
Other languages
Japanese (ja)
Inventor
Bii Datsukuuitsuku Oree
Ei Hofuman Rebaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
Shipley Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co Inc filed Critical Shipley Co Inc
Publication of JPS5299932A publication Critical patent/JPS5299932A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601Process or apparatus
    • C23C18/1617Purification and regeneration of coating baths

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP8490976A 1976-02-17 1976-07-16 Method of dryyreplenishing chemical plating solution Pending JPS5299932A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65828076A 1976-02-17 1976-02-17

Publications (1)

Publication Number Publication Date
JPS5299932A true JPS5299932A (en) 1977-08-22

Family

ID=24640605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8490976A Pending JPS5299932A (en) 1976-02-17 1976-07-16 Method of dryyreplenishing chemical plating solution

Country Status (7)

Country Link
JP (1) JPS5299932A (en)
CA (1) CA1069254A (en)
DE (1) DE2631633A1 (en)
FR (1) FR2341667A1 (en)
GB (1) GB1557871A (en)
IT (1) IT1059760B (en)
SE (1) SE7608874L (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014034706A (en) * 2012-08-08 2014-02-24 Ishihara Chemical Co Ltd Paste tin supplement for electroless tin-based plating liquid, and supplementing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60248882A (en) * 1984-05-24 1985-12-09 Aisin Seiki Co Ltd Electroless plating bath for plating high-phosphorus nickel alloy

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014034706A (en) * 2012-08-08 2014-02-24 Ishihara Chemical Co Ltd Paste tin supplement for electroless tin-based plating liquid, and supplementing method

Also Published As

Publication number Publication date
CA1069254A (en) 1980-01-08
FR2341667A1 (en) 1977-09-16
SE7608874L (en) 1977-08-18
IT1059760B (en) 1982-06-21
DE2631633A1 (en) 1977-08-18
GB1557871A (en) 1979-12-12

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