JPS53142328A - Solution for nonnelectrolytic copper plating - Google Patents
Solution for nonnelectrolytic copper platingInfo
- Publication number
- JPS53142328A JPS53142328A JP5697077A JP5697077A JPS53142328A JP S53142328 A JPS53142328 A JP S53142328A JP 5697077 A JP5697077 A JP 5697077A JP 5697077 A JP5697077 A JP 5697077A JP S53142328 A JPS53142328 A JP S53142328A
- Authority
- JP
- Japan
- Prior art keywords
- nonnelectrolytic
- solution
- copper plating
- plating
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5697077A JPS53142328A (en) | 1977-05-17 | 1977-05-17 | Solution for nonnelectrolytic copper plating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5697077A JPS53142328A (en) | 1977-05-17 | 1977-05-17 | Solution for nonnelectrolytic copper plating |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53142328A true JPS53142328A (en) | 1978-12-12 |
Family
ID=13042371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5697077A Pending JPS53142328A (en) | 1977-05-17 | 1977-05-17 | Solution for nonnelectrolytic copper plating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53142328A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108193197A (en) * | 2018-03-19 | 2018-06-22 | 四川省劲腾环保建材有限公司 | The method of chemical bronze plating liquid and electroless copper |
WO2022102226A1 (en) * | 2020-11-10 | 2022-05-19 | メルテックス株式会社 | Electroless copper plating solution |
-
1977
- 1977-05-17 JP JP5697077A patent/JPS53142328A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108193197A (en) * | 2018-03-19 | 2018-06-22 | 四川省劲腾环保建材有限公司 | The method of chemical bronze plating liquid and electroless copper |
WO2022102226A1 (en) * | 2020-11-10 | 2022-05-19 | メルテックス株式会社 | Electroless copper plating solution |
JP7111410B1 (en) * | 2020-11-10 | 2022-08-02 | メルテックス株式会社 | Electroless copper plating solution |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5464025A (en) | Acidic copper plating bath | |
JPS54153737A (en) | Nonelectrolytic copper plating composition | |
DE3066952D1 (en) | Electroless copper plating solution | |
JPS54119479A (en) | Copper complex | |
JPS544831A (en) | Alloy plating | |
IL51772A0 (en) | Electroless copper plating | |
ZA783060B (en) | Improved electroplating process | |
JPS5475431A (en) | Automatic plating apparatus | |
JPS5370931A (en) | Nonnelectrolytic copper plating method | |
JPS5448646A (en) | Copper electroplating | |
GB1547743A (en) | Aluminium electroplating solution | |
JPS5426247A (en) | Golddpalladium alloy plating solution | |
JPS53142328A (en) | Solution for nonnelectrolytic copper plating | |
JPS53142329A (en) | Plating method | |
JPS53119225A (en) | Plating method | |
JPS53119227A (en) | Plating method | |
JPS5217334A (en) | Electroless copper plating solution | |
JPS5433834A (en) | Golddcopper alloy plating solution | |
JPS5389834A (en) | Melting plating method | |
JPS5411837A (en) | Barrelltype plating equipment | |
JPS5285935A (en) | Peeling solution for copper plating | |
JPS51135836A (en) | Electroless copper plating solusion | |
JPS5277833A (en) | Nonnelectrolytic copper plating solution | |
JPS5221226A (en) | Nonnelectric copper plating solution | |
JPS52152831A (en) | Substitution copper plating solution |