AU544591B2 - Electroless copper plating - Google Patents

Electroless copper plating

Info

Publication number
AU544591B2
AU544591B2 AU89152/82A AU8915282A AU544591B2 AU 544591 B2 AU544591 B2 AU 544591B2 AU 89152/82 A AU89152/82 A AU 89152/82A AU 8915282 A AU8915282 A AU 8915282A AU 544591 B2 AU544591 B2 AU 544591B2
Authority
AU
Australia
Prior art keywords
copper plating
electroless copper
electroless
plating
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU89152/82A
Other versions
AU8915282A (en
Inventor
Donald Alan Arcilesi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Original Assignee
Occidental Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chemical Corp filed Critical Occidental Chemical Corp
Publication of AU8915282A publication Critical patent/AU8915282A/en
Application granted granted Critical
Publication of AU544591B2 publication Critical patent/AU544591B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents
AU89152/82A 1981-10-23 1982-10-06 Electroless copper plating Ceased AU544591B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31428081A 1981-10-23 1981-10-23
US314280 1981-10-23

Publications (2)

Publication Number Publication Date
AU8915282A AU8915282A (en) 1983-04-28
AU544591B2 true AU544591B2 (en) 1985-06-06

Family

ID=23219330

Family Applications (1)

Application Number Title Priority Date Filing Date
AU89152/82A Ceased AU544591B2 (en) 1981-10-23 1982-10-06 Electroless copper plating

Country Status (7)

Country Link
AU (1) AU544591B2 (en)
BE (1) BE894789A (en)
CA (1) CA1184359A (en)
DE (1) DE3238921C2 (en)
GB (1) GB2109013A (en)
IT (1) IT1197434B (en)
SE (1) SE8205982L (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3404270A1 (en) * 1984-02-04 1985-08-08 Schering AG, 1000 Berlin und 4709 Bergkamen AQUEOUS ALKALINE BATH FOR CHEMICAL DEPOSITION OF COPPER, NICKEL, COBALT AND THEIR ALLOYS
DE3504150A1 (en) * 1984-02-17 1985-10-17 Omi International Corp. (eine Gesellschaft n.d.Ges.d. Staates Delaware), Warren, Mich. AQUEOUS ALKALINE BATH FOR ELECTRICAL COUPLING AND A METHOD FOR ELECTRIC COPPERING USING THIS BATH
DE3806306A1 (en) * 1988-02-27 1989-09-07 Basf Ag USE OF POLYACETALES AS A COMPLEX DEVICE FOR THE CHEMICAL DEPOSITION OF COPPER AND METHOD FOR THE CHEMICAL DEPOSITION OF COPPER
EP0913502B1 (en) * 1997-04-07 2006-05-31 Okuno Chemical Industries Co., Ltd. Method of electroplating nonconductive plastic molded product
WO2014098064A1 (en) 2012-12-21 2014-06-26 奥野製薬工業株式会社 Conductive coating film forming bath
JP6024044B2 (en) 2014-01-27 2016-11-09 奥野製薬工業株式会社 Conductive film forming bath
CN105132973A (en) * 2015-09-22 2015-12-09 太原工业学院 Environment-friendly type non-cyanide electroplating copper-zinc alloy solution and electroplating copper-zinc alloy process thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3383224A (en) * 1965-11-09 1968-05-14 Shipley Co Electroless copper deposition
US3329512A (en) * 1966-04-04 1967-07-04 Shipley Co Chemical deposition of copper and solutions therefor
BE757573A (en) * 1969-10-16 1971-04-15 Philips Nv FLEXIBLE COPPER CURRENT FREE DEPOSIT
US3650777A (en) * 1971-02-11 1972-03-21 Kollmorgen Corp Electroless copper plating

Also Published As

Publication number Publication date
CA1184359A (en) 1985-03-26
SE8205982D0 (en) 1982-10-21
SE8205982L (en) 1983-04-24
GB2109013A (en) 1983-05-25
BE894789A (en) 1983-04-22
DE3238921A1 (en) 1983-05-05
IT8249324A0 (en) 1982-10-21
IT1197434B (en) 1988-11-30
AU8915282A (en) 1983-04-28
DE3238921C2 (en) 1985-06-13

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