AU5227779A - Electroless copper deposition - Google Patents

Electroless copper deposition

Info

Publication number
AU5227779A
AU5227779A AU52277/79A AU5227779A AU5227779A AU 5227779 A AU5227779 A AU 5227779A AU 52277/79 A AU52277/79 A AU 52277/79A AU 5227779 A AU5227779 A AU 5227779A AU 5227779 A AU5227779 A AU 5227779A
Authority
AU
Australia
Prior art keywords
electroless copper
copper deposition
deposition
electroless
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU52277/79A
Other versions
AU535517B2 (en
Inventor
Rachel Basker
John J. Grunwald
Peter E. Kukanskis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25508161&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU5227779(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of AU5227779A publication Critical patent/AU5227779A/en
Application granted granted Critical
Publication of AU535517B2 publication Critical patent/AU535517B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU52277/79A 1978-11-27 1979-10-29 Electroless copper deposition Ceased AU535517B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US964128 1978-11-27
US05/964,128 US4265943A (en) 1978-11-27 1978-11-27 Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions

Publications (2)

Publication Number Publication Date
AU5227779A true AU5227779A (en) 1980-05-29
AU535517B2 AU535517B2 (en) 1984-03-29

Family

ID=25508161

Family Applications (1)

Application Number Title Priority Date Filing Date
AU52277/79A Ceased AU535517B2 (en) 1978-11-27 1979-10-29 Electroless copper deposition

Country Status (10)

Country Link
US (1) US4265943A (en)
JP (1) JPS5576054A (en)
AU (1) AU535517B2 (en)
CA (1) CA1117704A (en)
CH (1) CH649580A5 (en)
DE (1) DE2947306A1 (en)
FR (1) FR2442278B2 (en)
GB (1) GB2037327B (en)
NL (1) NL188173C (en)
SE (1) SE463820B (en)

Families Citing this family (225)

* Cited by examiner, † Cited by third party
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GB2037327B (en) 1983-11-09
NL7907555A (en) 1980-05-29
JPS6344822B2 (en) 1988-09-07
CA1117704A (en) 1982-02-09
JPS5576054A (en) 1980-06-07
NL188173C (en) 1992-04-16
GB2037327A (en) 1980-07-09
US4265943A (en) 1981-05-05
SE7907373L (en) 1980-05-28
DE2947306C2 (en) 1988-01-21
FR2442278A2 (en) 1980-06-20
CH649580A5 (en) 1985-05-31
DE2947306A1 (en) 1980-06-04
FR2442278B2 (en) 1985-09-20
SE463820B (en) 1991-01-28
AU535517B2 (en) 1984-03-29
NL188173B (en) 1991-11-18

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