CN101078111B - Chemical copper plating solution and technique thereof - Google Patents
Chemical copper plating solution and technique thereof Download PDFInfo
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- CN101078111B CN101078111B CN2006100356524A CN200610035652A CN101078111B CN 101078111 B CN101078111 B CN 101078111B CN 2006100356524 A CN2006100356524 A CN 2006100356524A CN 200610035652 A CN200610035652 A CN 200610035652A CN 101078111 B CN101078111 B CN 101078111B
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Abstract
The present invention provides a kind of chemical solution used to copperize, compriseing the major components, by weight, blue vitriod 0.8-3, Fe vitriol 0-0.5, complex agent 3-6, sodium hypophosphorous acid 4-6, ammonia sulfate 0.5-1, sulfourea 0-0.01. The following is the procedure of the copper coating method with the above copper coating solution: to widen and activate the plastic board->to clean->to make it electric->to clean->to coat nickel-copper-phosphorus alloy on it by chemical method. The following are the content of the chemical method: the plastic pretreated according the above description will be immersed in the above chemical solution used to copperize, the pH of which has been adjusted to 10-13 by vitriol and stranger ammonia water, the working temperature of it is 20-70 DEG C, the time to copperize is 5-20 minutes. The chemical solution used to copperize in this patent does not contain formaldehyde, it improve the working circumstance, and is easy to control, the cost of it is lower, and it own high economical benefit and society benefit.
Description
Technical field
The present invention relates to a kind of process of surface treatment, particularly a kind of new chemical copper plating solution and chemical plating method.
Traditional chemical-copper-plating process is a reductive agent with formaldehyde, and EDTA and Seignette salt are separately or the mixed twine mixture, wherein, the formaldehyde that is adopted, environmental pollution is serious, and its smell is awful, have teratogenecity, mutagenicity, carinogenicity.Therefore, to this problem, developed some formaldehydeless chemical copper plating solutions, still, the formaldehydeless chemical copper plating solution of most conventional is because their hyperergy has relatively poor stability, and decomposes very soon when using.Therefore need exploitation to have the formaldehydeless chemical plating fluid of high stability, and use it can accomplish the electroless copper process rapidly.
The object of the invention is to provide a kind of chemical copper plating solution, does not contain formaldehyde in its composition, has improved Working environment, and has possessed advantages of higher stability, is convenient to management and control.
Chemical copper plating solution of the present invention mainly comprises following component:
Wherein, said complexing agent is a Seignette salt.
Another object of the present invention is to provide a kind of chemical plating method, improves Working environment and reduces the pollution to environment with great.
And the chemical plating method that adopts above-mentioned copper plating solution to carry out, its flow process is: plastic plate alligatoring activation → cleaning → electroless copper → cleaning → conductionization processing → cleaning → chemical nickel plating copper-phosphorus alloy.Wherein, said electroless copper step is specially: the plastic plate that will pass through above-mentioned pre-treatment soaks to place with sulfuric acid and strong aqua the pH value is modulated to the above-mentioned chemical copper plating solution of 10-13, and its working temperature is 20-70 ℃, and the copper facing time is 5-20 minute.
Wherein, described cleaning way can carry out through ultrasonic cleaning or water-washing method.
And said conduction treatment step is the copper-plated plastic plate of process is soaked in the acidic solution, with
Show conductive layer.
The alloy rete that said chemical nickel plating copper-phosphorus alloy step is generated also can make the resistance on this plastic plate top layer and sticking power can reach industrial standards in the etch-proof while.
Thus,, avoided adopting the environmental pollution that formaldehyde brought because of environmental-protecting chemical copper plating solution of the present invention adopts sodium hypophosphite as reductive agent, and adopt Seignette salt be complexing agent to reduce cost, this formulation stability is higher in addition, is easy to management and control; And at aspect of performance, the salt mist experiment that the rete of this method gained can be through 8 hours, and its resistance and sticking power can both reach industrial standards.
Embodiment
Embodiment 1
Make chemical copper plating solution by following prescription:
Salzburg vitriol 2g/L
Seven ferric sulfate hydrate 0.3g/L
Seignette salt 4g/L
Sodium hypophosphite 5g/L
Ammonium sulfate 0.8g/L
Thiocarbamide 0.01g/L
Adopt sulfuric acid and strong aqua that above-mentioned pH value of solution value is modulated to 12; Get a plastic plate sample then and, under room temperature, place above-mentioned chemical copper plating solution to soak the complete after washing of copper facing 10 minutes it again after the washing its alligatoring activation; Impregnated in the acidic solution conduction processing again 3 minutes; Then carry out the chemical nickel plating copper-phosphorus alloy after the washing once more, the salt mist experiment that last resulting superficial film can be through 8 hours, and its resistance and sticking power all can reach industrial standards.
Embodiment 2
Make chemical copper plating solution by following prescription:
Salzburg vitriol 3g/L
Seven ferric sulfate hydrate 0.2g/L
Seignette salt 3g/L
Sodium hypophosphite 4g/L
Ammonium sulfate 1g/L
Thiocarbamide 0.01g/L
Adopt sulfuric acid and strong aqua that above-mentioned pH value of solution value is modulated to 11; Get a plastic plate sample then and, under room temperature, place above-mentioned chemical copper plating solution to soak the complete after washing of copper facing 10 minutes it again after the washing its alligatoring activation; Impregnated in the acidic solution conduction processing again 3 minutes; Then carry out the chemical nickel plating copper-phosphorus alloy after the washing once more, the salt mist experiment that last resulting superficial film can be through 8 hours, and its resistance and sticking power all can reach industrial standards.
Embodiment 3
Make chemical copper plating solution by following prescription:
Salzburg vitriol 2g/L
Seven ferric sulfate hydrate 0.5g/L
Seignette salt 5g/L
Sodium hypophosphite 6g/L
Ammonium sulfate 1g/L
Thiocarbamide 0.01g/L
Adopt sulfuric acid and strong aqua that above-mentioned pH value of solution value is modulated to 13; Get a plastic plate sample then and, under room temperature, place above-mentioned chemical copper plating solution to soak the complete after washing of copper facing 10 minutes it again after the washing its alligatoring activation; Impregnated in the acidic solution conduction processing again 3 minutes; Then carry out the chemical nickel plating copper-phosphorus alloy after the washing once more, the salt mist experiment that last resulting superficial film can be through 8 hours, and its resistance and sticking power all can reach industrial standards.
The above; Only be the preferable feasible embodiment of the present invention; Can not therefore promptly limit to interest field of the present invention; Concerning being familiar with those of ordinary skill in the art, use technical scheme of the present invention and technical conceive to make other various corresponding changes and distortion such as, and all these changes and distortion all should belong within the protection domain of claim of the present invention.
Claims (8)
1. a chemical copper plating solution is characterized in that, the prescription of this chemical copper plating solution is:
Salzburg vitriol 2-3g/L;
Seven ferric sulfate hydrate 0.2-0.5g/L;
Seignette salt 3-5g/L;
Sodium hypophosphite 4-6g/L;
Ammonium sulfate 0.8-1g/L;
Thiocarbamide 0.01g/L.
2. chemical plating method, its flow process is: plastic plate alligatoring activation → cleaning → electroless copper → cleaning → conductionization processing → cleaning → chemical nickel plating copper-phosphorus alloy.It is characterized in that said electroless copper step is specially: the plastic plate that will pass through above-mentioned pre-treatment soaks and places the above-mentioned chemical copper plating solution that with sulfuric acid and strong aqua the pH value is modulated to 10-13.
3. chemical plating method according to claim 2 is characterized in that, said its working temperature of electroless copper step is 20-70 ℃.
4. chemical plating method according to claim 2 is characterized in that, its copper facing time of said electroless copper step is 5-20 minute.
5. chemical plating method according to claim 2 is characterized in that, said cleaning is a ultrasonic cleaning.
6. chemical plating method according to claim 2 is characterized in that, said cleaning is washing.
7. chemical plating method according to claim 2 is characterized in that, said conduction treatment step is the copper-plated plastic plate of process is soaked in the acidic solution, to show conductive layer.
8. chemical plating method according to claim 2 is characterized in that, the alloy rete that said chemical nickel plating copper-phosphorus alloy step is generated also can make the resistance on this plastic plate top layer and sticking power can reach industrial standards in the etch-proof while.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100356524A CN101078111B (en) | 2006-05-26 | 2006-05-26 | Chemical copper plating solution and technique thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100356524A CN101078111B (en) | 2006-05-26 | 2006-05-26 | Chemical copper plating solution and technique thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101078111A CN101078111A (en) | 2007-11-28 |
| CN101078111B true CN101078111B (en) | 2012-01-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100356524A Expired - Fee Related CN101078111B (en) | 2006-05-26 | 2006-05-26 | Chemical copper plating solution and technique thereof |
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| CN (1) | CN101078111B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101654797B (en) * | 2008-08-19 | 2011-04-20 | 陈允盈 | Chemical-copper plating liquid and copper plating production process |
| CN101684554B (en) * | 2008-09-23 | 2012-03-07 | 比亚迪股份有限公司 | Chemical copper plating solution for polyimide film and surface chemical copper plating method thereof |
| CN102766859B (en) * | 2011-05-06 | 2014-01-22 | 中国人民解放军海军工程大学 | Modification method of spongy iron deoxygenation filter material |
| CN102260864B (en) * | 2011-07-20 | 2014-03-12 | 淮阴工学院 | Preparation method of attapulgite/copper-core shell structure one-dimensional rod-like superfine copper powder |
| CN102337527A (en) * | 2011-09-14 | 2012-02-01 | 哈尔滨工业大学 | High-speed environment-friendly chemical copper plating solution |
| CN103276378B (en) * | 2013-06-06 | 2015-04-08 | 西安石油大学 | SeO2-containing copper-based chemical plating solution and its preparation method and application |
| CN103484846B (en) * | 2013-09-27 | 2015-07-22 | 西安石油大学 | Copper substrate electroless plating solution containing Bi2O3 and preparation method and application of copper substrate electroless plating solution |
| CN107385422A (en) * | 2017-09-22 | 2017-11-24 | 河南省中原华工激光工程有限公司 | A kind of environment-friendly type cylinder jacket copper plating bath and cylinder-barrel surface processing method |
| CN110684969A (en) * | 2019-10-18 | 2020-01-14 | 北京曙光航空电气有限责任公司 | Copper plating method for metal surface |
| CN110899692B (en) * | 2019-11-29 | 2022-02-08 | 安徽工业大学 | Preparation method of iron-based alloy powder |
| CN110846646B (en) * | 2019-12-10 | 2022-02-15 | 深圳中塑化工高性能材料有限公司 | ABS plastic chemical copper plating solution and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
-
2006
- 2006-05-26 CN CN2006100356524A patent/CN101078111B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4265943A (en) * | 1978-11-27 | 1981-05-05 | Macdermid Incorporated | Method and composition for continuous electroless copper deposition using a hypophosphite reducing agent in the presence of cobalt or nickel ions |
Non-Patent Citations (1)
| Title |
|---|
| 曹达华等.工程塑料上化学镀Ni-Cu-P 镀层的工艺研究.《机械工程材料》.2004,第28卷(第4期),第19-21页. * |
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| CN101078111A (en) | 2007-11-28 |
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