CN110684969A - Copper plating method for metal surface - Google Patents
Copper plating method for metal surface Download PDFInfo
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- CN110684969A CN110684969A CN201910994464.1A CN201910994464A CN110684969A CN 110684969 A CN110684969 A CN 110684969A CN 201910994464 A CN201910994464 A CN 201910994464A CN 110684969 A CN110684969 A CN 110684969A
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- copper
- copper plating
- repair liquid
- water
- metal surface
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
The invention relates to a copper plating method for a metal surface, wherein a part without copper plating is contacted with a repair solution for chemical reaction, and the heating temperature during the chemical reaction is 30-40 ℃; after the part without copper plating reacts with the repair liquid, washing and drying are carried out; wherein, the solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the invention realizes a new method for rapidly plating copper, and the copper plating film has the advantages of uniform film, smooth light quantity and good conductivity.
Description
Technical Field
The invention relates to the technical field of metal surface treatment, in particular to a copper plating method for a metal surface, and more particularly relates to a repair method for a copper plating surface.
Background
At present, the phenomenon of scratching and damage of the plating layer on the outer surface is found in the installation process of some copper-plated parts, and local repair is needed, but the formula of the repair liquid for local damage of the copper-plated film is complex and is inconvenient to prepare, and the repair method has high cost and low efficiency.
Disclosure of Invention
The purpose of the invention is: provides a copper plating repair solution and simplifies the copper plating repair process.
The technical scheme of the invention is as follows:
the technical scheme is as follows: providing a copper plating method for a metal surface, wherein the copper plating method comprises a first copper plating process and a second copper plating process, and the first copper plating process and the second copper plating process are different; copper is plated on part of the metal surface by the first copper plating process, and copper is plated on the metal surface without copper plating by the second copper plating process;
in the second copper plating process, the part without copper plating is contacted with a repair solution for chemical reaction, and the heating temperature during the chemical reaction is 30-40 ℃; after the part without copper plating reacts with the repair liquid, washing and drying are carried out;
wherein, the solutes of the repair liquid are copper sulfate, thiourea and sodium chloride, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 35-40: 1, unit is gram/liter; the volume ratio of the mass of the thiourea to the water is 40-50: 1, unit is gram/liter; the volume ratio of the mass of the sodium chloride to the volume of the water is 2-6: 1 in grams/liter.
Furthermore, the time for the copper-free part to react with the repair liquid is 25-40 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by spraying, coating, and dipping.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 35 ℃, and the reaction time is 30 seconds.
Providing a copper plating method for a metal surface, wherein the copper plating method comprises a first copper plating process and a second copper plating process, and the first copper plating process and the second copper plating process are different; the first copper plating process is used for plating copper on the metal surface, then the copper plating on part of the metal surface is removed, so that part of the metal surface without copper plating is formed, and the second copper plating process is used for plating copper on the metal surface without copper plating;
in the second copper plating process, the part without copper plating is contacted with a repair solution for chemical reaction, and the heating temperature during the chemical reaction is 30-40 ℃; and after the part without copper plating reacts with the repair liquid, washing and drying are carried out.
Wherein, the solutes of the repair liquid are copper sulfate, thiourea and sodium chloride, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 35-40: 1, unit is gram/liter; the volume ratio of the mass of the thiourea to the water is 40-50: 1, unit is gram/liter; the volume ratio of the mass of the sodium chloride to the volume of the water is 2-6: 1 in grams/liter.
Furthermore, the time for the copper-free part to react with the repair liquid is 25-40 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by spraying, coating, and dipping.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 35 ℃, and the reaction time is 30 seconds.
Providing a method for repairing the surface of copper-plated metal, wherein a copper-plated removal part exists on the surface of the copper-plated metal, the surface of the metal without the copper plating is contacted with a repair solution for chemical reaction, and the heating temperature during the chemical reaction is 30-40 ℃; after the part without copper plating reacts with the repair liquid, washing and drying are carried out;
wherein, the solutes of the repair liquid are copper sulfate, thiourea and sodium chloride, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 35-40: 1, unit is gram/liter; the volume ratio of the mass of the thiourea to the water is 40-50: 1, unit is gram/liter; the volume ratio of the mass of the sodium chloride to the volume of the water is 2-6: 1 in grams/liter.
Furthermore, the time for the copper-free part to react with the repair liquid is 25-40 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by spraying, coating, and dipping.
Further, the removal of the copper plating on the metal surface is achieved by machining, damage or abrasion.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 35 ℃, and the reaction time is 30 seconds.
Compared with the technical schemes, in the preparation of the repair liquid, copper sulfate, thiourea and sodium chloride are sequentially added into water to form a solution, so that the repair effect of the repair liquid is optimal.
The above is most suitable for copper or copper alloy surface plating.
The invention has the advantages that: the invention realizes a new method for rapidly plating copper, and the copper plating film has the advantages of uniform film, smooth light quantity and good conductivity.
Detailed Description
The present invention is described in further detail below.
Example 1
And (3) contacting the end plate material 10 steel, removing the copper plating film on the surface of the contact by a mechanical method after the integral copper plating, and plating copper on the film-free position by a chemical method.
The solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 20: 1, unit is gram/liter; the volume ratio of thiourea to water was 0.2: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 3: 1 in grams/liter.
Further, the time for the copper-free portion to react with the repair liquid is 40 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by coating.
Further, the removal of the copper plated on the metal surface is realized through machining.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 40 ℃, and the reaction time is 40 seconds.
Example 2
The contact piece material 45 steel is integrally plated with copper, and then the copper plating film on the contact surface is removed by mechanical addition, and the film-free position is plated with copper by a chemical method.
The solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 25: 1, unit is gram/liter; the volume ratio of thiourea to water was 0.3: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 4: 1 in grams/liter.
Further, the time for the copper-free portion to react with the repair liquid was 35 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by coating.
Further, the removal of the copper plated on the metal surface is realized through machining.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 35 ℃, and the reaction time is 35 seconds.
Example 3
After the whole copper plating, the copper plating film on the contact surface is removed by a mechanical method, and the copper plating is carried out on the non-film position by a chemical method.
The solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 30: 1, unit is gram/liter; the volume ratio of thiourea to water was 0.4: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 5: 1 in grams/liter.
Further, the time for the copper-free portion to react with the repair liquid is 30 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by coating.
Further, the removal of the copper plated on the metal surface is realized through machining.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 30 ℃, and the reaction time is 25 seconds.
Example 4
The contact end plate material is 10 steel, after the integral copper plating, the contact surface has no copper plating film, and the film-free position has copper plating by a chemical method.
The solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 20: 1, unit is gram/liter; the volume ratio of thiourea to water was 0.2: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 3: 1 in grams/liter.
Further, the time for the copper-free portion to react with the repair liquid is 40 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by coating.
Further, the removal of the copper plated on the metal surface is realized through machining.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 40 ℃, and the reaction time is 40 seconds.
Example 5
The contact piece material 45 steel is plated with copper integrally, the contact surface is not plated with a copper film, and the film-free position is plated with copper by a chemical method.
The solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 25: 1, unit is gram/liter; the volume ratio of thiourea to water was 0.3: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 4: 1 in grams/liter.
Further, the time for the copper-free portion to react with the repair liquid was 35 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by coating.
Further, the removal of the copper plated on the metal surface is realized through machining.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 35 ℃, and the reaction time is 35 seconds.
Example 6
After the material 20 steel is plated with copper integrally, the contact surface is free of copper plating films, and the copper is plated at the film-free position by a chemical method.
The solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 30: 1, unit is gram/liter; the volume ratio of thiourea to water was 0.4: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 5: 1 in grams/liter.
Further, the time for the copper-free portion to react with the repair liquid is 30 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by coating.
Further, the removal of the copper plated on the metal surface is realized through machining.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 30 ℃, and the reaction time is 25 seconds.
Example 7
And (3) contacting a contact end plate material 10 steel, and after the integral copper plating, damaging a copper plating film on the surface of the contact, and plating copper on the damaged film by a chemical method.
The solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 20: 1, unit is gram/liter; the volume ratio of thiourea to water was 0.2: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 3: 1 in grams/liter.
Further, the time for the copper-free portion to react with the repair liquid is 40 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by coating.
Further, the removal of the copper plated on the metal surface is realized through machining.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 40 ℃, and the reaction time is 40 seconds.
Example 8
The contact piece material 45 steel is damaged by a copper plating film on the contact surface after the copper is plated on the whole body, and the damaged film is plated with copper by a chemical method.
The solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 25: 1, unit is gram/liter; the volume ratio of thiourea to water was 0.3: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 4: 1 in grams/liter.
Further, the time for the copper-free portion to react with the repair liquid was 35 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by coating.
Further, the removal of the copper plated on the metal surface is realized through machining.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 35 ℃, and the reaction time is 35 seconds.
Example 9
The material 20 steel is damaged by a copper plating film on the contact surface after the whole copper plating, and copper is plated at the damaged film by a chemical method.
The solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 30: 1, unit is gram/liter; the volume ratio of thiourea to water was 0.4: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 5: 1 in grams/liter.
Further, the time for the copper-free portion to react with the repair liquid is 30 seconds.
Further, the contact of the copper-free portion with the repair liquid is performed by coating.
Further, the removal of the copper plated on the metal surface is realized through machining.
Further, the heating temperature of the reaction of the copper-free part and the repair liquid is 30 ℃, and the reaction time is 25 seconds.
Claims (10)
1. A copper plating method for a metal surface comprises a first copper plating process and a second copper plating process, wherein the first copper plating process and the second copper plating process are different; copper is plated on part of the metal surface by the first copper plating process, and copper is plated on the metal surface without copper plating by the second copper plating process;
in the second copper plating process, the part without copper plating is contacted with a repair solution for chemical reaction, and the heating temperature during the chemical reaction is 30-40 ℃; after the part without copper plating reacts with the repair liquid, washing and drying are carried out;
wherein, the solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 20-30: 1, unit is gram/liter; the volume ratio of the mass of the thiourea to the water is 0.2-0.4: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 3-5: 1 in grams/liter.
2. A method of copper plating a metal surface according to claim 1, wherein: the time for the copper-free part to react with the repair liquid is 25-40 seconds.
3. A method of copper plating a metal surface according to claim 1, wherein: the contact of the copper-free portion with the repair liquid is performed by spraying, coating, and dipping.
4. A method of copper plating a metal surface according to claim 1, wherein: the heating temperature of the copper-free part and the repair liquid is 35 ℃, and the reaction time is 30 seconds.
5. A copper plating method for a metal surface comprises a first copper plating process and a second copper plating process, wherein the first copper plating process and the second copper plating process are different; the first copper plating process is used for plating copper on the metal surface, then the copper plating on part of the metal surface is removed, so that part of the metal surface without copper plating is formed, and the second copper plating process is used for plating copper on the metal surface without copper plating;
in the second copper plating process, the part without copper plating is contacted with a repair solution for chemical reaction, and the heating temperature during the chemical reaction is 30-40 ℃; and after the part without copper plating reacts with the repair liquid, washing and drying are carried out.
Wherein, the solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 20-30: 1, unit is gram/liter; the volume ratio of the mass of the thiourea to the water is 0.2-0.4: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 3-5: 1 in grams/liter.
6. A method of copper plating of a metal surface according to claim 5, wherein: the time for the copper-free part to react with the repair liquid is 25-40 seconds.
7. A method of copper plating of a metal surface according to claim 5, wherein: the contact of the copper-free portion with the repair liquid is performed by spraying, coating, and dipping.
8. A method of copper plating of a metal surface according to claim 5, wherein: the heating temperature of the copper-free part and the repair liquid is 35 ℃, and the reaction time is 30 seconds.
9. The method for repairing the surface of the copper-plated metal comprises the steps that a copper-plated removal part exists on the surface of the copper-plated metal, the surface of the metal with the copper-plated removal part is in contact with a repair solution to carry out chemical reaction, and the heating temperature during the chemical reaction is 30-40 ℃; after the part without copper plating reacts with the repair liquid, washing and drying are carried out;
wherein, the solutes of the repair liquid are copper sulfate, thiourea and sodium hypophosphite, and the solvent of the repair liquid is water; the volume ratio of the mass of the copper sulfate to the volume of the water is 20-30: 1, unit is gram/liter; the volume ratio of the mass of the thiourea to the water is 0.2-0.4: 1, unit is gram/liter; the volume ratio of the mass of the sodium hypophosphite to the volume of the water is 3-5: 1 in grams/liter.
10. A method of copper plating of a metal surface according to claim 5, wherein: the time for the copper-free part to react with the repair liquid is 30-40 seconds.
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| CN201910994464.1A CN110684969A (en) | 2019-10-18 | 2019-10-18 | Copper plating method for metal surface |
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| CN201910994464.1A CN110684969A (en) | 2019-10-18 | 2019-10-18 | Copper plating method for metal surface |
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Application publication date: 20200114 |