GB2034756B - Electroless deposition of transition metals - Google Patents

Electroless deposition of transition metals

Info

Publication number
GB2034756B
GB2034756B GB7936316A GB7936316A GB2034756B GB 2034756 B GB2034756 B GB 2034756B GB 7936316 A GB7936316 A GB 7936316A GB 7936316 A GB7936316 A GB 7936316A GB 2034756 B GB2034756 B GB 2034756B
Authority
GB
United Kingdom
Prior art keywords
transition metals
electroless deposition
electroless
deposition
metals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB7936316A
Other versions
GB2034756A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Richardson Chemical Co
Original Assignee
Richardson Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Richardson Chemical Co filed Critical Richardson Chemical Co
Publication of GB2034756A publication Critical patent/GB2034756A/en
Application granted granted Critical
Publication of GB2034756B publication Critical patent/GB2034756B/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
GB7936316A 1978-10-23 1979-10-19 Electroless deposition of transition metals Expired GB2034756B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US95375078A 1978-10-23 1978-10-23

Publications (2)

Publication Number Publication Date
GB2034756A GB2034756A (en) 1980-06-11
GB2034756B true GB2034756B (en) 1982-12-15

Family

ID=25494486

Family Applications (1)

Application Number Title Priority Date Filing Date
GB7936316A Expired GB2034756B (en) 1978-10-23 1979-10-19 Electroless deposition of transition metals

Country Status (6)

Country Link
JP (1) JPS5569249A (en)
KR (1) KR850001554B1 (en)
CA (1) CA1144304A (en)
DE (1) DE2942792A1 (en)
FR (1) FR2439822A1 (en)
GB (1) GB2034756B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3640028C1 (en) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Acid bath for the electroless deposition of gold layers
DE69406701T2 (en) * 1993-03-26 1998-04-02 Uyemura & Co C Chemical gilding bath
JP4116718B2 (en) * 1998-11-05 2008-07-09 日本リーロナール有限会社 Electroless gold plating method and electroless gold plating solution used therefor
KR100454634B1 (en) * 2001-11-06 2004-11-05 재단법인서울대학교산학협력재단 Fabricating method of Copper film
US7431817B2 (en) 2004-05-11 2008-10-07 Technic, Inc. Electroplating solution for gold-tin eutectic alloy
EP2581470B1 (en) 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Electroless palladium plating bath composition
JP6030848B2 (en) * 2012-05-07 2016-11-24 上村工業株式会社 Electroless copper plating bath and electroless copper plating method
DE102013021502A1 (en) * 2013-12-19 2015-06-25 Schlenk Metallfolien Gmbh & Co. Kg Electrically conductive fluids based on metal diphosphonate complexes
WO2020115279A1 (en) * 2018-12-07 2020-06-11 Atotech Deutschland Gmbh Electroless nickel or cobalt plating solution
EP3922753A1 (en) * 2020-06-10 2021-12-15 ATOTECH Deutschland GmbH Electroless nickel or cobalt plating solution

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH530474A (en) * 1968-12-24 1972-11-15 Knapsack Ag Process for chemical thin-film nickel plating of objects made of iron or steel
NL7304650A (en) * 1973-04-04 1974-10-08

Also Published As

Publication number Publication date
GB2034756A (en) 1980-06-11
FR2439822A1 (en) 1980-05-23
FR2439822B1 (en) 1984-01-27
KR830001403A (en) 1983-04-30
DE2942792A1 (en) 1980-04-30
CA1144304A (en) 1983-04-12
JPS5569249A (en) 1980-05-24
KR850001554B1 (en) 1985-10-17

Similar Documents

Publication Publication Date Title
GB2021648B (en) Electroless deposition of copper
GB2037327B (en) Electroless copper deposition
AU537003B2 (en) Autocatalytic reduction deposition of gold
AU532144B2 (en) Electroless copper deposition
GB2025782B (en) Catalytic solution for the electroless deposition of metals
DE2967272D1 (en) Method of improving the adhesion of electroless metal deposits
GB2034756B (en) Electroless deposition of transition metals
GB2081309B (en) Electroless deposition of gold
DE2966835D1 (en) Deposition process
JPS5534699A (en) Silver plating
DE3164947D1 (en) Process for the electroless deposition of metals
DE2964228D1 (en) Method of plating aluminium
JPS54145305A (en) Cementation of metal
JPS5582793A (en) Nickelliron plating method
JPS54117329A (en) Electroless plating method
JPS54110917A (en) Improvement of feeniicr alloy
JPS54160525A (en) Lead alloy for molten plating
JPS54124834A (en) Partly electroless plating method
CH613475A5 (en) Appliance for the electroless metal coating of objects
JPS5481130A (en) Pretreatment of substrate made of cupperrzinc alloy
JPS54119344A (en) Forming of hard copper plating layer
JPS5574198A (en) Throughhhole plating process
JPS54127844A (en) Electrodeposition of zincccopper alloy
JPS54123533A (en) Antiirust structure of metal
JPS54159339A (en) Molten zinc plating

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee