AU541923B2 - Electroless gold plating - Google Patents

Electroless gold plating

Info

Publication number
AU541923B2
AU541923B2 AU14860/83A AU1486083A AU541923B2 AU 541923 B2 AU541923 B2 AU 541923B2 AU 14860/83 A AU14860/83 A AU 14860/83A AU 1486083 A AU1486083 A AU 1486083A AU 541923 B2 AU541923 B2 AU 541923B2
Authority
AU
Australia
Prior art keywords
gold plating
electroless gold
electroless
plating
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU14860/83A
Other versions
AU1486083A (en
Inventor
Kenneth Derek Baker
Mohamed Fathy El-Shazly
Alan Halecky
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Occidental Chemical Corp
Original Assignee
Occidental Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Occidental Chemical Corp filed Critical Occidental Chemical Corp
Publication of AU1486083A publication Critical patent/AU1486083A/en
Application granted granted Critical
Publication of AU541923B2 publication Critical patent/AU541923B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31Coating with metals
    • C23C18/42Coating with noble metals
    • C23C18/44Coating with noble metals using reducing agents
AU14860/83A 1982-06-07 1983-05-19 Electroless gold plating Ceased AU541923B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US38561782A 1982-06-07 1982-06-07
US385617 1982-06-07

Publications (2)

Publication Number Publication Date
AU1486083A AU1486083A (en) 1983-12-15
AU541923B2 true AU541923B2 (en) 1985-01-31

Family

ID=23522165

Family Applications (1)

Application Number Title Priority Date Filing Date
AU14860/83A Ceased AU541923B2 (en) 1982-06-07 1983-05-19 Electroless gold plating

Country Status (14)

Country Link
JP (1) JPS591668A (en)
AT (1) AT380902B (en)
AU (1) AU541923B2 (en)
BE (1) BE896977A (en)
CA (1) CA1188458A (en)
CH (1) CH655132A5 (en)
DE (1) DE3320308C2 (en)
DK (1) DK231783A (en)
ES (1) ES8407520A1 (en)
FR (1) FR2528073B1 (en)
GB (1) GB2121444B (en)
IT (1) IT1171818B (en)
NL (1) NL8302029A (en)
SE (1) SE8302798L (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050719A (en) * 1976-08-24 1977-09-27 Cunningham Walter F Color coded indexing system
WO1986001477A1 (en) * 1984-08-27 1986-03-13 Toyota Jidosha Kabushiki Kaisha Structure for supporting a steering column tube
JPS6299477A (en) * 1985-10-25 1987-05-08 C Uyemura & Co Ltd Electroless gold plating solution
US4863766A (en) * 1986-09-02 1989-09-05 General Electric Company Electroless gold plating composition and method for plating
DE3640028C1 (en) * 1986-11-24 1987-10-01 Heraeus Gmbh W C Acid bath for the electroless deposition of gold layers
JPS6452082A (en) * 1987-06-22 1989-02-28 Gen Electric Electroless gold plating composition and method
US5130168A (en) * 1988-11-22 1992-07-14 Technic, Inc. Electroless gold plating bath and method of using same
US4979988A (en) * 1989-12-01 1990-12-25 General Electric Company Autocatalytic electroless gold plating composition
JP2538461B2 (en) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 Electroless gold plating method
DE10101375A1 (en) * 2001-01-13 2002-07-18 Forschungszentrum Juelich Gmbh Point contacts for semiconductors and their manufacture
JP5526459B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP5526458B2 (en) * 2006-12-06 2014-06-18 上村工業株式会社 Electroless gold plating bath and electroless gold plating method
JP5526440B2 (en) * 2007-01-17 2014-06-18 奥野製薬工業株式会社 Printed wiring board formed using reduced deposition type electroless gold plating solution for palladium film

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52151637A (en) * 1976-04-29 1977-12-16 Trw Inc Aqueous solution for gold plating and method of applying gold film onto nickel surface at room temperature
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating

Also Published As

Publication number Publication date
AT380902B (en) 1986-07-25
DE3320308C2 (en) 1985-05-15
IT1171818B (en) 1987-06-10
DK231783D0 (en) 1983-05-24
CH655132A5 (en) 1986-03-27
DK231783A (en) 1983-12-08
CA1188458A (en) 1985-06-11
NL8302029A (en) 1984-01-02
SE8302798D0 (en) 1983-05-18
BE896977A (en) 1983-12-06
FR2528073A1 (en) 1983-12-09
ATA193183A (en) 1985-12-15
ES523032A0 (en) 1984-09-16
IT8348420A0 (en) 1983-06-03
GB2121444B (en) 1986-03-12
AU1486083A (en) 1983-12-15
FR2528073B1 (en) 1986-02-14
ES8407520A1 (en) 1984-09-16
GB8315556D0 (en) 1983-07-13
JPS591668A (en) 1984-01-07
DE3320308A1 (en) 1983-12-08
GB2121444A (en) 1983-12-21
SE8302798L (en) 1983-12-08

Similar Documents

Publication Publication Date Title
GB2095292B (en) Electroless gold plating
GB2093485B (en) Electroless alloy plating
DE3663690D1 (en) Electroless gold plating solution
GB8531356D0 (en) Copper plating
EP0137981A3 (en) Through-hole plating
SG83490G (en) Improved electroless plating process
DE3473890D1 (en) Electroless copper plating solution
EP0113395A3 (en) Monitoring electroless plating
DE3367940D1 (en) Electroless copper deposition solution
AU541923B2 (en) Electroless gold plating
DE3467187D1 (en) Electroless copper plating solution
GB2160897B (en) Electroless plating solution
GB2081309B (en) Electroless deposition of gold
DE3374420D1 (en) Electroless nickel plating
SG52688G (en) Alloy metallization
GB2100291B (en) Gold plating process
GB8703664D0 (en) Electroless silver plating composition
DE3476683D1 (en) Process for electroless plating
AU4351485A (en) Selective plating apparatus
AU544591B2 (en) Electroless copper plating
GB8414871D0 (en) Gold plating baths
GB2141441B (en) High-speed silver plating
GB8332205D0 (en) Non-electrolytic copper plating
GB2129441B (en) Gold plating
GB8431280D0 (en) Gold plating